MC68332GCEH16 - 32-Bit CPU32 MCU 16MHz ROMless 132-PQFP | NXP
MPN: MC68332GCEH16 ⚠ רכישה אחרונהMC68332GCEH16 סקירה
A 32-bit microcontroller (MCU) is a microprocessor core with on-chip RAM, ROM/Flash, timers, and communication peripherals integrated on a single die. The MC68332 specifically uses the CPU32 core, an evolution of the Motorola 68000 family, optimized for embedded control. It sits within the broader hierarchy: CPU32 -> M683xx family -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. The part is ROMless, requiring external program memory, which gives designers freedom to select boot code and firmware tailored to the application.
Key features include the CPU32 core at 16 MHz, 2 KB of on-chip RAM, a Time Processing Unit (TPU) for high-resolution timing I/O, a Queued Serial Module (QSM) for queued SPI/UART transactions, and a System Integration Module (SIM) that aggregates chip selects, interrupt control, and bus arbitration. The internal intermodule bus (IMB) connects these standard modules, allowing configuration flexibility. Operating temperature spans -40C to +85C for industrial environments.
The architecture uses modular standard cells interconnected through the intermodule bus (IMB), a hallmark of the M683xx design philosophy. By decoupling peripherals from the core, NXP enables software reuse across family members. The TPU executes microcoded timing algorithms autonomously, offloading the CPU from event timing workloads such as ignition control, motor commutation, and pulse-width measurement. External bus width and wait-state insertion are SIM-controlled, supporting slow program-memory devices.
Typical applications include automotive engine and transmission control, industrial automation controllers, robotic motion controllers, medical instrumentation with deterministic timing needs, and legacy embedded systems originally designed around the Motorola 68000 architecture. The TPU is especially valuable for fuel injection, anti-lock braking, and electronic stability control subsystems.
When designing with this part, ensure proper decoupling near the 5V supply pins, allocate an external program-memory device, and respect the ROMless boot configuration. Migration paths should be evaluated against the MC68332 family variants, since the part is mature and approaching end-of-life per the manufacturer product page.
This page synthesizes distributor pricing, drop-in NXP M68332 family alternatives, application context, and design notes that extend beyond the manufacturer datasheet to support procurement and engineering decisions.
חלופות תחליף ישיר עבור MC68332GCEH16 — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם MC68332GCEH16 (אותו גורם צורה וטביעת רגל) — שונים ב Package, Core Processor, Peripherals, Series, Maximum Clock Frequency.
MC68332GMEH16
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MC68332ACEH16
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MC68332AVEH16
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MC68LK332ACEH16
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MC68332GMFC16
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MC68332GCEH16 דירוגים מרביים ומאפיינים חשמליים
| Core | CPU32 (M683xx 32-bit) |
| Bit Width | 32-bit |
| Maximum Clock Speed | 16 MHz |
| Program Memory Size | ROMless |
| RAM Size | 2 KB (2K x 8) |
| Number of I/O | 15 |
| מארז | 132-BQFP (132-PQFP bumpered, 24.13 x 24.13 mm) |
| סוג הרכבה | Surface Mount |
| טמפרטורת פעולה | -40C to +85C |
| On-chip Peripherals | TPU (Time Processing Unit), QSM (Queued Serial Module), SIM (System Integration Module) |
| Interconnect | Intermodule Bus (IMB) |
| מתח אספקה | 5 V (typical) |
| סטטוס מחזור חיים | End-of-Life (Last Time Buy per NXP product page) |
תצורת פינים של MC68332GCEH16
| פין 1 | A0 — Address bus bit 0 (external memory interface) |
| פין 2 | A1 — Address bus bit 1 |
| פין 3 | A2 — Address bus bit 2 |
| פין 4 | A3 — Address bus bit 3 |
| פין 5 | A4 — Address bus bit 4 |
| פין 6 | A5 — Address bus bit 5 |
| פין 7 | A6 — Address bus bit 6 |
| פין 8 | A7 — Address bus bit 7 |
| פין 9 | A8 — Address bus bit 8 |
| פין 10 | A9 — Address bus bit 9 |
