MPXC2011DT1 vs MPXC2012DT1 موازنہ
تفصیلی ساتھ ساتھ موازنہ از MPXC2011DT1 بذریعہ NXP Semiconductors اور MPXC2012DT1 بذریعہ NXP Semiconductors. اہم خصوصیات، برقی پیرامیٹرز، پیکیجنگ، لائف سائیکل اسٹیٹس، قیمتوں اور دستیابی کا موازنہ کریں تاکہ آپ کی ڈیزائن ضروریات کے لیے بہترین کمپوننٹ کا تعین ہو سکے۔
خصوصیات کا موازنہ
| پیرامیٹر | MPXC2011DT1 | MPXC2012DT1 |
|---|---|---|
| برانڈ | NXP Semiconductors | NXP Semiconductors |
| زمرہ | Pressure Sensors | Pressure Sensors |
| لائف سائیکل کی حالت | فعال | NRND |
| Pressure Type | Differential | Differential |
| Operating Pressure Range | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) | — |
| Full-Scale Output | 25 mV typical at 10 V excitation | 24 mV to 26 mV (typ. 25 mV) at 10 V excitation |
| Sensitivity | 2.5 mV/kPa typical | — |
| Excitation Voltage | 3 V DC to 10 V DC (10 V nominal) | 10 V DC typical |
| آؤٹ پٹ کی قسم | Analog Wheatstone bridge (ratiometric) | Wheatstone Bridge (analog mV) |
| پیکیج | 4-SSIP Chip Pak module, side port | — |
| Port Style | Female, 3.25 mm (0.128 in) barbed side port | Side port, single barbed inlet |
| Termination Style | Through-hole PCB, 4 leads | Through-hole PCB (vertical mount) |
| آپریٹنگ درجہ حرارت | 0 °C to +85 °C | [DATA_NEEDED: operating temperature range] |
| Compensation | On-chip temperature compensated and calibrated | — |
| Technology | Piezoresistive silicon strain gauge | — |
| Module Dimensions | 7.6 mm x 12.8 mm nominal | — |
| ماؤنٹنگ ٹائپ | Through-hole (PCB mount with side-port tubing) | Through-hole, vertical |
| RoHS اسٹیٹس | [DATA_NEEDED: RoHS status not in web data] | [DATA_NEEDED: RoHS compliance status] |
| Operating Pressure | — | 1.45 PSI (10 kPa) |
| Maximum Over Pressure | — | [DATA_NEEDED: maximum overpressure rating] |
| Offset (Null) | — | 0 mV nominal at 10 V excitation |
| Bridge Resistance | — | [DATA_NEEDED: input/output bridge resistance] |
| Linearity | — | [DATA_NEEDED: linearity %FS] |
| Pressure Port Size | — | Female, 0.128 in (3.25 mm) side port |
| پیکیج / کیس | — | 4-SSIP Module (chip-pak, no gel) |
| Gel Protection | — | No (bare die in chip-pak cavity) |
| Storage Temperature | — | [DATA_NEEDED: storage temperature range] |
| MSL لیول | — | Not applicable (through-hole sensor module) |
| Manufacturer | — | NXP Semiconductors (formerly Freescale / Motorola) |