MPXC2011DT1 vs MPXC2012DT1 比較

詳細並排比較 MPXC2011DT1 由 NXP Semiconductors 與 MPXC2012DT1 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPXC2011DT1 MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 ✓ 啟用中

規格比較

參數 MPXC2011DT1 MPXC2012DT1
品牌 NXP Semiconductors NXP Semiconductors
類別 Pressure Sensors Pressure Sensors
生命週期狀態 啟用中 NRND
Pressure Type Differential Differential
Operating Pressure Range 0 kPa to 10 kPa (0 PSI to 1.45 PSI) —
Full-Scale Output 25 mV typical at 10 V excitation 24 mV to 26 mV (typ. 25 mV) at 10 V excitation
Sensitivity 2.5 mV/kPa typical —
Excitation Voltage 3 V DC to 10 V DC (10 V nominal) 10 V DC typical
輸出類型 Analog Wheatstone bridge (ratiometric) Wheatstone Bridge (analog mV)
封裝 4-SSIP Chip Pak module, side port —
Port Style Female, 3.25 mm (0.128 in) barbed side port Side port, single barbed inlet
Termination Style Through-hole PCB, 4 leads Through-hole PCB (vertical mount)
工作溫度 0 °C to +85 °C [DATA_NEEDED: operating temperature range]
Compensation On-chip temperature compensated and calibrated —
Technology Piezoresistive silicon strain gauge —
Module Dimensions 7.6 mm x 12.8 mm nominal —
安裝類型 Through-hole (PCB mount with side-port tubing) Through-hole, vertical
RoHS 狀態 [DATA_NEEDED: RoHS status not in web data] [DATA_NEEDED: RoHS compliance status]
Operating Pressure — 1.45 PSI (10 kPa)
Maximum Over Pressure — [DATA_NEEDED: maximum overpressure rating]
Offset (Null) — 0 mV nominal at 10 V excitation
Bridge Resistance — [DATA_NEEDED: input/output bridge resistance]
Linearity — [DATA_NEEDED: linearity %FS]
Pressure Port Size — Female, 0.128 in (3.25 mm) side port
封裝 / 外殼 — 4-SSIP Module (chip-pak, no gel)
Gel Protection — No (bare die in chip-pak cavity)
Storage Temperature — [DATA_NEEDED: storage temperature range]
MSL 等級 — Not applicable (through-hole sensor module)
Manufacturer — NXP Semiconductors (formerly Freescale / Motorola)

資料表與資源

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