5CSEBA4U19I7LN - 40K LE Cyclone V SoC, Dual ARM Cortex-A9 | Intel
MPN: 5CSEBA4U19I7LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $225 | $2,250.00 |
| 100 | $198.5 | $19,850.00 |
| 250 | $180 | $45,000.00 |
| 500 | $168 | $84,000.00 |
Drop-in alternatives for 5CSEBA4U19I7LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CSEBA5U19I7N
✅ Drop-In✓ In Stock
$119.85 / Unit
View Datasheet →5CSEBA6U19I7N
✅ Drop-In📋 Reference alternative (not in catalog)
5CSEBA4U19I7N
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$72 / Unit
View Datasheet →5CSEBA5U19C7N
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$99.2 / Unit
View Datasheet →5CSEBA2U19I7N
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$454.39 / Unit
View Datasheet →5CSEBA4U19I7LN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 40K |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 925 MHz |
| FPGA Logic Performance | up to 925 MHz DSP / 300 MHz logic |
| DSP Blocks (18x18 Multipliers) | 56 |
| Memory Controller | DDR2/DDR3/LPDDR2 with ECC (hardened in HPS) |
| HPS Peripherals | UART, SPI, I2C, USB 2.0 OTG, EMAC, SD/MMC, NAND, GPIO |
| Package | 484-pin UFBGA (19x19 mm, 0.8 mm pitch) |
| Process Technology | TSMC 28 nm low-power |
| Operating Temperature (Industrial) | -40C to +100C (I7 grade, inferred from MPN suffix) |
| Supply Voltage (core) | 1.1 V typical (Cyclone V family) |
| RoHS Status | Compliant |
| Configuration Scheme | Serial (EPCS) or Quad-Serial Flash |
| Mounting Type | Surface Mount (BGA) |
5CSEBA4U19I7LN 484-pin ufbga (19x19 mm, 0.8 mm pitch) Pin Configuration Guide
Complete pinout information for 5CSEBA4U19I7LN (484-pin ufbga (19x19 mm, 0.8 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA4U19I7LN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA4U19I7LN is suitable for 6 applications: Industrial Machine Vision, Motor Drive and Inverter Control, Broadcast Video Processing, Military and Aerospace Signal Processing, Factory Automation Controllers, Portable Medical Diagnostic Devices.
Industrial Machine Vision
The 5CSEBA4U19I7LN fits machine vision pipelines because its 40K logic elements plus 56 18x18 DSP multipliers can run Bayer demosaic, Sobel edge detection, and FFT preprocessing at full camera frame rate (typically 60-120 fps at 1080p) in parallel fabric, while the dual-core ARM Cortex-A9 HPS at 925 MHz handles object classification, GigE Vision/USB3 Vision protocol stacks, and Linux user-space orchestration. The hardened DDR3 controller with ECC in the HPS provides a low-latency buffer for line-scan and area-array sensors, and the industrial -40C to +100C junction rating supports factory-floor enclosures. Reference: Intel Cyclone V SoC Development Kit for industrial imaging reference designs.
Recommended
Motor Drive and Inverter Control
The 5CSEBA4U19I7LN serves motor control applications by combining FPGA-based field-oriented control (FOC) loops - typically implemented in fabric to achieve sub-microsecond current-loop update rates - with the ARM Cortex-A9 HPS running the velocity/torque loop, CANopen or EtherCAT master stack, and HMI. The 56 DSP multipliers accelerate Park/Clarke transforms and SVM modulation, while the 925 MHz Cortex-A9 HPS peripherals include EMAC for EtherCAT and CAN for legacy industrial buses. Industrial temperature grade and the hardened memory controller with ECC ensure reliable operation across inverter ambient conditions.
Recommended
Broadcast Video Processing
The 5CSEBA4U19I7LN is well matched to broadcast video workloads where the FPGA fabric handles SDI de/serialization, color space conversion, scaling, and genlock at low latency, while the dual-core ARM Cortex-A9 HPS runs the control plane for video routing, ancillary data extraction, and SNMP/JSON management. The 40K logic elements and LVDS I/O banks support multi-channel 3G-SDI I/O, and the 56 DSP multipliers accelerate chroma resampling. The 484-UFBGA package supports multi-layer PCB stackups needed for controlled-impedance SDI traces.
Recommended
Military and Aerospace Signal Processing
The 5CSEBA4U19I7LN suits defense signal-processing applications because the hardened dual-core ARM Cortex-A9 MPCore with CoreSight provides SWaP-optimized heterogeneous compute, while the FPGA fabric handles radar DSP, software-defined radio baseband, or secure communications link layers. Industrial temperature grade (I7) and the 28 nm low-power process support size, weight, and power envelopes typical of unmanned systems. The device is widely used in DO-254 and MIL-STD-810 programs; reference Intel Cyclone V military-grade qualification packages for design assurance.
Recommended
Factory Automation Controllers
The 5CSEBA4U19I7LN enables compact Programmable Automation Controllers (PACs) by running real-time EtherCAT, PROFINET, or Modbus TCP stacks on the Cortex-A9 HPS while offloading deterministic I/O scanning, PWM, encoder decoding, and high-speed counter functions to fabric. The 40K logic elements are sufficient for 8-16 axis servo control with custom feedback loops, and the HPS peripherals include EMAC, USB, SD/MMC, and SPI for HMI and storage. The 484-UFBGA package keeps the controller PCB compact while supporting industrial EMC standards.
