5M2210ZF256C4N - MAX V CPLD, 1700 LE, FBGA-256, C4 Speed | Intel / Altera
MPN: 5M2210ZF256C4N ✓ فعال5M2210ZF256C4N جائزہ
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple SPLDs/GALs and higher-density FPGAs in the programmable logic hierarchy (CPLD -> PLD -> programmable logic -> digital IC). MAX V CPLDs are built on a 0.30 um 6-metal-layer CMOS process with a flash-based configuration cell, providing instant-on operation in less than 1 ms without an external boot PROM. They are used as glue logic, I/O expansion, interface bridging, and power-sequencing controllers in industrial, communications, and consumer systems. Unlike SRAM-based FPGAs that require external configuration memory, MAX V devices self-configure at power-up from internal flash.
Key features of the 5M2210ZF256C4N include 1700 LEs arranged in 221 Logic Array Blocks (LABs), 160 user I/O pins available in this FBGA-256 outline, a 1.8 V core supply (VCCINT) with multi-voltage I/O bank support (1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL), and an internal oscillator plus JTAG (IEEE 1149.1) and IEEE 1532 in-system programmability. Typical tPD pin-to-pin delay is in the 4 ns class for speed grade 4, suitable for control-path rather than high-speed datapath applications. The device supports live insertion and 5 V tolerant I/O when the bank VCCIO is set below 3.3 V.
The device integrates the JTAG controller, internal voltage regulator, and configuration flash memory on-die, eliminating the external programming PROM required by legacy MAX and MAX II CPLDs. It also provides four user I/O banks for flexible mixed-voltage interfacing, allowing direct connection to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without external level shifters.
Typical applications include bus interface bridging (e.g. PCI to local bus), I/O expansion for microcontrollers and ASICs, power-supply sequencing in multi-rail systems, configuration/control for companion FPGAs, and glue logic in industrial controllers and consumer set-top boxes. The FBGA-256 package and high I/O count make it suitable for high-density board-level integration.
When designing with this part, route all four VCCIO bank supplies and at least one VCCINT (1.8 V) supply with adequate decoupling (0.1 uF + bulk); unused I/O pins should be left floating or driven to a defined logic level to minimize in-rush during power-up. The 256-ball FBGA requires X-ray or BGA rework equipment for prototype bring-up, so allocate 2-3 days for first-article assembly.
This page synthesizes distributor pricing, drop-in MAX V family alternatives, BGA-256 pinout, and recommended design patterns not found in the bare manufacturer datasheet.
کے لیے ڈراپ اِن متبادل 5M2210ZF256C4N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں 5M2210ZF256C4N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Operating Temperature, Programming Interface, Speed Grade, Family.
5M2210ZF256C5N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →5M2210ZF256I5N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →5M2210ZF256C4N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPM570GF256C4N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →5CEFA7F27C6N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →5M2210ZF256C4N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | MAX V |
| Device | 5M2210Z |
| Logic Elements (LEs) | 1700 |
| Logic Array Blocks (LABs) | 221 |
| User Flash Memory | 8192 bits |
| Internal RAM | 212 Kbits |
| Maximum User I/O (family) | 203 |
| User I/O (this package) | 160 |
| پیکیج | FBGA-256 (FineLine BGA) |
| آپریٹنگ درجہ حرارت | 0C to 85C (Commercial) |
| Speed Grade | C4 (tPD ~4 ns class) |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Bank Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Number of I/O Banks | 4 |
