5M2210ZF256C4N - MAX V CPLD, 1700 LE, FBGA-256, C4 Speed | Intel / Altera
MPN: 5M2210ZF256C4N ✓ نشط5M2210ZF256C4N نظرة عامة
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple SPLDs/GALs and higher-density FPGAs in the programmable logic hierarchy (CPLD -> PLD -> programmable logic -> digital IC). MAX V CPLDs are built on a 0.30 um 6-metal-layer CMOS process with a flash-based configuration cell, providing instant-on operation in less than 1 ms without an external boot PROM. They are used as glue logic, I/O expansion, interface bridging, and power-sequencing controllers in industrial, communications, and consumer systems. Unlike SRAM-based FPGAs that require external configuration memory, MAX V devices self-configure at power-up from internal flash.
Key features of the 5M2210ZF256C4N include 1700 LEs arranged in 221 Logic Array Blocks (LABs), 160 user I/O pins available in this FBGA-256 outline, a 1.8 V core supply (VCCINT) with multi-voltage I/O bank support (1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL), and an internal oscillator plus JTAG (IEEE 1149.1) and IEEE 1532 in-system programmability. Typical tPD pin-to-pin delay is in the 4 ns class for speed grade 4, suitable for control-path rather than high-speed datapath applications. The device supports live insertion and 5 V tolerant I/O when the bank VCCIO is set below 3.3 V.
The device integrates the JTAG controller, internal voltage regulator, and configuration flash memory on-die, eliminating the external programming PROM required by legacy MAX and MAX II CPLDs. It also provides four user I/O banks for flexible mixed-voltage interfacing, allowing direct connection to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without external level shifters.
Typical applications include bus interface bridging (e.g. PCI to local bus), I/O expansion for microcontrollers and ASICs, power-supply sequencing in multi-rail systems, configuration/control for companion FPGAs, and glue logic in industrial controllers and consumer set-top boxes. The FBGA-256 package and high I/O count make it suitable for high-density board-level integration.
When designing with this part, route all four VCCIO bank supplies and at least one VCCINT (1.8 V) supply with adequate decoupling (0.1 uF + bulk); unused I/O pins should be left floating or driven to a defined logic level to minimize in-rush during power-up. The 256-ball FBGA requires X-ray or BGA rework equipment for prototype bring-up, so allocate 2-3 days for first-article assembly.
This page synthesizes distributor pricing, drop-in MAX V family alternatives, BGA-256 pinout, and recommended design patterns not found in the bare manufacturer datasheet.
بدائل مباشرة لـ 5M2210ZF256C4N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع 5M2210ZF256C4N (نفس عامل الشكل والبصمة) — يختلف في Package, Operating Temperature, Programming Interface, Speed Grade, Family.
