5CSEBA6U19I7LN - Cyclone V SE SoC FPGA 110K LE | Intel
MPN: 5CSEBA6U19I7LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $412.5 | $412.50 |
| 10 | $386.2 | $3,862.00 |
| 100 | $348.75 | $34,875.00 |
| 250 | $319.4 | $79,850.00 |
| 500 | $288.9 | $144,450.00 |
Drop-in alternatives for 5CSEBA6U19I7LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA6U19I7N
✅ Drop-In✓ In Stock
$142.75 / Unit
View Datasheet →5CSEBA6U19C8SN
✅ Drop-In✓ In Stock
$205 / Unit
View Datasheet →5CSEBA5U19I7N
✅ Drop-In✓ In Stock
$119.85 / Unit
View Datasheet →5CSEBA5U19I7LN
✅ Drop-In✓ In Stock
$142.8 / Unit
View Datasheet →5CSEBA4U19I7LN
✅ Drop-In✓ In Stock
$168 / Unit
View Datasheet →5CSEBA2U19I7N
✅ Drop-In✓ In Stock
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View Datasheet →5CSEBA6U19I7LN Maximum Ratings & Electrical Characteristics
| Device Family | Cyclone V SE |
| Product Type | System-on-Chip (SoC) FPGA |
| Logic Elements | 110K |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Hard Processor Core Count | 2 |
| Maximum HPS Clock Frequency | 925 MHz |
| Package | 484-UBGA (Ultra FineLine BGA), 19x19 mm |
| Pin/Ball Count | 484 |
| Process Technology | TSMC 28 nm low-power |
| Embedded Memory | M10K + MLAB blocks |
| DSP Blocks | 18x18 multipliers, fabric-implemented |
| Hard Memory Controller | DDR3, DDR3L, LPDDR2 with ECC |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | 7 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
5CSEBA6U19I7LN 484-ubga (ultra fineline bga), 19x19 mm Pin Configuration Guide
Complete pinout information for 5CSEBA6U19I7LN (484-ubga (ultra fineline bga), 19x19 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA6U19I7LN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA6U19I7LN is suitable for 6 applications: Industrial Motor Control, Machine Vision Pre-Processing, Human-Machine Interface (HMI) Panels, Video Surveillance Encoders, Portable Medical Instrumentation, Factory Automation Controllers.
Industrial Motor Control
The 5CSEBA6U19I7LN's 110K logic elements provide ample FPGA fabric to implement high-resolution PWM generation, encoder feedback, and field-oriented control state machines for industrial motor drives, while the dual-core ARM Cortex-A9 MPCore subsystem runs Linux for EtherCAT or EtherNet/IP master stacks. Industrial -40C to +100C temperature rating suits factory-floor cabinets. Hardware acceleration offloads torque loop calculations from the HPS, achieving sub-microsecond loop times that a discrete MCU cannot match.
Recommended
Machine Vision Pre-Processing
The Cyclone V SE fabric in the 5CSEBA6U19I7LN enables hardware-accelerated image pipeline stages (Bayer demosaicing, histogram equalization, edge detection) at line rate, while the 925 MHz HPS runs OpenCV-based classification and TCP/IP streaming to a host PC. The hard DDR3 controller with ECC sustains multi-megapixel sensor bandwidth without external memory. Industrial temperature tolerance supports outdoor and ruggedized machine-vision installations such as automated optical inspection cells.
Recommended
Human-Machine Interface (HMI) Panels
The 5CSEBA6U19I7LN's HPS runs Linux with Qt or Chromium-based HMIs at 925 MHz, driving LVDS or TTL LCD panels up to 1080p through the FPGA fabric's dedicated display IP. The 110K logic elements handle graphic overlay acceleration, touch-screen controllers, and industrial bus interfaces (PROFINET, Modbus). Power-efficient 28 nm process keeps the panel under fanless operation for sealed enclosures typical in food processing or chemical plants.
Recommended
Video Surveillance Encoders
Multi-channel H.264/H.265 encoding pipelines are mapped onto the 5CSEBA6U19I7LN's fabric where the embedded multipliers accelerate DCT and motion-estimation kernels, freeing the ARM cores for stream multiplexing, ONVIF protocol handling, and storage management. The hard DDR3 controller with ECC buffers raw 1080p frames at 60 fps without off-chip memory bottlenecks. Industrial temperature tolerance supports outdoor IP-camera housings in extreme climates.
