MC68332GCEH16 - 32-Bit CPU32 MCU 16MHz ROMless 132-PQFP | NXP
MPN: MC68332GCEH16 ⚠ آخر فرصة للشراءMC68332GCEH16 نظرة عامة
A 32-bit microcontroller (MCU) is a microprocessor core with on-chip RAM, ROM/Flash, timers, and communication peripherals integrated on a single die. The MC68332 specifically uses the CPU32 core, an evolution of the Motorola 68000 family, optimized for embedded control. It sits within the broader hierarchy: CPU32 -> M683xx family -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. The part is ROMless, requiring external program memory, which gives designers freedom to select boot code and firmware tailored to the application.
Key features include the CPU32 core at 16 MHz, 2 KB of on-chip RAM, a Time Processing Unit (TPU) for high-resolution timing I/O, a Queued Serial Module (QSM) for queued SPI/UART transactions, and a System Integration Module (SIM) that aggregates chip selects, interrupt control, and bus arbitration. The internal intermodule bus (IMB) connects these standard modules, allowing configuration flexibility. Operating temperature spans -40C to +85C for industrial environments.
The architecture uses modular standard cells interconnected through the intermodule bus (IMB), a hallmark of the M683xx design philosophy. By decoupling peripherals from the core, NXP enables software reuse across family members. The TPU executes microcoded timing algorithms autonomously, offloading the CPU from event timing workloads such as ignition control, motor commutation, and pulse-width measurement. External bus width and wait-state insertion are SIM-controlled, supporting slow program-memory devices.
Typical applications include automotive engine and transmission control, industrial automation controllers, robotic motion controllers, medical instrumentation with deterministic timing needs, and legacy embedded systems originally designed around the Motorola 68000 architecture. The TPU is especially valuable for fuel injection, anti-lock braking, and electronic stability control subsystems.
When designing with this part, ensure proper decoupling near the 5V supply pins, allocate an external program-memory device, and respect the ROMless boot configuration. Migration paths should be evaluated against the MC68332 family variants, since the part is mature and approaching end-of-life per the manufacturer product page.
This page synthesizes distributor pricing, drop-in NXP M68332 family alternatives, application context, and design notes that extend beyond the manufacturer datasheet to support procurement and engineering decisions.
بدائل مباشرة لـ MC68332GCEH16 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MC68332GCEH16 (نفس عامل الشكل والبصمة) — يختلف في Package, Core Processor, Peripherals, Series, Maximum Clock Frequency.
MC68332GMEH16
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC68332ACEH16
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MC68332AVEH16
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MC68LK332ACEH16
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MC68332GMFC16
