5CSEBA6U19I7LN - Cyclone V SE SoC FPGA 110K LE | Intel
MPN: 5CSEBA6U19I7LN ✓ نشط5CSEBA6U19I7LN نظرة عامة
A System-on-Chip (SoC) FPGA is a heterogeneous compute device that combines a general-purpose processor subsystem, hardened memory and peripherals, and a programmable logic fabric on one silicon die. This architecture sits in the broader hierarchy of embedded processors: microcontroller -> microprocessor -> applications processor -> SoC -> SoC FPGA. Compared to a discrete FPGA-plus-MPU solution, a Cyclone V SE SoC FPGA reduces board area, lowers bill-of-materials cost, and simplifies high-bandwidth fabric-to-processor data paths through on-chip AXI/ARM Cortex-A9 MPCore bridges.
Key features of the 5CSEBA6U19I7LN include 110K logic elements, embedded 32-bit Cortex-A9 MPCore dual-core processor subsystem, 64-bit ECC-capable DDR3 hard memory controller, and integrated CoreSight debug. The device supports industrial temperature range and the commercial speed grade 7 silicon for moderate-speed designs. Embedded multipliers and M10K memory blocks enable on-chip DSP and buffering without consuming fabric.
Architecturally, the Cyclone V SE fabric uses TSMC 28 nm low-power process technology, achieving static power reductions of up to 40% versus prior Cyclone generations. The hard ARM subsystem includes NEON media engine, single/double-precision FPU, and dedicated L1 caches per core plus a shared L2 cache, enabling Linux and real-time OS workloads alongside RTL accelerators.
Typical applications include industrial motor control, factory automation HMI panels, video surveillance encoders, machine vision pre-processing, and portable medical instrumentation. The combination of low static power and a hardened ARM core makes it well suited for always-on embedded systems where a soft-core-only FPGA would overtax power budgets.
When designing with this device, allocate sufficient PCB area for the 484-pin UBGA 19x19 mm footprint and follow Intel's pinout guidelines for power-pin decoupling. Quartus Prime software (Standard or Pro edition) is required for synthesis, place-and-route, and HPS firmware development, with the Intel SoC EDS providing GCC/Linaro toolchains for the ARM side.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
بدائل مباشرة لـ 5CSEBA6U19I7LN — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع 5CSEBA6U19I7LN (نفس عامل الشكل والبصمة) — يختلف في Package, Logic Elements, DSP Blocks, Embedded Memory, Process Technology.
5CSEBA6U19I7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5CSEBA6U19C8SN
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5CSEBA5U19I7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5CSEBA5U19I7LN
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5CSEBA4U19I7LN
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5CSEBA2U19I7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5CSEBA6U19I7LN الحدود القصوى والخصائص الكهربائية
| Device Family | Cyclone V SE |
| Product Type | System-on-Chip (SoC) FPGA |
| Logic Elements | 110K |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Hard Processor Core Count | 2 |
| Maximum HPS Clock Frequency | 925 MHz |
| العلبة | 484-UBGA (Ultra FineLine BGA), 19x19 mm |
| Pin/Ball Count | 484 |
| Process Technology | TSMC 28 nm low-power |
| Embedded Memory | M10K + MLAB blocks |
| DSP Blocks | 18x18 multipliers, fabric-implemented |
| Hard Memory Controller | DDR3, DDR3L, LPDDR2 with ECC |
| درجة حرارة التشغيل | -40C to +100C (Industrial) |
| Speed Grade | 7 |
| حالة RoHS | Compliant |
| نوع التركيب | Surface Mount (BGA) |
دليل تكوين أطراف 5CSEBA6U19I7LN 484-ubga (ultra fineline bga), 19x19 mm
تكوين الأطراف لـ 5CSEBA6U19I7LN (حزمة 484-ubga (ultra fineline bga), 19x19 mm). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ 5CSEBA6U19I7LN.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
5CSEBA6U19I7LN مناسب لـ 6 التطبيقs: Industrial Motor Control, Machine Vision Pre-Processing, Human-Machine Interface (HMI) Panels, Video Surveillance Encoders, Portable Medical Instrumentation, Factory Automation Controllers.
Industrial Motor Control
The 5CSEBA6U19I7LN's 110K logic elements provide ample FPGA fabric to implement high-resolution PWM generation, encoder feedback, and field-oriented control state machines for industrial motor drives, while the dual-core ARM Cortex-A9 MPCore subsystem runs Linux for EtherCAT or EtherNet/IP master stacks. Industrial -40C to +100C temperature rating suits factory-floor cabinets. Hardware acceleration offloads torque loop calculations from the HPS, achieving sub-microsecond loop times that a discrete MCU cannot match.
موصى به
Machine Vision Pre-Processing
The Cyclone V SE fabric in the 5CSEBA6U19I7LN enables hardware-accelerated image pipeline stages (Bayer demosaicing, histogram equalization, edge detection) at line rate, while the 925 MHz HPS runs OpenCV-based classification and TCP/IP streaming to a host PC. The hard DDR3 controller with ECC sustains multi-megapixel sensor bandwidth without external memory. Industrial temperature tolerance supports outdoor and ruggedized machine-vision installations such as automated optical inspection cells.