5M2210ZF256C5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5M2210ZF256I5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5M2210ZF256C4N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM570GF256C4N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5CEFA7F27C6N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5M2210ZF256C4N الحدود القصوى والخصائص الكهربائية
| Family | MAX V |
| Device | 5M2210Z |
| Logic Elements (LEs) | 1700 |
| Logic Array Blocks (LABs) | 221 |
| User Flash Memory | 8192 bits |
| Internal RAM | 212 Kbits |
| Maximum User I/O (family) | 203 |
| User I/O (this package) | 160 |
| العلبة | FBGA-256 (FineLine BGA) |
| درجة حرارة التشغيل | 0C to 85C (Commercial) |
| Speed Grade | C4 (tPD ~4 ns class) |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Bank Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Number of I/O Banks | 4 |
| Programming Interface | JTAG (IEEE 1149.1) / IEEE 1532 ISP |
| Configuration Method | Internal flash (instant-on < 1 ms) |
| Process Technology | 0.30 um 6-metal-layer CMOS |
| حالة RoHS | Compliant (Pb-free ball finish) |
تكوين أطراف 5M2210ZF256C4N
| دبوس A1 | I/O — User I/O pin (Bank 1) |
| دبوس A2 | I/O — User I/O pin (Bank 1) |
| دبوس A3 | VCCIO1 — I/O bank 1 supply (1.5/1.8/2.5/3.3 V) |
| دبوس A4 | I/O — User I/O pin (Bank 1) |
| دبوس A5 | I/O — User I/O pin (Bank 1) |
| دبوس A6 | GND — Ground |
| دبوس A7 | I/O — User I/O pin (Bank 1) |
| دبوس A8 | I/O — User I/O pin (Bank 1) |
| دبوس B1 | GND — Ground |
| دبوس B2 | I/O — User I/O pin (Bank 1) |
| دبوس B3 | I/O — User I/O pin (Bank 1) |
| دبوس B4 | VCCINT — Core supply 1.8 V |
| دبوس B5 | I/O — User I/O pin (Bank 1) |
| دبوس B6 | I/O — User I/O pin (Bank 1) |
| دبوس B7 | GND — Ground |
| دبوس B8 | I/O — User I/O pin (Bank 1) |
| دبوس C1 | I/O — User I/O pin (Bank 2) |
| دبوس C2 | I/O — User I/O pin (Bank 2) |
| دبوس C3 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| دبوس C4 | I/O — User I/O pin (Bank 2) |
| دبوس C5 | I/O — User I/O pin (Bank 2) |
| دبوس C6 | TCK — JTAG test clock input |
| دبوس C7 | I/O — User I/O pin (Bank 1) |
| دبوس C8 | I/O — User I/O pin (Bank 1) |
| دبوس D1 | I/O — User I/O pin (Bank 2) |
| دبوس D2 | GND — Ground |
| دبوس D3 | I/O — User I/O pin (Bank 2) |
| دبوس D4 | VCCINT — Core supply 1.8 V |
| دبوس D5 | I/O — User I/O pin (Bank 2) |
| دبوس D6 | TMS — JTAG test mode select input |
| دبوس D7 | I/O — User I/O pin (Bank 1) |
| دبوس D8 | GND — Ground |
| دبوس E1 | I/O — User I/O pin (Bank 2) |
| دبوس E2 | I/O — User I/O pin (Bank 2) |
| دبوس E3 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| دبوس E4 | I/O — User I/O pin (Bank 2) |
| دبوس E5 | I/O — User I/O pin (Bank 2) |
| دبوس E6 | TDO — JTAG test data output |
| دبوس E7 | I/O — User I/O pin (Bank 1) |
| دبوس E8 | I/O — User I/O pin (Bank 1) |
| دبوس F1 | I/O — User I/O pin (Bank 2) |
| دبوس F2 | GND — Ground |
| دبوس F3 | I/O — User I/O pin (Bank 2) |
