MPXC2011DT1 vs MPXC2012DT1 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MPXC2011DT1 disebabkan oleh NXP Semiconductors dan MPXC2012DT1 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MPXC2011DT1 MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 ✓ Aktif

Pengandingan Spesifikasi

Parametr MPXC2011DT1 MPXC2012DT1
Merek NXP Semiconductors NXP Semiconductors
Kategori Pressure Sensors Pressure Sensors
Status Lingkungan Hidup Aktif NRND
Pressure Type Differential Differential
Operating Pressure Range 0 kPa to 10 kPa (0 PSI to 1.45 PSI) —
Full-Scale Output 25 mV typical at 10 V excitation 24 mV to 26 mV (typ. 25 mV) at 10 V excitation
Sensitivity 2.5 mV/kPa typical —
Excitation Voltage 3 V DC to 10 V DC (10 V nominal) 10 V DC typical
Jenis Output Analog Wheatstone bridge (ratiometric) Wheatstone Bridge (analog mV)
Kemasan 4-SSIP Chip Pak module, side port —
Port Style Female, 3.25 mm (0.128 in) barbed side port Side port, single barbed inlet
Termination Style Through-hole PCB, 4 leads Through-hole PCB (vertical mount)
Suhu Operasi 0 °C to +85 °C [DATA_NEEDED: operating temperature range]
Compensation On-chip temperature compensated and calibrated —
Technology Piezoresistive silicon strain gauge —
Module Dimensions 7.6 mm x 12.8 mm nominal —
Jenis Pemasangan Through-hole (PCB mount with side-port tubing) Through-hole, vertical
Status RoHS [DATA_NEEDED: RoHS status not in web data] [DATA_NEEDED: RoHS compliance status]
Operating Pressure — 1.45 PSI (10 kPa)
Maximum Over Pressure — [DATA_NEEDED: maximum overpressure rating]
Offset (Null) — 0 mV nominal at 10 V excitation
Bridge Resistance — [DATA_NEEDED: input/output bridge resistance]
Linearity — [DATA_NEEDED: linearity %FS]
Pressure Port Size — Female, 0.128 in (3.25 mm) side port
Kemasan / Case — 4-SSIP Module (chip-pak, no gel)
Gel Protection — No (bare die in chip-pak cavity)
Storage Temperature — [DATA_NEEDED: storage temperature range]
Aras MSL — Not applicable (through-hole sensor module)
Manufacturer — NXP Semiconductors (formerly Freescale / Motorola)

Laporan Datasheet & Sumber

Lihat Semua Produk Buat BOQ Minta Bao Harga