موصى به
Human-Machine Interface (HMI) Panels
The 5CSEBA6U19I7LN's HPS runs Linux with Qt or Chromium-based HMIs at 925 MHz, driving LVDS or TTL LCD panels up to 1080p through the FPGA fabric's dedicated display IP. The 110K logic elements handle graphic overlay acceleration, touch-screen controllers, and industrial bus interfaces (PROFINET, Modbus). Power-efficient 28 nm process keeps the panel under fanless operation for sealed enclosures typical in food processing or chemical plants.
موصى به
Video Surveillance Encoders
Multi-channel H.264/H.265 encoding pipelines are mapped onto the 5CSEBA6U19I7LN's fabric where the embedded multipliers accelerate DCT and motion-estimation kernels, freeing the ARM cores for stream multiplexing, ONVIF protocol handling, and storage management. The hard DDR3 controller with ECC buffers raw 1080p frames at 60 fps without off-chip memory bottlenecks. Industrial temperature tolerance supports outdoor IP-camera housings in extreme climates.
موصى به
Portable Medical Instrumentation
The 5CSEBA6U19I7LN's low-power 28 nm process and integrated HPS suit portable patient monitors where battery life is critical. The FPGA fabric implements DSP front-ends for ECG/EEG signal conditioning while the ARM cores run real-time QRS detection algorithms and a touch-screen user interface. Industrial temperature tolerance supports cold-chain transport between hospitals. Single-chip integration reduces BOM cost and PCB size for handheld devices.
موصى به
Factory Automation Controllers
The 5CSEBA6U19I7LN combines deterministic FPGA I/O for sensors and actuators with a Cortex-A9 HPS running industrial Linux, suitable for programmable automation controllers (PACs) and PLCs. Fabric-implemented high-speed counters, PWM, and serial protocols (RS-485, SPI, I2C) handle deterministic machine control, while the HPS executes ladder-logic or structured-text runtimes. The 484-UBGA 19x19 mm package enables compact DIN-rail-mounted controllers.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ 5CSEBA6U19I7LN — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | 5CSEBA6U19I7N | 5CSEBA6U19C8SN | 5CSEBA5U19I7N | 5CSEBA5U19I7LN | 5CSEBA4U19I7LN | 5CSEBA2U19I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-UBGA (19x19) |
| Logic Elements | 110K | 110K | 110K | 85K | 85K | 40K | 25K |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| HPS Clock Frequency | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz |
| Speed Grade | 7 | 7 | 8 (faster) | 7 | 7 | 7 | 7 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Approx. Unit Price (USD) | $412.50 | $385 (commercial-temp discount) | $450 (speed grade premium) | $320 | $345 | $225 | $185 |
أبرز الفروقات
- Highest logic density in the U19 BGA variant of Cyclone V SE (مقابل5CSEBA5U19I7LN)
- Industrial temperature grade at the 110K-LE density point (مقابل5CSEBA6U19I7N)
- Same HPS clock speed (925 MHz) and ARM subsystem across the entire U19 SE family (مقابل5CSEBA2U19I7N)
ملاحظات التصميم
Estimated: at 1.0 W typical SoC FPGA power and 484-UBGA 19x19 mm with theta_JA around 14 C/W (JEDEC JESD51-9 still air), junction-to-ambient rise is roughly 14C. Industrial -40C to +100C operation is achievable in still air with a moderate copper-pour heat-spreader on inner PCB layers. For enclosed cabinets, calculate with Marlow Industries or Wakefield-Vette heatsink data sheets for your specific airflow profile.
The 484-UBGA 19x19 mm package requires at minimum a 1.0 mm pitch BGA fanout with microvia stacks (4-layer PCB is feasible; 6+ layers recommended for signal-integrity). Intel provides Cyclone V device family pin connection guidelines for power-pin decoupling - use 0.1 uF X7R capacitors within 50 mil of every power ball, plus bulk 22 uF tantalum or polymer per rail. Match trace lengths within 25 mil for DDR3 address/command and within 50 mil for byte-lane DQS to avoid setup/hold violations in the hard memory controller.
Separate HPS clock, HPS JTAG, and FPGA fabric JTAG chains; do not share routing between HPS and FPGA bank I/O to avoid simultaneous-switching-noise coupling into the hard processor subsystem. Place the 25 MHz HPS reference clock crystal within 200 mil of the HPS_CLK1 pins with a guard-ring ground pour. Keep LVDS pairs length-matched within 5 mil for display or camera interfaces.
Do not assume all Cyclone V SE packages are drop-in compatible - the U19 (484-UBGA 19x19), U23 (484-UBGA 23x23), and F35 (896-FBGA 35x35) differ in pinout and even ball count. Verify pinout in Pin Planner before reusing a PCB layout. Also, the 'N' vs 'LN' suffix distinction matters: 'N' indicates lead-free solder balls but commercial temp; 'LN' indicates industrial temperature. Mixing these on a BOM causes qualification failure.
Estimated: Cyclone V SE SoC FPGAs typically draw 0.5-1.5 W for the HPS subsystem and 1-3 W for fabric use, totaling under 5 W for moderate designs. Design the regulator tree with a 3 A capable buck for VCCINT plus separate LDO for VCCPD and HPS analog rails. Avoid tying VCCIO banks at incompatible voltages - this device supports 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V LVCMOS per bank but mixing LVDS and LVCMOS in one bank requires special constraints.
معلومات الامتثال
RoHS compliance confirmed via distributor listings. Halogen-free status not explicitly stated in provided data - confirm with Intel material declaration if required. Not AEC-Q100; for automotive use, contact Intel about Cyclone V Auto variants.