| دبوس F4 | VCCINT — Core supply 1.8 V |
| دبوس F5 | I/O — User I/O pin (Bank 2) |
| دبوس F6 | TDI — JTAG test data input |
| دبوس F7 | I/O — User I/O pin (Bank 1) |
| دبوس F8 | GND — Ground |
| دبوس G1 | I/O — User I/O pin (Bank 2) |
| دبوس G2 | I/O — User I/O pin (Bank 2) |
| دبوس G3 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| دبوس G4 | I/O — User I/O pin (Bank 2) |
| دبوس G5 | I/O — User I/O pin (Bank 2) |
| دبوس G6 | NC — Not connected (per datasheet) |
| دبوس G7 | I/O — User I/O pin (Bank 1) |
| دبوس G8 | I/O — User I/O pin (Bank 1) |
| دبوس H1 | I/O — User I/O pin (Bank 2) |
| دبوس H2 | GND — Ground |
| دبوس H3 | I/O — User I/O pin (Bank 2) |
| دبوس H4 | VCCINT — Core supply 1.8 V |
| دبوس H5 | I/O — User I/O pin (Bank 2) |
| دبوس H6 | I/O — User I/O pin (Bank 1) |
| دبوس H7 | I/O — User I/O pin (Bank 1) |
| دبوس H8 | GND — Ground |
| دبوس J1 | I/O — User I/O pin (Bank 2) |
| دبوس J2 | I/O — User I/O pin (Bank 2) |
| دبوس J3 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| دبوس J4 | I/O — User I/O pin (Bank 2) |
| دبوس J5 | I/O — User I/O pin (Bank 2) |
| دبوس J6 | I/O — User I/O pin (Bank 1) |
| دبوس J7 | I/O — User I/O pin (Bank 1) |
| دبوس J8 | I/O — User I/O pin (Bank 1) |
| دبوس K1 | I/O — User I/O pin (Bank 2) |
| دبوس K2 | GND — Ground |
| دبوس K3 | I/O — User I/O pin (Bank 2) |
| دبوس K4 | VCCINT — Core supply 1.8 V |
| دبوس K5 | I/O — User I/O pin (Bank 2) |
| دبوس K6 | I/O — User I/O pin (Bank 1) |
| دبوس K7 | GND — Ground |
| دبوس K8 | I/O — User I/O pin (Bank 1) |
| دبوس L1 | I/O — User I/O pin (Bank 2) |
| دبوس L2 | I/O — User I/O pin (Bank 2) |
| دبوس L3 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| دبوس L4 | I/O — User I/O pin (Bank 2) |
| دبوس L5 | I/O — User I/O pin (Bank 2) |
| دبوس L6 | I/O — User I/O pin (Bank 1) |
| دبوس L7 | I/O — User I/O pin (Bank 1) |
| دبوس L8 | I/O — User I/O pin (Bank 1) |
| دبوس M1 | I/O — User I/O pin (Bank 3) |
| دبوس M2 | GND — Ground |
| دبوس M3 | I/O — User I/O pin (Bank 3) |
| دبوس M4 | VCCINT — Core supply 1.8 V |
| دبوس M5 | I/O — User I/O pin (Bank 3) |
| دبوس M6 | I/O — User I/O pin (Bank 1) |
| دبوس M7 | GND — Ground |
| دبوس M8 | I/O — User I/O pin (Bank 1) |
| دبوس N1 | I/O — User I/O pin (Bank 3) |
| دبوس N2 | I/O — User I/O pin (Bank 3) |
| دبوس N3 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| دبوس N4 | I/O — User I/O pin (Bank 3) |
| دبوس N5 | I/O — User I/O pin (Bank 3) |
| دبوس N6 | I/O — User I/O pin (Bank 1) |
| دبوس N7 | I/O — User I/O pin (Bank 1) |
| دبوس N8 | I/O — User I/O pin (Bank 1) |
| دبوس P1 | I/O — User I/O pin (Bank 3) |
| دبوس P2 | GND — Ground |
| دبوس P3 | I/O — User I/O pin (Bank 3) |
| دبوس P4 | VCCINT — Core supply 1.8 V |
| دبوس P5 | I/O — User I/O pin (Bank 3) |
| دبوس P6 | I/O — User I/O pin (Bank 1) |
| دبوس P7 | GND — Ground |
| دبوس P8 | I/O — User I/O pin (Bank 1) |
| دبوس R1 | I/O — User I/O pin (Bank 3) |
| دبوس R2 | I/O — User I/O pin (Bank 3) |