| Programming Interface | JTAG (IEEE 1149.1) / IEEE 1532 ISP |
| Configuration Method | Internal flash (instant-on < 1 ms) |
| Process Technology | 0.30 um 6-metal-layer CMOS |
| RoHS اسٹیٹس | Compliant (Pb-free ball finish) |
5M2210ZF256C4N پن کنفیگریشن
| پن A1 | I/O — User I/O pin (Bank 1) |
| پن A2 | I/O — User I/O pin (Bank 1) |
| پن A3 | VCCIO1 — I/O bank 1 supply (1.5/1.8/2.5/3.3 V) |
| پن A4 | I/O — User I/O pin (Bank 1) |
| پن A5 | I/O — User I/O pin (Bank 1) |
| پن A6 | GND — Ground |
| پن A7 | I/O — User I/O pin (Bank 1) |
| پن A8 | I/O — User I/O pin (Bank 1) |
| پن B1 | GND — Ground |
| پن B2 | I/O — User I/O pin (Bank 1) |
| پن B3 | I/O — User I/O pin (Bank 1) |
| پن B4 | VCCINT — Core supply 1.8 V |
| پن B5 | I/O — User I/O pin (Bank 1) |
| پن B6 | I/O — User I/O pin (Bank 1) |
| پن B7 | GND — Ground |
| پن B8 | I/O — User I/O pin (Bank 1) |
| پن C1 | I/O — User I/O pin (Bank 2) |
| پن C2 | I/O — User I/O pin (Bank 2) |
| پن C3 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| پن C4 | I/O — User I/O pin (Bank 2) |
| پن C5 | I/O — User I/O pin (Bank 2) |
| پن C6 | TCK — JTAG test clock input |
| پن C7 | I/O — User I/O pin (Bank 1) |
| پن C8 | I/O — User I/O pin (Bank 1) |
| پن D1 | I/O — User I/O pin (Bank 2) |
| پن D2 | GND — Ground |
| پن D3 | I/O — User I/O pin (Bank 2) |
| پن D4 | VCCINT — Core supply 1.8 V |
| پن D5 | I/O — User I/O pin (Bank 2) |
| پن D6 | TMS — JTAG test mode select input |
| پن D7 | I/O — User I/O pin (Bank 1) |
| پن D8 | GND — Ground |
| پن E1 | I/O — User I/O pin (Bank 2) |
| پن E2 | I/O — User I/O pin (Bank 2) |
| پن E3 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| پن E4 | I/O — User I/O pin (Bank 2) |
| پن E5 | I/O — User I/O pin (Bank 2) |
| پن E6 | TDO — JTAG test data output |
| پن E7 | I/O — User I/O pin (Bank 1) |
| پن E8 | I/O — User I/O pin (Bank 1) |
| پن F1 | I/O — User I/O pin (Bank 2) |
| پن F2 | GND — Ground |
| پن F3 | I/O — User I/O pin (Bank 2) |
| پن F4 | VCCINT — Core supply 1.8 V |
| پن F5 | I/O — User I/O pin (Bank 2) |
| پن F6 | TDI — JTAG test data input |
| پن F7 | I/O — User I/O pin (Bank 1) |
| پن F8 | GND — Ground |
| پن G1 | I/O — User I/O pin (Bank 2) |
| پن G2 | I/O — User I/O pin (Bank 2) |
| پن G3 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| پن G4 | I/O — User I/O pin (Bank 2) |
| پن G5 | I/O — User I/O pin (Bank 2) |
| پن G6 | NC — Not connected (per datasheet) |
| پن G7 | I/O — User I/O pin (Bank 1) |
| پن G8 | I/O — User I/O pin (Bank 1) |
| پن H1 | I/O — User I/O pin (Bank 2) |
| پن H2 | GND — Ground |
| پن H3 | I/O — User I/O pin (Bank 2) |
| پن H4 | VCCINT — Core supply 1.8 V |
| پن H5 | I/O — User I/O pin (Bank 2) |
| پن H6 | I/O — User I/O pin (Bank 1) |
| پن H7 | I/O — User I/O pin (Bank 1) |
| پن H8 | GND — Ground |
| پن J1 | I/O — User I/O pin (Bank 2) |
| پن J2 | I/O — User I/O pin (Bank 2) |
| پن J3 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| پن J4 | I/O — User I/O pin (Bank 2) |
| پن J5 | I/O — User I/O pin (Bank 2) |
| پن J6 | I/O — User I/O pin (Bank 1) |
| پن J7 | I/O — User I/O pin (Bank 1) |
| پن J8 | I/O — User I/O pin (Bank 1) |
| پن K1 | I/O — User I/O pin (Bank 2) |
| پن K2 | GND — Ground |
| پن K3 | I/O — User I/O pin (Bank 2) |
| پن K4 | VCCINT — Core supply 1.8 V |
| پن K5 | I/O — User I/O pin (Bank 2) |
| پن K6 | I/O — User I/O pin (Bank 1) |
| پن K7 | GND — Ground |
| پن K8 | I/O — User I/O pin (Bank 1) |
| پن L1 | I/O — User I/O pin (Bank 2) |
| پن L2 | I/O — User I/O pin (Bank 2) |
| پن L3 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| پن L4 | I/O — User I/O pin (Bank 2) |
| پن L5 | I/O — User I/O pin (Bank 2) |
| پن L6 | I/O — User I/O pin (Bank 1) |
| پن L7 | I/O — User I/O pin (Bank 1) |
| پن L8 | I/O — User I/O pin (Bank 1) |