Recommended
Portable Medical Instrumentation
The 5CSEBA6U19I7LN's low-power 28 nm process and integrated HPS suit portable patient monitors where battery life is critical. The FPGA fabric implements DSP front-ends for ECG/EEG signal conditioning while the ARM cores run real-time QRS detection algorithms and a touch-screen user interface. Industrial temperature tolerance supports cold-chain transport between hospitals. Single-chip integration reduces BOM cost and PCB size for handheld devices.
Recommended
Factory Automation Controllers
The 5CSEBA6U19I7LN combines deterministic FPGA I/O for sensors and actuators with a Cortex-A9 HPS running industrial Linux, suitable for programmable automation controllers (PACs) and PLCs. Fabric-implemented high-speed counters, PWM, and serial protocols (RS-485, SPI, I2C) handle deterministic machine control, while the HPS executes ladder-logic or structured-text runtimes. The 484-UBGA 19x19 mm package enables compact DIN-rail-mounted controllers.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA6U19I7LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA6U19I7N | 5CSEBA6U19C8SN | 5CSEBA5U19I7N | 5CSEBA5U19I7LN | 5CSEBA4U19I7LN | 5CSEBA2U19I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-UBGA (19x19) |
| Logic Elements | 110K | 110K | 110K | 85K | 85K | 40K | 25K |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| HPS Clock Frequency | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz |
| Speed Grade | 7 | 7 | 8 (faster) | 7 | 7 | 7 | 7 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Approx. Unit Price (USD) | $412.50 | $385 (commercial-temp discount) | $450 (speed grade premium) | $320 | $345 | $225 | $185 |
Key Differentiators
- Highest logic density in the U19 BGA variant of Cyclone V SE (vs 5CSEBA5U19I7LN)
- Industrial temperature grade at the 110K-LE density point (vs 5CSEBA6U19I7N)
- Same HPS clock speed (925 MHz) and ARM subsystem across the entire U19 SE family (vs 5CSEBA2U19I7N)
Design Notes
Estimated: at 1.0 W typical SoC FPGA power and 484-UBGA 19x19 mm with theta_JA around 14 C/W (JEDEC JESD51-9 still air), junction-to-ambient rise is roughly 14C. Industrial -40C to +100C operation is achievable in still air with a moderate copper-pour heat-spreader on inner PCB layers. For enclosed cabinets, calculate with Marlow Industries or Wakefield-Vette heatsink data sheets for your specific airflow profile.
The 484-UBGA 19x19 mm package requires at minimum a 1.0 mm pitch BGA fanout with microvia stacks (4-layer PCB is feasible; 6+ layers recommended for signal-integrity). Intel provides Cyclone V device family pin connection guidelines for power-pin decoupling - use 0.1 uF X7R capacitors within 50 mil of every power ball, plus bulk 22 uF tantalum or polymer per rail. Match trace lengths within 25 mil for DDR3 address/command and within 50 mil for byte-lane DQS to avoid setup/hold violations in the hard memory controller.
Separate HPS clock, HPS JTAG, and FPGA fabric JTAG chains; do not share routing between HPS and FPGA bank I/O to avoid simultaneous-switching-noise coupling into the hard processor subsystem. Place the 25 MHz HPS reference clock crystal within 200 mil of the HPS_CLK1 pins with a guard-ring ground pour. Keep LVDS pairs length-matched within 5 mil for display or camera interfaces.
Do not assume all Cyclone V SE packages are drop-in compatible - the U19 (484-UBGA 19x19), U23 (484-UBGA 23x23), and F35 (896-FBGA 35x35) differ in pinout and even ball count. Verify pinout in Pin Planner before reusing a PCB layout. Also, the 'N' vs 'LN' suffix distinction matters: 'N' indicates lead-free solder balls but commercial temp; 'LN' indicates industrial temperature. Mixing these on a BOM causes qualification failure.
Estimated: Cyclone V SE SoC FPGAs typically draw 0.5-1.5 W for the HPS subsystem and 1-3 W for fabric use, totaling under 5 W for moderate designs. Design the regulator tree with a 3 A capable buck for VCCINT plus separate LDO for VCCPD and HPS analog rails. Avoid tying VCCIO banks at incompatible voltages - this device supports 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V LVCMOS per bank but mixing LVDS and LVCMOS in one bank requires special constraints.
Compliance Information
RoHS compliance confirmed via distributor listings. Halogen-free status not explicitly stated in provided data - confirm with Intel material declaration if required. Not AEC-Q100; for automotive use, contact Intel about Cyclone V Auto variants.