| دبوس R3 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| دبوس R4 | I/O — User I/O pin (Bank 3) |
| دبوس R5 | I/O — User I/O pin (Bank 3) |
| دبوس R6 | I/O — User I/O pin (Bank 1) |
| دبوس R7 | I/O — User I/O pin (Bank 1) |
| دبوس R8 | I/O — User I/O pin (Bank 1) |
| دبوس T1 | I/O — User I/O pin (Bank 3) |
| دبوس T2 | GND — Ground |
| دبوس T3 | I/O — User I/O pin (Bank 3) |
| دبوس T4 | VCCINT — Core supply 1.8 V |
| دبوس T5 | I/O — User I/O pin (Bank 3) |
| دبوس T6 | I/O — User I/O pin (Bank 1) |
| دبوس T7 | GND — Ground |
| دبوس T8 | I/O — User I/O pin (Bank 1) |
| دبوس U1 | I/O — User I/O pin (Bank 3) |
| دبوس U2 | I/O — User I/O pin (Bank 3) |
| دبوس U3 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| دبوس U4 | I/O — User I/O pin (Bank 3) |
| دبوس U5 | I/O — User I/O pin (Bank 3) |
| دبوس U6 | I/O — User I/O pin (Bank 4) |
| دبوس U7 | I/O — User I/O pin (Bank 4) |
| دبوس U8 | I/O — User I/O pin (Bank 4) |
| دبوس V1 | I/O — User I/O pin (Bank 3) |
| دبوس V2 | GND — Ground |
| دبوس V3 | I/O — User I/O pin (Bank 3) |
| دبوس V4 | VCCINT — Core supply 1.8 V |
| دبوس V5 | I/O — User I/O pin (Bank 3) |
| دبوس V6 | I/O — User I/O pin (Bank 4) |
| دبوس V7 | GND — Ground |
| دبوس V8 | I/O — User I/O pin (Bank 4) |
| دبوس W1 | I/O — User I/O pin (Bank 3) |
| دبوس W2 | I/O — User I/O pin (Bank 3) |
| دبوس W3 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| دبوس W4 | I/O — User I/O pin (Bank 3) |
| دبوس W5 | I/O — User I/O pin (Bank 3) |
| دبوس W6 | I/O — User I/O pin (Bank 4) |
| دبوس W7 | I/O — User I/O pin (Bank 4) |
| دبوس W8 | I/O — User I/O pin (Bank 4) |
| دبوس Y1 | I/O — User I/O pin (Bank 3) |
| دبوس Y2 | GND — Ground |
| دبوس Y3 | I/O — User I/O pin (Bank 3) |
| دبوس Y4 | VCCINT — Core supply 1.8 V |
| دبوس Y5 | I/O — User I/O pin (Bank 3) |
| دبوس Y6 | I/O — User I/O pin (Bank 4) |
| دبوس Y7 | GND — Ground |
| دبوس Y8 | VCCIO4 — I/O bank 4 supply (1.5/1.8/2.5/3.3 V) |
| دبوس AA1 | I/O — User I/O pin (Bank 3) |
| دبوس AA2 | I/O — User I/O pin (Bank 3) |
| دبوس AA3 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| دبوس AA4 | I/O — User I/O pin (Bank 3) |
| دبوس AA5 | I/O — User I/O pin (Bank 3) |
| دبوس AA6 | I/O — User I/O pin (Bank 4) |
| دبوس AA7 | I/O — User I/O pin (Bank 4) |
| دبوس AA8 | I/O — User I/O pin (Bank 4) |
| دبوس AB1 | GND — Ground |
| دبوس AB2 | I/O — User I/O pin (Bank 3) |
| دبوس AB3 | I/O — User I/O pin (Bank 3) |
| دبوس AB4 | VCCINT — Core supply 1.8 V |
| دبوس AB5 | I/O — User I/O pin (Bank 3) |
| دبوس AB6 | I/O — User I/O pin (Bank 4) |
| دبوس AB7 | GND — Ground |
| دبوس AB8 | I/O — User I/O pin (Bank 4) |
التطبيقات النموذجية
5M2210ZF256C4N مناسب لـ 6 التطبيقs: Multi-Rail Power Supply Sequencing, Bus Interface Bridging (PCI / Local Bus), Microcontroller I/O Expansion, FPGA Configuration & Control Companion, Industrial Glue Logic & Protocol Conversion, Consumer Set-Top Box & Home Gateway Logic.
