5CSEBA6U19I7LN - Cyclone V SE SoC FPGA 110K LE | Intel
MPN: 5CSEBA6U19I7LN ✓ فعال5CSEBA6U19I7LN نمای کلی
A System-on-Chip (SoC) FPGA is a heterogeneous compute device that combines a general-purpose processor subsystem, hardened memory and peripherals, and a programmable logic fabric on one silicon die. This architecture sits in the broader hierarchy of embedded processors: microcontroller -> microprocessor -> applications processor -> SoC -> SoC FPGA. Compared to a discrete FPGA-plus-MPU solution, a Cyclone V SE SoC FPGA reduces board area, lowers bill-of-materials cost, and simplifies high-bandwidth fabric-to-processor data paths through on-chip AXI/ARM Cortex-A9 MPCore bridges.
Key features of the 5CSEBA6U19I7LN include 110K logic elements, embedded 32-bit Cortex-A9 MPCore dual-core processor subsystem, 64-bit ECC-capable DDR3 hard memory controller, and integrated CoreSight debug. The device supports industrial temperature range and the commercial speed grade 7 silicon for moderate-speed designs. Embedded multipliers and M10K memory blocks enable on-chip DSP and buffering without consuming fabric.
Architecturally, the Cyclone V SE fabric uses TSMC 28 nm low-power process technology, achieving static power reductions of up to 40% versus prior Cyclone generations. The hard ARM subsystem includes NEON media engine, single/double-precision FPU, and dedicated L1 caches per core plus a shared L2 cache, enabling Linux and real-time OS workloads alongside RTL accelerators.
Typical applications include industrial motor control, factory automation HMI panels, video surveillance encoders, machine vision pre-processing, and portable medical instrumentation. The combination of low static power and a hardened ARM core makes it well suited for always-on embedded systems where a soft-core-only FPGA would overtax power budgets.
When designing with this device, allocate sufficient PCB area for the 484-pin UBGA 19x19 mm footprint and follow Intel's pinout guidelines for power-pin decoupling. Quartus Prime software (Standard or Pro edition) is required for synthesis, place-and-route, and HPS firmware development, with the Intel SoC EDS providing GCC/Linaro toolchains for the ARM side.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
جایگزین‌های drop-in برای 5CSEBA6U19I7LN — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای 5CSEBA6U19I7LN (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Package, Logic Elements, DSP Blocks, Embedded Memory, Process Technology.
5CSEBA6U19I7N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←5CSEBA6U19C8SN
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←5CSEBA5U19I7N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←5CSEBA5U19I7LN
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←5CSEBA4U19I7LN
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←5CSEBA2U19I7N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←5CSEBA6U19I7LN حداکثر مقادیر مجاز و مشخصات الکتریکی
| Device Family | Cyclone V SE |
| Product Type | System-on-Chip (SoC) FPGA |
| Logic Elements | 110K |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Hard Processor Core Count | 2 |
| Maximum HPS Clock Frequency | 925 MHz |
| بسته‌بندی | 484-UBGA (Ultra FineLine BGA), 19x19 mm |
| Pin/Ball Count | 484 |
| Process Technology | TSMC 28 nm low-power |
| Embedded Memory | M10K + MLAB blocks |
| DSP Blocks | 18x18 multipliers, fabric-implemented |
| Hard Memory Controller | DDR3, DDR3L, LPDDR2 with ECC |
| دمای کاری | -40C to +100C (Industrial) |
| Speed Grade | 7 |
| وضعیت RoHS | Compliant |
| نوع نصب | Surface Mount (BGA) |
راهنمای پیکربندی پین 5CSEBA6U19I7LN 484-ubga (ultra fineline bga), 19x19 mm
پیکربندی پین برای 5CSEBA6U19I7LN (پکیج 484-ubga (ultra fineline bga), 19x19 mm). این IC دیجیتال شامل GPIO، رابط‌های ارتباطی (UART، SPI، I2C) و پین‌های تغذیه است. برای عملکردهای جایگزین پین و گزینه‌های پیکربندی به دیتاشیت سازنده مراجعه کنید. ضروری برای طراحی سیستم‌های نهفته و چیدمان PCB.
داده پین‌آوت تفصیلی موجود نیست برای 5CSEBA6U19I7LN.
به دیتاشیت برای پیکربندی کامل پین‌ها.
کاربردهای معمول
5CSEBA6U19I7LN مناسب است برای 6 کاربردs: Industrial Motor Control, Machine Vision Pre-Processing, Human-Machine Interface (HMI) Panels, Video Surveillance Encoders, Portable Medical Instrumentation, Factory Automation Controllers.
Industrial Motor Control
The 5CSEBA6U19I7LN's 110K logic elements provide ample FPGA fabric to implement high-resolution PWM generation, encoder feedback, and field-oriented control state machines for industrial motor drives, while the dual-core ARM Cortex-A9 MPCore subsystem runs Linux for EtherCAT or EtherNet/IP master stacks. Industrial -40C to +100C temperature rating suits factory-floor cabinets. Hardware acceleration offloads torque loop calculations from the HPS, achieving sub-microsecond loop times that a discrete MCU cannot match.
پیشنهادی
Machine Vision Pre-Processing
The Cyclone V SE fabric in the 5CSEBA6U19I7LN enables hardware-accelerated image pipeline stages (Bayer demosaicing, histogram equalization, edge detection) at line rate, while the 925 MHz HPS runs OpenCV-based classification and TCP/IP streaming to a host PC. The hard DDR3 controller with ECC sustains multi-megapixel sensor bandwidth without external memory. Industrial temperature tolerance supports outdoor and ruggedized machine-vision installations such as automated optical inspection cells.
