5CSEBA5U19I7LN - Cyclone V SE SoC FPGA, 85K LE, 925MHz, U19 | Intel
MPN: 5CSEBA5U19I7LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $215 | $215.00 |
| 10 | $198.5 | $1,985.00 |
| 100 | $175 | $17,500.00 |
| 500 | $158.2 | $79,100.00 |
| 1,000 | $142.8 | $142,800.00 |
Drop-in alternatives for 5CSEBA5U19I7LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA5U19C8SN
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →5CSEBA5U19C8N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →5CSEBA5U19C7SN
✅ Drop-In✓ In Stock
$305 / Unit
View Datasheet →5CSEBA5U19C7N
✅ Drop-In✓ In Stock
$99.2 / Unit
View Datasheet →5CSEBA5U19A7N
✅ Drop-In✓ In Stock
$152.4 / Unit
View Datasheet →5CSEBA5U19C6N
✅ Drop-In✓ In Stock
$118.2 / Unit
View Datasheet →5CSEBA4U19I7LN
✅ Drop-In✓ In Stock
$168 / Unit
View Datasheet →5CSEBA4U19I7N
✅ Drop-In✓ In Stock
$72 / Unit
View Datasheet →5CSEBA5U19I7LN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 85 K |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 925 MHz |
| Package | 484-UBGA (U19), 19x19 mm |
| Operating Temperature Range | -40C to +100C (Industrial) |
| Speed Grade | I7 |
| Embedded Memory | 4.45 Mbits |
| DSP Blocks | 156 |
| User I/O Pins | 364 |
| I/O Banks | 8 |
| Transceivers | Up to 3.125 Gbps |
| Hard Memory Controller | DDR3 with ECC support |
| Hard PCIe | PCIe Gen2 x4 |
| Hard Ethernet MAC | Gigabit Ethernet |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
5CSEBA5U19I7LN 484-ubga (u19), 19x19 mm Pin Configuration Guide
Complete pinout information for 5CSEBA5U19I7LN (484-ubga (u19), 19x19 mm package) with 364 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA5U19I7LN.
Refer to the datasheet for full pin configuration.
Estimated pin count: 364 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA5U19I7LN is suitable for 7 applications: Industrial Machine Vision Systems, Motor Control and Industrial Drives, Video Surveillance and Broadcast Equipment, Factory Automation Controllers with HMI, Smart Energy and Grid Edge Devices, Automotive Driver-Assist Prototyping, Medical Imaging and Diagnostic Equipment.
Industrial Machine Vision Systems
The 5CSEBA5U19I7LN is ideal for industrial machine vision systems that need real-time image preprocessing on the FPGA fabric and Linux-based classification or defect-detection algorithms on the HPS. The 85K logic elements and 156 DSP blocks accelerate common preprocessing tasks - Bayer demosaicing, Sobel filtering, and morphological operations - while the 925 MHz Dual ARM Cortex-A9 HPS runs OpenCV and inference frameworks like TensorFlow Lite. The integrated DDR3 controller with ECC supports the high memory bandwidth required for HD video pipelines, and the industrial temperature grade (-40C to +100C) ensures reliability on factory floors.
Recommended
Motor Control and Industrial Drives
The 5CSEBA5U19I7LN suits high-performance motor control drives where deterministic PWM generation and field-oriented control algorithms must coexist with industrial Ethernet protocol stacks. The FPGA fabric implements encoder decoding, PWM generation, and current-loop control with sub-microsecond latency, while the HPS runs Linux with EtherCAT, PROFINET, or EtherNet/IP master stacks for real-time communication. The 364 user I/O across 8 banks support multiple encoder interfaces (EnDat, BiSS, Tamagawa), gate-driver outputs, and analog feedback channels simultaneously.
Recommended
Video Surveillance and Broadcast Equipment
The 5CSEBA5U19I7LN powers multi-channel video surveillance recorders and broadcast video processing equipment that require H.264/H.265 encoding/decoding alongside analytics overlays. The FPGA fabric accelerates video pipeline functions - color space conversion, scaling, and overlay composition - while the HPS manages network streaming, storage, and ONVIF/RTSP protocol stacks. The 3.125 Gbps transceivers handle SDI input/output for broadcast-grade equipment, and the integrated Gigabit Ethernet MAC supports multiple IP camera streams simultaneously.
Recommended
Factory Automation Controllers with HMI
The 5CSEBA5U19I7LN integrates a Linux-driven HMI panel and PLC-style logic in a single SoC, eliminating the need for separate processor plus FPGA designs. The Dual ARM Cortex-A9 HPS runs Qt or Web-based HMI applications while the FPGA fabric executes deterministic ladder-logic or IEC 61131-3 soft-PLC code. The industrial temperature grade and integrated peripherals (USB, Ethernet, SD/MMC) make it suitable for control cabinets, and the 85K logic elements provide headroom for custom industrial protocols and safety functions.