| پن M1 | I/O — User I/O pin (Bank 3) |
| پن M2 | GND — Ground |
| پن M3 | I/O — User I/O pin (Bank 3) |
| پن M4 | VCCINT — Core supply 1.8 V |
| پن M5 | I/O — User I/O pin (Bank 3) |
| پن M6 | I/O — User I/O pin (Bank 1) |
| پن M7 | GND — Ground |
| پن M8 | I/O — User I/O pin (Bank 1) |
| پن N1 | I/O — User I/O pin (Bank 3) |
| پن N2 | I/O — User I/O pin (Bank 3) |
| پن N3 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| پن N4 | I/O — User I/O pin (Bank 3) |
| پن N5 | I/O — User I/O pin (Bank 3) |
| پن N6 | I/O — User I/O pin (Bank 1) |
| پن N7 | I/O — User I/O pin (Bank 1) |
| پن N8 | I/O — User I/O pin (Bank 1) |
| پن P1 | I/O — User I/O pin (Bank 3) |
| پن P2 | GND — Ground |
| پن P3 | I/O — User I/O pin (Bank 3) |
| پن P4 | VCCINT — Core supply 1.8 V |
| پن P5 | I/O — User I/O pin (Bank 3) |
| پن P6 | I/O — User I/O pin (Bank 1) |
| پن P7 | GND — Ground |
| پن P8 | I/O — User I/O pin (Bank 1) |
| پن R1 | I/O — User I/O pin (Bank 3) |
| پن R2 | I/O — User I/O pin (Bank 3) |
| پن R3 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| پن R4 | I/O — User I/O pin (Bank 3) |
| پن R5 | I/O — User I/O pin (Bank 3) |
| پن R6 | I/O — User I/O pin (Bank 1) |
| پن R7 | I/O — User I/O pin (Bank 1) |
| پن R8 | I/O — User I/O pin (Bank 1) |
| پن T1 | I/O — User I/O pin (Bank 3) |
| پن T2 | GND — Ground |
| پن T3 | I/O — User I/O pin (Bank 3) |
| پن T4 | VCCINT — Core supply 1.8 V |
| پن T5 | I/O — User I/O pin (Bank 3) |
| پن T6 | I/O — User I/O pin (Bank 1) |
| پن T7 | GND — Ground |
| پن T8 | I/O — User I/O pin (Bank 1) |
| پن U1 | I/O — User I/O pin (Bank 3) |
| پن U2 | I/O — User I/O pin (Bank 3) |
| پن U3 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| پن U4 | I/O — User I/O pin (Bank 3) |
| پن U5 | I/O — User I/O pin (Bank 3) |
| پن U6 | I/O — User I/O pin (Bank 4) |
| پن U7 | I/O — User I/O pin (Bank 4) |
| پن U8 | I/O — User I/O pin (Bank 4) |
| پن V1 | I/O — User I/O pin (Bank 3) |
| پن V2 | GND — Ground |
| پن V3 | I/O — User I/O pin (Bank 3) |
| پن V4 | VCCINT — Core supply 1.8 V |
| پن V5 | I/O — User I/O pin (Bank 3) |
| پن V6 | I/O — User I/O pin (Bank 4) |
| پن V7 | GND — Ground |
| پن V8 | I/O — User I/O pin (Bank 4) |
| پن W1 | I/O — User I/O pin (Bank 3) |
| پن W2 | I/O — User I/O pin (Bank 3) |
| پن W3 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| پن W4 | I/O — User I/O pin (Bank 3) |
| پن W5 | I/O — User I/O pin (Bank 3) |
| پن W6 | I/O — User I/O pin (Bank 4) |
| پن W7 | I/O — User I/O pin (Bank 4) |
| پن W8 | I/O — User I/O pin (Bank 4) |
| پن Y1 | I/O — User I/O pin (Bank 3) |
| پن Y2 | GND — Ground |
| پن Y3 | I/O — User I/O pin (Bank 3) |
| پن Y4 | VCCINT — Core supply 1.8 V |
| پن Y5 | I/O — User I/O pin (Bank 3) |
| پن Y6 | I/O — User I/O pin (Bank 4) |
| پن Y7 | GND — Ground |
| پن Y8 | VCCIO4 — I/O bank 4 supply (1.5/1.8/2.5/3.3 V) |
| پن AA1 | I/O — User I/O pin (Bank 3) |
| پن AA2 | I/O — User I/O pin (Bank 3) |
| پن AA3 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| پن AA4 | I/O — User I/O pin (Bank 3) |
| پن AA5 | I/O — User I/O pin (Bank 3) |
| پن AA6 | I/O — User I/O pin (Bank 4) |
| پن AA7 | I/O — User I/O pin (Bank 4) |
| پن AA8 | I/O — User I/O pin (Bank 4) |
| پن AB1 | GND — Ground |
| پن AB2 | I/O — User I/O pin (Bank 3) |
| پن AB3 | I/O — User I/O pin (Bank 3) |
| پن AB4 | VCCINT — Core supply 1.8 V |
| پن AB5 | I/O — User I/O pin (Bank 3) |
| پن AB6 | I/O — User I/O pin (Bank 4) |
| پن AB7 | GND — Ground |
| پن AB8 | I/O — User I/O pin (Bank 4) |
عام استعمالات
5M2210ZF256C4N کے لیے موزوں ہے 6 ایپلیکیشنs: Multi-Rail Power Supply Sequencing, Bus Interface Bridging (PCI / Local Bus), Microcontroller I/O Expansion, FPGA Configuration & Control Companion, Industrial Glue Logic & Protocol Conversion, Consumer Set-Top Box & Home Gateway Logic.