پیشنهادی
Human-Machine Interface (HMI) Panels
The 5CSEBA6U19I7LN's HPS runs Linux with Qt or Chromium-based HMIs at 925 MHz, driving LVDS or TTL LCD panels up to 1080p through the FPGA fabric's dedicated display IP. The 110K logic elements handle graphic overlay acceleration, touch-screen controllers, and industrial bus interfaces (PROFINET, Modbus). Power-efficient 28 nm process keeps the panel under fanless operation for sealed enclosures typical in food processing or chemical plants.
پیشنهادی
Video Surveillance Encoders
Multi-channel H.264/H.265 encoding pipelines are mapped onto the 5CSEBA6U19I7LN's fabric where the embedded multipliers accelerate DCT and motion-estimation kernels, freeing the ARM cores for stream multiplexing, ONVIF protocol handling, and storage management. The hard DDR3 controller with ECC buffers raw 1080p frames at 60 fps without off-chip memory bottlenecks. Industrial temperature tolerance supports outdoor IP-camera housings in extreme climates.
پیشنهادی
Portable Medical Instrumentation
The 5CSEBA6U19I7LN's low-power 28 nm process and integrated HPS suit portable patient monitors where battery life is critical. The FPGA fabric implements DSP front-ends for ECG/EEG signal conditioning while the ARM cores run real-time QRS detection algorithms and a touch-screen user interface. Industrial temperature tolerance supports cold-chain transport between hospitals. Single-chip integration reduces BOM cost and PCB size for handheld devices.
پیشنهادی
Factory Automation Controllers
The 5CSEBA6U19I7LN combines deterministic FPGA I/O for sensors and actuators with a Cortex-A9 HPS running industrial Linux, suitable for programmable automation controllers (PACs) and PLCs. Fabric-implemented high-speed counters, PWM, and serial protocols (RS-485, SPI, I2C) handle deterministic machine control, while the HPS executes ladder-logic or structured-text runtimes. The 484-UBGA 19x19 mm package enables compact DIN-rail-mounted controllers.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای 5CSEBA6U19I7LN — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | 5CSEBA6U19I7N | 5CSEBA6U19C8SN | 5CSEBA5U19I7N | 5CSEBA5U19I7LN | 5CSEBA4U19I7LN | 5CSEBA2U19I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-UBGA (19x19) |
| Logic Elements | 110K | 110K | 110K | 85K | 85K | 40K | 25K |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| HPS Clock Frequency | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz |
| Speed Grade | 7 | 7 | 8 (faster) | 7 | 7 | 7 | 7 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Approx. Unit Price (USD) | $412.50 | $385 (commercial-temp discount) | $450 (speed grade premium) | $320 | $345 | $225 | $185 |
تفاوت‌های کلیدی
- Highest logic density in the U19 BGA variant of Cyclone V SE (در مقابل5CSEBA5U19I7LN)
- Industrial temperature grade at the 110K-LE density point (در مقابل5CSEBA6U19I7N)
- Same HPS clock speed (925 MHz) and ARM subsystem across the entire U19 SE family (در مقابل5CSEBA2U19I7N)
یادداشت‌های طراحی
Estimated: at 1.0 W typical SoC FPGA power and 484-UBGA 19x19 mm with theta_JA around 14 C/W (JEDEC JESD51-9 still air), junction-to-ambient rise is roughly 14C. Industrial -40C to +100C operation is achievable in still air with a moderate copper-pour heat-spreader on inner PCB layers. For enclosed cabinets, calculate with Marlow Industries or Wakefield-Vette heatsink data sheets for your specific airflow profile.
The 484-UBGA 19x19 mm package requires at minimum a 1.0 mm pitch BGA fanout with microvia stacks (4-layer PCB is feasible; 6+ layers recommended for signal-integrity). Intel provides Cyclone V device family pin connection guidelines for power-pin decoupling - use 0.1 uF X7R capacitors within 50 mil of every power ball, plus bulk 22 uF tantalum or polymer per rail. Match trace lengths within 25 mil for DDR3 address/command and within 50 mil for byte-lane DQS to avoid setup/hold violations in the hard memory controller.
Separate HPS clock, HPS JTAG, and FPGA fabric JTAG chains; do not share routing between HPS and FPGA bank I/O to avoid simultaneous-switching-noise coupling into the hard processor subsystem. Place the 25 MHz HPS reference clock crystal within 200 mil of the HPS_CLK1 pins with a guard-ring ground pour. Keep LVDS pairs length-matched within 5 mil for display or camera interfaces.
Do not assume all Cyclone V SE packages are drop-in compatible - the U19 (484-UBGA 19x19), U23 (484-UBGA 23x23), and F35 (896-FBGA 35x35) differ in pinout and even ball count. Verify pinout in Pin Planner before reusing a PCB layout. Also, the 'N' vs 'LN' suffix distinction matters: 'N' indicates lead-free solder balls but commercial temp; 'LN' indicates industrial temperature. Mixing these on a BOM causes qualification failure.
Estimated: Cyclone V SE SoC FPGAs typically draw 0.5-1.5 W for the HPS subsystem and 1-3 W for fabric use, totaling under 5 W for moderate designs. Design the regulator tree with a 3 A capable buck for VCCINT plus separate LDO for VCCPD and HPS analog rails. Avoid tying VCCIO banks at incompatible voltages - this device supports 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V LVCMOS per bank but mixing LVDS and LVCMOS in one bank requires special constraints.
اطلاعات انطباق
RoHS compliance confirmed via distributor listings. Halogen-free status not explicitly stated in provided data - confirm with Intel material declaration if required. Not AEC-Q100; for automotive use, contact Intel about Cyclone V Auto variants.