Recommended
Smart Energy and Grid Edge Devices
The 5CSEBA5U19I7LN enables smart-grid edge devices such as phasor measurement units, power-quality analyzers, and substation controllers requiring high-speed ADC sampling plus secure communication. The FPGA fabric captures and processes high-rate ADC data streams from current/voltage sensors, while the HPS runs secure Linux with TLS/DNP3/IEC 61850 protocol stacks. The hard cryptographic accelerators in the HPS support grid cybersecurity requirements, and the industrial temperature grade withstands outdoor enclosure conditions.
Recommended
Automotive Driver-Assist Prototyping
The 5CSEBA5U19I7LN is used for prototyping advanced driver-assistance systems (ADAS) where sensor fusion and real-time processing must coexist with vehicle networking. The FPGA fabric pre-processes camera, radar, or lidar sensor data with deterministic latency, while the Dual ARM Cortex-A9 HPS runs object-detection and sensor-fusion algorithms. The 3.125 Gbps transceivers interface with automotive Ethernet (100BASE-T1, 1000BASE-T1) and CAN-FD buses, and the automotive speed-grade variant 5CSEBA5U19A7N supports AEC-Q100 environments when production qualification is required.
Recommended
Medical Imaging and Diagnostic Equipment
The 5CSEBA5U19I7LN supports portable and mid-range medical imaging systems such as ultrasound and endoscopy controllers where high-speed signal processing must be paired with user-interface software. The FPGA fabric implements beamforming, filtering, and image reconstruction algorithms, while the HPS drives the touchscreen UI, DICOM networking, and patient database integration. The medical-relevant features include the DDR3 controller with ECC for data integrity and the integrated Gigabit Ethernet for DICOM transmission over hospital networks.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA5U19I7LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA5U19C8SN | 5CSEBA5U19C7SN | 5CSEBA5U19A7N | 5CSEBA4U19I7LN |
|---|---|---|---|---|---|
| Package | 484-UBGA (U19) | 484-UBGA (U19) - same | 484-UBGA (U19) - same | 484-UBGA (U19) - same | 484-UBGA (U19) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 85 K | 85 K | 85 K | 85 K | 40 K (-53%) |
| Speed Grade | I7 | C8 (commercial) | C7 (commercial, -10%) | A7 (automotive) | I7 (industrial) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +125C (Automotive) | -40C to +100C (Industrial) |
| HPS Maximum Frequency | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz |
| DSP Blocks | 156 | 156 | 156 | 156 | 110 (-29%) |
| Embedded Memory | 4.45 Mbits | 4.45 Mbits | 4.45 Mbits | 4.45 Mbits | 2.7 Mbits (-39%) |
Key Differentiators
- Industrial temperature grade at I7 speed grade (vs 5CSEBA5U19C8SN)
- Larger FPGA fabric than 5CSEBA4 family (vs 5CSEBA4U19I7LN)
- Same-package U19 footprint with identical HPS (vs 5CSEBA5U19A7N)
Design Notes
The 5CSEBA5U19I7LN requires multiple voltage rails: a 0.85V core supply for the HPS and FPGA fabric, 1.1V/1.35V for DDR3 interface, 1.8V/2.5V/3.3V for I/O banks, and a 1.5V transceiver supply if the 3.125 Gbps channels are used. Decoupling per Intel reference designs should include 0402 ceramic capacitors placed as close as possible to each power pin, with bulk capacitors distributed across the BGA footprint. Estimate: total core current at full HPS and FPGA utilization is approximately 3-5A, requiring at least a 10A-capable buck regulator with remote sense.
The 484-UBGA package has a 19x19 mm body with 0.8 mm ball pitch. PCB design requires microvia (HDI) stack-up with at least 4-6 layers, blind/buried vias for breakout routing, and via-in-pad for the center ball rows. Use the Intel Cyclone V development kit PCB stack-up as a starting reference. Estimated minimum trace width for one ball escape is 0.1 mm (4 mil) with 0.1 mm spacing. Controlled impedance (50 ohm single-ended, 90 ohm differential) is required for all transceiver and DDR3 lanes.
Route DDR3 signals with matched-length matching per Intel pin-out guidelines: DQ/DQS within +/-25 mil, address/command within +/-100 mil, and clock within +/-50 mil. The HPS and FPGA-fabric DDR3 controllers each have their own dedicated I/O banks - do not share them between controllers. Estimate: total DDR3 trace length budget for a 16-bit interface is approximately 2 inches (50 mm) max to maintain signal integrity at 533 MHz operation.
Common pitfalls when designing with the 5CSEBA5U19I7LN: (1) Forget to provide both the HPS boot image (typically in QSPI flash or SD card) and the FPGA bitstream - the device will not boot fully without both. (2) Mix HPS and FPGA-fabric voltage rails - the HPS core requires 0.85V while the FPGA fabric may have different voltage requirements depending on utilization. (3) Neglect MSL handling - BGA packages require dry-pack storage and pre-bake if floor-life is exceeded before reflow. (4) Skip the configuration controller pin connection to MSEL - the boot mode will not be selectable without correct MSEL[4:0] strapping.
Compliance Information
RoHS and REACH compliant per Intel/Alt-era Cyclone V product family documentation. The standard 5CSEBA5U19I7LN is not AEC-Q100 qualified; choose 5CSEBA5U19A7N for AEC-Q100 automotive applications.