Recommended
Portable Medical Diagnostic Devices
The 5CSEBA4U19I7LN supports portable ultrasound, patient monitoring, and point-of-care diagnostic equipment by partitioning real-time DSP (beamforming, FIR filtering, FFT) onto the FPGA fabric while the Cortex-A9 HPS runs the user interface, network stack (TCP/IP, Wi-Fi via USB), and clinical data encryption. The 28 nm low-power process keeps the device's power envelope compatible with battery operation, and the integrated DDR3 controller with ECC preserves data integrity for diagnostic images. The industrial temperature grade supports clinical and field environments.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA4U19I7LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA5U19I7N | 5CSEBA6U19I7N | 5CSEBA4U19I7N | 5CSEBA5U19C7N | 5CSEBA2U19I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-pin UFBGA (19x19 mm) | 484-pin UFBGA (19x19 mm) - same | 484-pin UFBGA (19x19 mm) - same | 484-pin UFBGA (19x19 mm) - same | 484-pin UFBGA (19x19 mm) - same | 484-pin UFBGA (19x19 mm) - same |
| Logic Elements | 40K | 85K | 110K | 40K | 85K | 25K |
| HPS Processor | Dual ARM Cortex-A9 @ 925 MHz | Dual ARM Cortex-A9 @ 925 MHz | Dual ARM Cortex-A9 @ 925 MHz | Dual ARM Cortex-A9 @ 925 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 925 MHz |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Commercial (0C to +85C) | Industrial |
| DSP (18x18 Multipliers) | 56 | 87 | 112 | 56 | 87 | 36 |
| Hard Memory Controller | DDR2/DDR3/LPDDR2 + ECC | DDR2/DDR3/LPDDR2 + ECC | DDR2/DDR3/LPDDR2 + ECC | DDR2/DDR3/LPDDR2 + ECC | DDR2/DDR3/LPDDR2 + ECC | DDR2/DDR3/LPDDR2 + ECC |
| Lifecycle Status | Active | Active | Active | Active | Active | Active |
Key Differentiators
- Balanced 40K logic + dual-core Cortex-A9 HPS at 925 MHz on same die (vs 5CSEBA2U19I7N)
- Industrial -40C to +100C operating range with hardened memory controller (vs 5CSEBA5U19C7N)
- Wide ecosystem support: Quartus Prime, SoC EDS, ARM DS-5, Linux 6.x LTS (vs Xilinx Zynq-7000 family)
Design Notes
The 5CSEBA4U19I7LN requires multi-rail sequencing: 3.3 V VCCPD must ramp before or together with VCCIO, and VCC (1.1 V core) must come up after the I/O rails. Intel's Cyclone V Power Management User Guide specifies a maximum delta of 200 mV between rails during ramp. Use a dedicated power sequencer IC (e.g., LTC2923-class) or the SoC EDS preloader to enforce sequencing. Decouple each VCC/VCCIO/VCCPD domain with 0.1 uF + 10 uF ceramic capacitors within 5 mm of each pin, and add bulk capacitance on the 1.0 V HPS core and 1.5 V DDR supply to handle HPS-to-FPGA bus bursts.
Estimated: at full HPS (1.5 W) and 40K-LE fabric utilization at 300 MHz (approximately 1.2 W) the 5CSEBA4U19I7LN dissipates about 2.7 W total. The 484-UFBGA has a theta_JA of roughly 13 C/W on a 4-layer JEDEC JESD51 test board, yielding a 35 C rise above ambient - comfortable for industrial 100 C operation. For enclosed designs, place thermal vias in the BGA land pattern and consider a 30x30 mm copper spreader. Use Quartus Prime's PowerPlay early power estimator for accurate per-design budget.
The 484-UFBGA package uses 0.8 mm pitch; route with microvia (laser-drilled) stackups rather than through-via dog-bones to escape the inner rows. Maintain 50 ohm controlled impedance for LVDS pairs used by FPGA transceivers, and 100 ohm differential for HPS RGMII. Reference Intel's Cyclone V SoC Board Design Guidelines for DDR3 trace matching (within 25 ps skew), length-matched HPS-to-FPGA bridges (lightweight HPS-to-FPGA AXI bus), and the recommended 8-layer stackup. Add a low-ESR 0402 0.1 uF cap under each FPGA quadrant for high-frequency decoupling.
Three pitfalls to avoid on 5CSEBA4U19I7LN designs: (1) The HPS boot pins MSEL[2:0] and BSEL must be tied to the correct mode (000 = NAND, 001 = SD/MMC, 100 = QSPI) - a mismatch silently bricks the boot flow; verify with the SoC EDS preloader generator. (2) Do not enable both HPS and FPGA core supplies simultaneously without sequencing, as back-powering through the HPS-to-FPGA bridges can latch up the HPS. (3) The JTAG chain must include both the HPS TAP (ARM CoreSight) and the FPGA TAP - a missing HPS TAP blocks DS-5 debugger attach even when FPGA JTAG works.
Compliance Information
RoHS and lead-free per Cyclone V family datasheet; AEC-Q100 not applicable for industrial-grade SoC FPGA. For halogen-free status consult the Intel Material Declaration.