| פין 11 | A10 — Address bus bit 10 |
| פין 12 | A11 — Address bus bit 11 |
| פין 13 | A12 — Address bus bit 12 |
| פין 14 | A13 — Address bus bit 13 |
| פין 15 | A14 — Address bus bit 14 |
| פין 16 | A15 — Address bus bit 15 |
| פין 17 | A16 — Address bus bit 16 |
| פין 18 | A17 — Address bus bit 17 |
| פין 19 | A18 — Address bus bit 18 |
| פין 20 | A19 — Address bus bit 19 |
| פין 21 | A20 — Address bus bit 20 |
| פין 22 | A21 — Address bus bit 21 |
| פין 23 | A22 — Address bus bit 22 |
| פין 24 | A23 — Address bus bit 23 |
| פין 25 | D0 — Data bus bit 0 |
| פין 26 | D1 — Data bus bit 1 |
| פין 27 | D2 — Data bus bit 2 |
| פין 28 | D3 — Data bus bit 3 |
| פין 29 | D4 — Data bus bit 4 |
| פין 30 | D5 — Data bus bit 5 |
| פין 31 | D6 — Data bus bit 6 |
| פין 32 | D7 — Data bus bit 7 |
| פין 33 | D8 — Data bus bit 8 |
| פין 34 | D9 — Data bus bit 9 |
| פין 35 | D10 — Data bus bit 10 |
| פין 36 | D11 — Data bus bit 11 |
| פין 37 | D12 — Data bus bit 12 |
| פין 38 | D13 — Data bus bit 13 |
| פין 39 | D14 — Data bus bit 14 |
| פין 40 | D15 — Data bus bit 15 |
| פין 41 | TPU_CH0 — TPU channel 0 |
| פין 42 | TPU_CH1 — TPU channel 1 |
| פין 43 | TPU_CH2 — TPU channel 2 |
| פין 44 | TPU_CH3 — TPU channel 3 |
| פין 45 | TPU_CH4 — TPU channel 4 |
| פין 46 | TPU_CH5 — TPU channel 5 |
| פין 47 | TPU_CH6 — TPU channel 6 |
| פין 48 | TPU_CH7 — TPU channel 7 |
| פין 49 | TPU_CH8 — TPU channel 8 |
| פין 50 | TPU_CH9 — TPU channel 9 |
| פין 51 | TPU_CH10 — TPU channel 10 |
| פין 52 | TPU_CH11 — TPU channel 11 |
| פין 53 | TPU_CH12 — TPU channel 12 |
| פין 54 | TPU_CH13 — TPU channel 13 |
| פין 55 | TPU_CH14 — TPU channel 14 |
| פין 56 | TPU_CH15 — TPU channel 15 |
| פין 57 | QSM_TX — QSM transmit output |
| פין 58 | QSM_RX — QSM receive input |
| פין 59 | QSM_SCK — QSM serial clock |
| פין 60 | QSM_PCS — QSM peripheral chip select |
| פין 61 | CS0 — Chip select 0 (SIM) |
| פין 62 | CS1 — Chip select 1 (SIM) |
| פין 63 | CS2 — Chip select 2 (SIM) |
| פין 64 | CS3 — Chip select 3 (SIM) |
| פין 65 | CS4 — Chip select 4 (SIM) |
| פין 66 | CS5 — Chip select 5 (SIM) |
| פין 67 | CS6 — Chip select 6 (SIM) |
| פין 68 | CS7 — Chip select 7 (SIM) |
| פין 69 | CS9 — Chip select 9 (SIM) |
| פין 70 | CS10 — Chip select 10 (SIM) |
| פין 71 | IRQ1 — Interrupt request 1 |
| פין 72 | IRQ2 — Interrupt request 2 |
| פין 73 | IRQ3 — Interrupt request 3 |
| פין 74 | IRQ4 — Interrupt request 4 |
| פין 75 | IRQ5 — Interrupt request 5 |
| פין 76 | IRQ6 — Interrupt request 6 |
| פין 77 | IRQ7 — Interrupt request 7 |
| פין 78 | RST — Reset input (active low) |
| פין 79 | HALT — Halt input (active low) |
| פין 80 | BKPT — Breakpoint / background debug |
| פין 81 | DSI — Development serial input |
| פין 82 | DSO — Development serial output |
| פין 83 | CLKIN — Clock input |
| פין 84 | CLKOUT — Clock output |
| פין 85 | XTAL — Crystal oscillator pin |
| פין 86 | EXTAL — External clock pin |
| פין 87 | VCCSYNTH — Synthesizer power (internal use) |
| פין 88 | VDDSYNTH — Synthesizer power (internal use) |
| פין 89 | IFETCH — Instruction fetch status |
| פין 90 | IPIPE — Instruction pipeline status |
| פין 91 | AVEC — Autovector request |
| פין 92 | BERR — Bus error input |
| פין 93 | HALT_CPU — CPU halt status |
| פין 94 | R/W — Read/Write control |
| פין 95 | AS — Address strobe |
| פין 96 | DS — Data strobe |
| פין 97 | OE — Output enable |
| פין 98 | BG — Bus grant |
| פין 99 | BR — Bus request |
| פין 100 | BGACK — Bus grant acknowledge |
| פין 101 | FC0 — Function code bit 0 |
| פין 102 | FC1 — Function code bit 1 |
| פין 103 | FC2 — Function code bit 2 |
| פין 104 | SIZE0 — Transfer size bit 0 |
| פין 105 | SIZE1 — Transfer size bit 1 |
| פין 106 | TS — Transfer start |
| פין 107 | TA — Transfer acknowledge |
| פין 108 | TEA — Transfer error acknowledge |
| פין 109 | TCLK — Test clock (factory test) |
| פין 110 | TDI — Test data input (factory test) |
| פין 111 | TDO — Test data output (factory test) |
| פין 112 | TMS — Test mode select (factory test) |
| פין 113 | TRST — Test reset (factory test) |
| פין 114 | VDD — 5V power supply |
| פין 115 | VDD — 5V power supply |
| פין 116 | VDD — 5V power supply |