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC68332GCEH16 الحدود القصوى والخصائص الكهربائية
| Core | CPU32 (M683xx 32-bit) |
| Bit Width | 32-bit |
| Maximum Clock Speed | 16 MHz |
| Program Memory Size | ROMless |
| RAM Size | 2 KB (2K x 8) |
| Number of I/O | 15 |
| العلبة | 132-BQFP (132-PQFP bumpered, 24.13 x 24.13 mm) |
| نوع التركيب | Surface Mount |
| درجة حرارة التشغيل | -40C to +85C |
| On-chip Peripherals | TPU (Time Processing Unit), QSM (Queued Serial Module), SIM (System Integration Module) |
| Interconnect | Intermodule Bus (IMB) |
| جهد التغذية | 5 V (typical) |
| حالة دورة الحياة | End-of-Life (Last Time Buy per NXP product page) |
تكوين أطراف MC68332GCEH16
| دبوس 1 | A0 — Address bus bit 0 (external memory interface) |
| دبوس 2 | A1 — Address bus bit 1 |
| دبوس 3 | A2 — Address bus bit 2 |
| دبوس 4 | A3 — Address bus bit 3 |
| دبوس 5 | A4 — Address bus bit 4 |
| دبوس 6 | A5 — Address bus bit 5 |
| دبوس 7 | A6 — Address bus bit 6 |
| دبوس 8 | A7 — Address bus bit 7 |
| دبوس 9 | A8 — Address bus bit 8 |
| دبوس 10 | A9 — Address bus bit 9 |
| دبوس 11 | A10 — Address bus bit 10 |
| دبوس 12 | A11 — Address bus bit 11 |
| دبوس 13 | A12 — Address bus bit 12 |
| دبوس 14 | A13 — Address bus bit 13 |
| دبوس 15 | A14 — Address bus bit 14 |
| دبوس 16 | A15 — Address bus bit 15 |
| دبوس 17 | A16 — Address bus bit 16 |
| دبوس 18 | A17 — Address bus bit 17 |
| دبوس 19 | A18 — Address bus bit 18 |
| دبوس 20 | A19 — Address bus bit 19 |
| دبوس 21 | A20 — Address bus bit 20 |
| دبوس 22 | A21 — Address bus bit 21 |
| دبوس 23 | A22 — Address bus bit 22 |
| دبوس 24 | A23 — Address bus bit 23 |
| دبوس 25 | D0 — Data bus bit 0 |
| دبوس 26 | D1 — Data bus bit 1 |
| دبوس 27 | D2 — Data bus bit 2 |
| دبوس 28 | D3 — Data bus bit 3 |
| دبوس 29 | D4 — Data bus bit 4 |
| دبوس 30 | D5 — Data bus bit 5 |
| دبوس 31 | D6 — Data bus bit 6 |
| دبوس 32 | D7 — Data bus bit 7 |
| دبوس 33 | D8 — Data bus bit 8 |
| دبوس 34 | D9 — Data bus bit 9 |
| دبوس 35 | D10 — Data bus bit 10 |
| دبوس 36 | D11 — Data bus bit 11 |
| دبوس 37 | D12 — Data bus bit 12 |
| دبوس 38 | D13 — Data bus bit 13 |
| دبوس 39 | D14 — Data bus bit 14 |
| دبوس 40 | D15 — Data bus bit 15 |
| دبوس 41 | TPU_CH0 — TPU channel 0 |
| دبوس 42 | TPU_CH1 — TPU channel 1 |
| دبوس 43 | TPU_CH2 — TPU channel 2 |
| دبوس 44 | TPU_CH3 — TPU channel 3 |
| دبوس 45 | TPU_CH4 — TPU channel 4 |
| دبوس 46 | TPU_CH5 — TPU channel 5 |
| دبوس 47 | TPU_CH6 — TPU channel 6 |
| دبوس 48 | TPU_CH7 — TPU channel 7 |
| دبوس 49 | TPU_CH8 — TPU channel 8 |
| دبوس 50 | TPU_CH9 — TPU channel 9 |
| دبوس 51 | TPU_CH10 — TPU channel 10 |
| دبوس 52 | TPU_CH11 — TPU channel 11 |
| دبوس 53 | TPU_CH12 — TPU channel 12 |
| دبوس 54 | TPU_CH13 — TPU channel 13 |
| دبوس 55 | TPU_CH14 — TPU channel 14 |
| دبوس 56 | TPU_CH15 — TPU channel 15 |
| دبوس 57 | QSM_TX — QSM transmit output |
| دبوس 58 | QSM_RX — QSM receive input |
| دبوس 59 | QSM_SCK — QSM serial clock |
| دبوس 60 | QSM_PCS — QSM peripheral chip select |
| دبوس 61 | CS0 — Chip select 0 (SIM) |
| دبوس 62 | CS1 — Chip select 1 (SIM) |
| دبوس 63 | CS2 — Chip select 2 (SIM) |