Multi-Rail Power Supply Sequencing
The 5M2210ZF256C4N's four independent VCCIO banks, instant-on flash configuration, and 160 user I/O pins make it an ideal power-supply sequencing controller for multi-rail systems. Each of the four VCCIO banks can be powered at 1.5 V, 1.8 V, 2.5 V, or 3.3 V, allowing direct logic-level interface to enable pins of DC-DC converters and LDOs without external level shifters. The MAX V internal flash eliminates the boot PROM required by older MAX II designs, simplifying the BOM. The 5M2210ZF256C4N's typical tPD of ~4 ns (C4 speed grade) is more than adequate for sequenced enable signals in the millisecond regime, while the 1.8 V VCCINT core minimizes quiescent power. Compared to discrete sequencer ICs, this CPLD adds flexibility to reprogram turn-on/off order via JTAG without PCB rework.
تجویز کردہ
Bus Interface Bridging (PCI / Local Bus)
The 5M2210ZF256C4N provides 160 user I/O and 1700 Logic Elements, sufficient to bridge legacy 32-bit PCI buses to local processor buses in industrial and embedded designs. Its 3.3 V VCCIO bank support directly interfaces 5 V tolerant I/O when the bank is biased below 3.3 V, eliminating external level shifters. The 5M2210ZF256C4N's 4 ns tPD (C4 speed grade) comfortably meets PCI 33 MHz bus timing with adequate margin for address decode and wait-state insertion. The internal flash configuration enables in-field firmware updates via JTAG, useful for fixing bus-timing bugs without board replacement. Compared to discrete glue-logic ICs, this CPLD consolidates 5-10 TTL packages into a single BGA, saving PCB area and BOM cost.
تجویز کردہ
Microcontroller I/O Expansion
The 5M2210ZF256C4N expands I/O capacity for microcontrollers and ASICs that lack sufficient pins, exposing up to 160 user I/O and connecting via SPI, I2C, or parallel sideband interfaces. The 1.8 V VCCINT core plus four VCCIO banks support modern SoCs running at 1.8 V while driving 3.3 V peripherals in the same design. The 5M2210ZF256C4N's flash-based instant-on (<1 ms) configuration avoids the boot latency of SRAM-based FPGA expansion solutions. With 1700 LEs, it can implement shift registers, PWM generators, encoder/decoders, and custom serial protocols in addition to raw I/O expansion. The FBGA-256 package suits space-constrained designs where 160 I/O are needed in a small footprint.
تجویز کردہ
FPGA Configuration & Control Companion
The 5M2210ZF256C4N serves as a low-cost configuration and control companion to higher-density SRAM-based FPGAs such as Altera Cyclone V or Xilinx Artix-7 in the same system. Its flash-based instant-on operation (<1 ms) can hold the main FPGA in reset, generate proper power-good signals, and sequence supply rails before releasing the FPGA reset pin. The 160 user I/O of the 5M2210ZF256C4N provide ample bandwidth for SPI/parallel configuration loading, status monitoring, and sideband control signals. Compared to a discrete CPLD+FPGA architecture with separate boot PROMs, the MAX V flash integrates the configuration memory on-die, reducing BOM and board area.
تجویز کردہ
Industrial Glue Logic & Protocol Conversion
The 5M2210ZF256C4N consolidates 5-10 discrete 74-series TTL/CMOS glue-logic packages into a single FBGA-256 device, simplifying PCB layout in industrial controllers, motor drives, and PLCs. With 1700 LEs, it can implement UART, SPI, I2C, parallel-to-serial conversion, encoder interfaces, and watchdog timers in a single chip. The commercial 0C to 85C operating range suits most indoor industrial enclosures, while the 5M2210ZF256I5N variant extends to industrial -40C to 100C for outdoor/harsh environments. The 4 VCCIO banks enable direct interface to 1.8 V SoCs, 2.5 V DSPs, 3.3 V sensors, and 5 V tolerant legacy signals within the same design.