Multi-Rail Power Supply Sequencing
The 5M2210ZF256C4N's four independent VCCIO banks, instant-on flash configuration, and 160 user I/O pins make it an ideal power-supply sequencing controller for multi-rail systems. Each of the four VCCIO banks can be powered at 1.5 V, 1.8 V, 2.5 V, or 3.3 V, allowing direct logic-level interface to enable pins of DC-DC converters and LDOs without external level shifters. The MAX V internal flash eliminates the boot PROM required by older MAX II designs, simplifying the BOM. The 5M2210ZF256C4N's typical tPD of ~4 ns (C4 speed grade) is more than adequate for sequenced enable signals in the millisecond regime, while the 1.8 V VCCINT core minimizes quiescent power. Compared to discrete sequencer ICs, this CPLD adds flexibility to reprogram turn-on/off order via JTAG without PCB rework.
موصى به
Bus Interface Bridging (PCI / Local Bus)
The 5M2210ZF256C4N provides 160 user I/O and 1700 Logic Elements, sufficient to bridge legacy 32-bit PCI buses to local processor buses in industrial and embedded designs. Its 3.3 V VCCIO bank support directly interfaces 5 V tolerant I/O when the bank is biased below 3.3 V, eliminating external level shifters. The 5M2210ZF256C4N's 4 ns tPD (C4 speed grade) comfortably meets PCI 33 MHz bus timing with adequate margin for address decode and wait-state insertion. The internal flash configuration enables in-field firmware updates via JTAG, useful for fixing bus-timing bugs without board replacement. Compared to discrete glue-logic ICs, this CPLD consolidates 5-10 TTL packages into a single BGA, saving PCB area and BOM cost.
موصى به
Microcontroller I/O Expansion
The 5M2210ZF256C4N expands I/O capacity for microcontrollers and ASICs that lack sufficient pins, exposing up to 160 user I/O and connecting via SPI, I2C, or parallel sideband interfaces. The 1.8 V VCCINT core plus four VCCIO banks support modern SoCs running at 1.8 V while driving 3.3 V peripherals in the same design. The 5M2210ZF256C4N's flash-based instant-on (<1 ms) configuration avoids the boot latency of SRAM-based FPGA expansion solutions. With 1700 LEs, it can implement shift registers, PWM generators, encoder/decoders, and custom serial protocols in addition to raw I/O expansion. The FBGA-256 package suits space-constrained designs where 160 I/O are needed in a small footprint.
موصى به
FPGA Configuration & Control Companion
The 5M2210ZF256C4N serves as a low-cost configuration and control companion to higher-density SRAM-based FPGAs such as Altera Cyclone V or Xilinx Artix-7 in the same system. Its flash-based instant-on operation (<1 ms) can hold the main FPGA in reset, generate proper power-good signals, and sequence supply rails before releasing the FPGA reset pin. The 160 user I/O of the 5M2210ZF256C4N provide ample bandwidth for SPI/parallel configuration loading, status monitoring, and sideband control signals. Compared to a discrete CPLD+FPGA architecture with separate boot PROMs, the MAX V flash integrates the configuration memory on-die, reducing BOM and board area.
موصى به
Industrial Glue Logic & Protocol Conversion
The 5M2210ZF256C4N consolidates 5-10 discrete 74-series TTL/CMOS glue-logic packages into a single FBGA-256 device, simplifying PCB layout in industrial controllers, motor drives, and PLCs. With 1700 LEs, it can implement UART, SPI, I2C, parallel-to-serial conversion, encoder interfaces, and watchdog timers in a single chip. The commercial 0C to 85C operating range suits most indoor industrial enclosures, while the 5M2210ZF256I5N variant extends to industrial -40C to 100C for outdoor/harsh environments. The 4 VCCIO banks enable direct interface to 1.8 V SoCs, 2.5 V DSPs, 3.3 V sensors, and 5 V tolerant legacy signals within the same design.