| دبوس 64 | CS3 — Chip select 3 (SIM) |
| دبوس 65 | CS4 — Chip select 4 (SIM) |
| دبوس 66 | CS5 — Chip select 5 (SIM) |
| دبوس 67 | CS6 — Chip select 6 (SIM) |
| دبوس 68 | CS7 — Chip select 7 (SIM) |
| دبوس 69 | CS9 — Chip select 9 (SIM) |
| دبوس 70 | CS10 — Chip select 10 (SIM) |
| دبوس 71 | IRQ1 — Interrupt request 1 |
| دبوس 72 | IRQ2 — Interrupt request 2 |
| دبوس 73 | IRQ3 — Interrupt request 3 |
| دبوس 74 | IRQ4 — Interrupt request 4 |
| دبوس 75 | IRQ5 — Interrupt request 5 |
| دبوس 76 | IRQ6 — Interrupt request 6 |
| دبوس 77 | IRQ7 — Interrupt request 7 |
| دبوس 78 | RST — Reset input (active low) |
| دبوس 79 | HALT — Halt input (active low) |
| دبوس 80 | BKPT — Breakpoint / background debug |
| دبوس 81 | DSI — Development serial input |
| دبوس 82 | DSO — Development serial output |
| دبوس 83 | CLKIN — Clock input |
| دبوس 84 | CLKOUT — Clock output |
| دبوس 85 | XTAL — Crystal oscillator pin |
| دبوس 86 | EXTAL — External clock pin |
| دبوس 87 | VCCSYNTH — Synthesizer power (internal use) |
| دبوس 88 | VDDSYNTH — Synthesizer power (internal use) |
| دبوس 89 | IFETCH — Instruction fetch status |
| دبوس 90 | IPIPE — Instruction pipeline status |
| دبوس 91 | AVEC — Autovector request |
| دبوس 92 | BERR — Bus error input |
| دبوس 93 | HALT_CPU — CPU halt status |
| دبوس 94 | R/W — Read/Write control |
| دبوس 95 | AS — Address strobe |
| دبوس 96 | DS — Data strobe |
| دبوس 97 | OE — Output enable |
| دبوس 98 | BG — Bus grant |
| دبوس 99 | BR — Bus request |
| دبوس 100 | BGACK — Bus grant acknowledge |
| دبوس 101 | FC0 — Function code bit 0 |
| دبوس 102 | FC1 — Function code bit 1 |
| دبوس 103 | FC2 — Function code bit 2 |
| دبوس 104 | SIZE0 — Transfer size bit 0 |
| دبوس 105 | SIZE1 — Transfer size bit 1 |
| دبوس 106 | TS — Transfer start |
| دبوس 107 | TA — Transfer acknowledge |
| دبوس 108 | TEA — Transfer error acknowledge |
| دبوس 109 | TCLK — Test clock (factory test) |
| دبوس 110 | TDI — Test data input (factory test) |
| دبوس 111 | TDO — Test data output (factory test) |
| دبوس 112 | TMS — Test mode select (factory test) |
| دبوس 113 | TRST — Test reset (factory test) |
| دبوس 114 | VDD — 5V power supply |
| دبوس 115 | VDD — 5V power supply |
| دبوس 116 | VDD — 5V power supply |
| دبوس 117 | VDD — 5V power supply |
| دبوس 118 | VDD — 5V power supply |
| دبوس 119 | VDD — 5V power supply |
| دبوس 120 | VSS — Ground |
| دبوس 121 | VSS — Ground |
| دبوس 122 | VSS — Ground |
| دبوس 123 | VSS — Ground |
| دبوس 124 | VSS — Ground |
| دبوس 125 | VSS — Ground |
| دبوس 126 | VSTBY — Standby voltage (SRAM) |
| دبوس 127 | MODCLK — Module clock |
| دبوس 128 | TEXP — Timer expire |
| دبوس 129 | T2CLK — TPU clock |
| دبوس 130 | PWM_A — PWM channel A output |
| دبوس 131 | PWM_B — PWM channel B output |
| دبوس 132 | NC — Not connected (per datasheet) |
التطبيقات النموذجية
MC68332GCEH16 مناسب لـ 6 التطبيقs: Automotive Engine Control Unit (ECU), Industrial Motion and Motor Control, Medical Instrumentation Controllers, Robotics and CNC Machine Controllers, Legacy Avionics and Aerospace Subsystems, Industrial PLC and Process Control.