تجویز کردہ
Consumer Set-Top Box & Home Gateway Logic
The 5M2210ZF256C4N delivers cost-optimized glue logic, I/O expansion, and LED-driving capability for consumer set-top boxes, home gateways, and smart-home hubs. Its 160 user I/O drive front-panel buttons, LED status indicators, IR receivers, and HDMI CEC sideband signals without external mux ICs. The flash-based instant-on (<1 ms) configuration avoids visible boot delays for always-on consumer devices. Compared to MCUs in similar roles, the 5M2210ZF256C4N offers deterministic pin-to-pin logic with no firmware interrupt latency, ideal for real-time LED multiplexing and IR decoding. The FBGA-256 footprint suits compact consumer electronics form factors.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا 5M2210ZF256C4N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | 5M2210ZF256C5N | 5M2210ZF256I5N | EPM570GF256C4N | 5CEFA7F27C6N |
|---|---|---|---|---|---|
| Package | FBGA-256 | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 1700 LEs | 1700 LEs (same) | 1700 LEs (same) | 570 LEs (-66%) | 77000 LEs (FPGA, not CPLD) |
| Device Family | MAX V CPLD | MAX V CPLD (same) | MAX V CPLD (same) | MAX II CPLD (older) | Cyclone V FPGA (not CPLD) |
| Speed Grade | C4 (~4 ns tPD) | C5 (faster, ~3 ns) | I5 (faster, industrial) | C4 (same) | C6 (FPGA speed grade) |
| Operating Temperature | 0C to 85C (Commercial) | 0C to 85C (Commercial) | -40C to 100C (Industrial) | 0C to 85C (Commercial) | -40C to 100C (Industrial) |
| User I/O Pins | 160 | 160 (same) | 160 (same) | 160 (same) | 144 (different pin map) |
| Core Voltage | 1.8 V | 1.8 V (same) | 1.8 V (same) | 1.8 V (same) | 1.1 V (different) |
| Configuration | Internal flash (instant-on) | Internal flash (same) | Internal flash (same) | Internal flash (same) | SRAM (external flash needed) |
اہم امتیازی خصوصیات
- Internal flash configuration - no boot PROM needed (بمقابلہ5CEFA7F27C6N (Cyclone V FPGA))
- 1700 LEs vs 570 LEs for higher logic density in same footprint (بمقابلہEPM570GF256C4N (MAX II))
- Deterministic pin-to-pin logic with no firmware overhead (بمقابلہ5CEFA7F27C6N (Cyclone V FPGA))
ڈیزائن نوٹس
Estimated: at typical 1.8 V VCCINT plus four 3.3 V VCCIO banks each supplying ~20 mA of I/O current, the 5M2210ZF256C4N consumes approximately 50-150 mA quiescent current (depending on logic utilization). Per the Intel MAX V family datasheet, decouple each VCCINT ball with a 0.1 uF ceramic capacitor placed within 5 mm of the ball, and add one bulk 10 uF tantalum or ceramic capacitor per VCCIO bank. Sequence VCCINT before VCCIO to prevent I/O latch-up during power-up.
The FBGA-256 package has a 17x17 ball grid at 1.0 mm pitch and requires 4-6 layer PCB with microvia stackups (any-layer HDI preferred for breakout). Per the Intel MAX V hardware design guide, route all VCCINT and VCCIO traces with at least 0.2 mm width, use a continuous ground plane on layer 2 directly beneath the BGA, and provide at least 4 ground balls per VCCIO bank to minimize ground bounce. BGA assembly requires X-ray inspection; do not attempt hand-rework.
Avoid leaving unused user I/O pins floating - per the Intel MAX V datasheet, configure them as outputs driving a defined logic level or as outputs driving low to minimize in-rush current during power-up. Do not exceed the maximum VCCIO-to-VCCINT voltage differential of 2.5 V during hot-plug events. Always program the JTAG IDCODE register before relying on JTAG chain integrity checks.
تعمیل کی معلومات
RoHS compliant per Intel/Altera product page; 'N' suffix indicates Pb-free ball finish. Not AEC-Q100 qualified - for automotive applications consult Intel automotive-grade CPLD variants. Halogen-free status not explicitly stated in product page.