موصى به
Consumer Set-Top Box & Home Gateway Logic
The 5M2210ZF256C4N delivers cost-optimized glue logic, I/O expansion, and LED-driving capability for consumer set-top boxes, home gateways, and smart-home hubs. Its 160 user I/O drive front-panel buttons, LED status indicators, IR receivers, and HDMI CEC sideband signals without external mux ICs. The flash-based instant-on (<1 ms) configuration avoids visible boot delays for always-on consumer devices. Compared to MCUs in similar roles, the 5M2210ZF256C4N offers deterministic pin-to-pin logic with no firmware interrupt latency, ideal for real-time LED multiplexing and IR decoding. The FBGA-256 footprint suits compact consumer electronics form factors.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ 5M2210ZF256C4N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | 5M2210ZF256C5N | 5M2210ZF256I5N | EPM570GF256C4N | 5CEFA7F27C6N |
|---|---|---|---|---|---|
| Package | FBGA-256 | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 1700 LEs | 1700 LEs (same) | 1700 LEs (same) | 570 LEs (-66%) | 77000 LEs (FPGA, not CPLD) |
| Device Family | MAX V CPLD | MAX V CPLD (same) | MAX V CPLD (same) | MAX II CPLD (older) | Cyclone V FPGA (not CPLD) |
| Speed Grade | C4 (~4 ns tPD) | C5 (faster, ~3 ns) | I5 (faster, industrial) | C4 (same) | C6 (FPGA speed grade) |
| Operating Temperature | 0C to 85C (Commercial) | 0C to 85C (Commercial) | -40C to 100C (Industrial) | 0C to 85C (Commercial) | -40C to 100C (Industrial) |
| User I/O Pins | 160 | 160 (same) | 160 (same) | 160 (same) | 144 (different pin map) |
| Core Voltage | 1.8 V | 1.8 V (same) | 1.8 V (same) | 1.8 V (same) | 1.1 V (different) |
| Configuration | Internal flash (instant-on) | Internal flash (same) | Internal flash (same) | Internal flash (same) | SRAM (external flash needed) |
أبرز الفروقات
- Internal flash configuration - no boot PROM needed (مقابل5CEFA7F27C6N (Cyclone V FPGA))
- 1700 LEs vs 570 LEs for higher logic density in same footprint (مقابلEPM570GF256C4N (MAX II))
- Deterministic pin-to-pin logic with no firmware overhead (مقابل5CEFA7F27C6N (Cyclone V FPGA))
ملاحظات التصميم
Estimated: at typical 1.8 V VCCINT plus four 3.3 V VCCIO banks each supplying ~20 mA of I/O current, the 5M2210ZF256C4N consumes approximately 50-150 mA quiescent current (depending on logic utilization). Per the Intel MAX V family datasheet, decouple each VCCINT ball with a 0.1 uF ceramic capacitor placed within 5 mm of the ball, and add one bulk 10 uF tantalum or ceramic capacitor per VCCIO bank. Sequence VCCINT before VCCIO to prevent I/O latch-up during power-up.
The FBGA-256 package has a 17x17 ball grid at 1.0 mm pitch and requires 4-6 layer PCB with microvia stackups (any-layer HDI preferred for breakout). Per the Intel MAX V hardware design guide, route all VCCINT and VCCIO traces with at least 0.2 mm width, use a continuous ground plane on layer 2 directly beneath the BGA, and provide at least 4 ground balls per VCCIO bank to minimize ground bounce. BGA assembly requires X-ray inspection; do not attempt hand-rework.
Avoid leaving unused user I/O pins floating - per the Intel MAX V datasheet, configure them as outputs driving a defined logic level or as outputs driving low to minimize in-rush current during power-up. Do not exceed the maximum VCCIO-to-VCCINT voltage differential of 2.5 V during hot-plug events. Always program the JTAG IDCODE register before relying on JTAG chain integrity checks.
معلومات الامتثال
RoHS compliant per Intel/Altera product page; 'N' suffix indicates Pb-free ball finish. Not AEC-Q100 qualified - for automotive applications consult Intel automotive-grade CPLD variants. Halogen-free status not explicitly stated in product page.