Automotive Engine Control Unit (ECU)
The MC68332GCEH16's CPU32 core at 16 MHz combined with the Time Processing Unit (TPU) made it a workhorse for automotive engine management in the 1990s and 2000s. The TPU autonomously executes microcoded timing routines for fuel injection pulse width, ignition dwell, and crank/cam shaft synchronization, offloading the CPU32 so it can focus on closed-loop control math. With 2 KB of internal SRAM and ROMless external memory, designers could size boot and calibration tables to specific engine families. The SIM provides chip-select generation for multiple external memory banks. While the part is now EOL per the NXP product page, many deployed vehicles still depend on it, making MC68332GCEH16 a critical maintenance and repair component.
موصى به
Industrial Motion and Motor Control
The TPU on the MC68332GCEH16 generates precise PWM waveforms and measures quadrature encoder feedback for servo drives, stepper controllers, and robotic actuators. With 16 MHz CPU32 bandwidth and QSM queued serial transactions, multiple axes can share a single MCU. The intermodule bus (IMB) integrates the TPU, QSM, and SIM so deterministic timing remains predictable even under heavy interrupt load. Designers use the 2 KB SRAM for real-time control loops, while external ROMless memory holds motion profiles and PID parameters. The 132-PQFP industrial-grade temperature range (-40C to +85C) suits factory-floor deployments.
موصى به
Medical Instrumentation Controllers
Deterministic timing and high reliability made the MC68332GCEH16 a fit for medical instrument controllers such as infusion pumps, patient monitors, and laboratory analyzers. The TPU handles precise timing of sensor sampling and actuator drive signals while the CPU32 manages user interface and serial communication via the QSM. With 2 KB internal SRAM and ROMless external memory, designers could implement FDA-compliant firmware with version-traceable boot code. The -40C to +85C industrial temperature range supports clinical and laboratory environments. Note that new medical designs should target modern microcontrollers; MC68332GCEH16 is appropriate only for sustaining legacy equipment.
موصى به
Robotics and CNC Machine Controllers
Multi-axis robotics and CNC machines benefit from the MC68332GCEH16's TPU, which offloads stepper pulse generation and servo-loop timing from the CPU32. The QSM handles queued SPI communications with multi-axis driver boards, while the SIM arbitrates bus access between peripherals. With 16 MHz CPU32 performance and 2 KB internal SRAM, the MCU can coordinate three to six axes in a single chip, eliminating distributed-controller complexity. External ROMless memory stores G-code interpreters and toolpath tables. The 132-PQFP package provides robust mechanical mounting for vibration-prone factory environments.
موصى به
Legacy Avionics and Aerospace Subsystems
Long-lifecycle aerospace and avionics subsystems continue to deploy the MC68332GCEH16 because its deterministic interrupt latency, radiation-tolerant packaging options, and proven reliability match DO-178 and MIL-spec workflows. The TPU's autonomous timing handles actuator drive and sensor sampling in flight control surfaces, while the CPU32 manages serial databus protocols via QSM. The -40C to +85C operating range spans avionics bay temperatures. Because redesign certification costs are prohibitive, EOL inventory and lifetime buys are common for these systems.
موصى به
Industrial PLC and Process Control
Programmable logic controllers (PLCs) and process-control systems historically used the MC68332GCEH16 for deterministic scan-time execution and digital I/O handling. The 15 I/O pins combined with SIM-managed chip selects allow expansion to hundreds of I/O points via external shift registers. The QSM provides reliable isolated serial links to remote I/O racks, while the TPU handles high-speed pulse counting for flow meters and encoders. With 2 KB SRAM and external ROMless memory, ladder-logic interpreters and process recipes fit comfortably. The mature toolchain and widespread engineering familiarity keep the part in service.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MC68332GCEH16 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MC68332GMEH16 | MC68332ACEH16 | MC68332AVEH16 | MC68LK332ACEH16 | MC68332GMFC16 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 132-PQFP (24.13x24.13) | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same |
| Core | CPU32 (M683xx) | CPU32 (M683xx) - same | CPU32 (M683xx) - same | CPU32 (M683xx) - same | CPU32 (M683xx) - same | CPU32 (M683xx) - same |
| Clock Speed | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
| Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| RAM Size | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB (low-power variant) | 2 KB |
| TPU Channels | 16 | 16 | 16 | 16 | 16 | 16 |
| Lifecycle Status | End-of-Life | End-of-Life | End-of-Life | End-of-Life | End-of-Life | End-of-Life |
أبرز الفروقات
- Time Processing Unit (TPU) with 16 dedicated channels (مقابلMC68332AVEH16)
- Queued Serial Module (QSM) for high-throughput serial I/O (مقابلMC68332ACEH16)
- Mature NXP M68332 family tooling and software ecosystem (مقابلMC68LK332ACEH16)
ملاحظات التصميم
The MC68332GCEH16 requires a stable 5V supply with decoupling capacitors placed as close as possible to each VDD/VSS pin pair. Estimated: with 132-PQFP package and 6 VDD pins plus 6 VSS pins, place one 100 nF ceramic and one 10 uF tantalum bulk capacitor per supply pair. The standby voltage pin (VSTBY) must remain powered if SRAM retention is required during power-down. Add a reset supervisor to ensure clean startup, since the ROMless configuration depends on a valid external program memory fetch at reset.
Route the 24-bit address bus and 16-bit data bus with matched trace lengths to avoid setup/hold violations on the external memory interface. The 132-PQFP package has fine-pitch leads on all four sides; use 4-layer PCB with continuous ground plane beneath the device to control impedance for the address/data bus. Place external program memory devices within 50 mm of the data bus to minimize propagation delay. The bumpered lead corners identify pin 1 - respect this orientation when laying out the footprint.
Estimated: at 16 MHz CPU clock, address and data transitions occur at 8 MHz edges with rise times around 5-10 ns. Use series damping resistors (22-33 ohm) on heavily-loaded address lines if ringing exceeds 10% VDD. Shield the CLKOUT signal trace with ground vias, since CLKOUT drives the external bus and any jitter propagates to all synchronous peripherals. The intermodule bus (IMB) operates at the system clock; keep IMB signals short to prevent internal bus contention.
Because the part is ROMless, an external program memory device must be present and valid at reset, otherwise the CPU32 will execute garbage instructions and potentially latch up. Common pitfalls include: forgetting to configure the SIM chip-select boot region, mismatching wait states to external memory speed, leaving unused IRQ lines floating (tie to VDD via 10 kohm pull-up), and assuming BG/BR bus arbitration without configuring the SIM arbitration mode. Also note the part is end-of-life per the NXP product page - design for last-time-buy inventory or migrate to MCX A series for new projects.
Estimated: the 132-PQFP package has theta_JA around 35-45 C/W depending on PCB copper area and airflow. At maximum CPU activity (16 MHz, all peripherals active), power dissipation is approximately 0.5-0.8 W. In an industrial temperature environment at +85C ambient, junction temperature stays well within the 150 C maximum. However, in sealed enclosures without airflow, derate by 30-40%. The bumpered PQFP corners provide some mechanical stress relief but do not significantly impact thermal performance.
معلومات الامتثال
Compliance data not present in the verified web data for MC68332GCEH16. Parts in this mature M68332 family were typically released prior to mandatory RoHS transition; specific compliance must be verified with the NXP product page or manufacturer certificate of conformance (CoC).