| פין 117 | VDD — 5V power supply |
| פין 118 | VDD — 5V power supply |
| פין 119 | VDD — 5V power supply |
| פין 120 | VSS — Ground |
| פין 121 | VSS — Ground |
| פין 122 | VSS — Ground |
| פין 123 | VSS — Ground |
| פין 124 | VSS — Ground |
| פין 125 | VSS — Ground |
| פין 126 | VSTBY — Standby voltage (SRAM) |
| פין 127 | MODCLK — Module clock |
| פין 128 | TEXP — Timer expire |
| פין 129 | T2CLK — TPU clock |
| פין 130 | PWM_A — PWM channel A output |
| פין 131 | PWM_B — PWM channel B output |
| פין 132 | NC — Not connected (per datasheet) |
יישומים טיפוסיים
MC68332GCEH16 מתאים עבור 6 יישוםs: Automotive Engine Control Unit (ECU), Industrial Motion and Motor Control, Medical Instrumentation Controllers, Robotics and CNC Machine Controllers, Legacy Avionics and Aerospace Subsystems, Industrial PLC and Process Control.
Automotive Engine Control Unit (ECU)
The MC68332GCEH16's CPU32 core at 16 MHz combined with the Time Processing Unit (TPU) made it a workhorse for automotive engine management in the 1990s and 2000s. The TPU autonomously executes microcoded timing routines for fuel injection pulse width, ignition dwell, and crank/cam shaft synchronization, offloading the CPU32 so it can focus on closed-loop control math. With 2 KB of internal SRAM and ROMless external memory, designers could size boot and calibration tables to specific engine families. The SIM provides chip-select generation for multiple external memory banks. While the part is now EOL per the NXP product page, many deployed vehicles still depend on it, making MC68332GCEH16 a critical maintenance and repair component.
מומלץ
Industrial Motion and Motor Control
The TPU on the MC68332GCEH16 generates precise PWM waveforms and measures quadrature encoder feedback for servo drives, stepper controllers, and robotic actuators. With 16 MHz CPU32 bandwidth and QSM queued serial transactions, multiple axes can share a single MCU. The intermodule bus (IMB) integrates the TPU, QSM, and SIM so deterministic timing remains predictable even under heavy interrupt load. Designers use the 2 KB SRAM for real-time control loops, while external ROMless memory holds motion profiles and PID parameters. The 132-PQFP industrial-grade temperature range (-40C to +85C) suits factory-floor deployments.
מומלץ
Medical Instrumentation Controllers
Deterministic timing and high reliability made the MC68332GCEH16 a fit for medical instrument controllers such as infusion pumps, patient monitors, and laboratory analyzers. The TPU handles precise timing of sensor sampling and actuator drive signals while the CPU32 manages user interface and serial communication via the QSM. With 2 KB internal SRAM and ROMless external memory, designers could implement FDA-compliant firmware with version-traceable boot code. The -40C to +85C industrial temperature range supports clinical and laboratory environments. Note that new medical designs should target modern microcontrollers; MC68332GCEH16 is appropriate only for sustaining legacy equipment.
מומלץ
Robotics and CNC Machine Controllers
Multi-axis robotics and CNC machines benefit from the MC68332GCEH16's TPU, which offloads stepper pulse generation and servo-loop timing from the CPU32. The QSM handles queued SPI communications with multi-axis driver boards, while the SIM arbitrates bus access between peripherals. With 16 MHz CPU32 performance and 2 KB internal SRAM, the MCU can coordinate three to six axes in a single chip, eliminating distributed-controller complexity. External ROMless memory stores G-code interpreters and toolpath tables. The 132-PQFP package provides robust mechanical mounting for vibration-prone factory environments.
מומלץ
Legacy Avionics and Aerospace Subsystems
Long-lifecycle aerospace and avionics subsystems continue to deploy the MC68332GCEH16 because its deterministic interrupt latency, radiation-tolerant packaging options, and proven reliability match DO-178 and MIL-spec workflows. The TPU's autonomous timing handles actuator drive and sensor sampling in flight control surfaces, while the CPU32 manages serial databus protocols via QSM. The -40C to +85C operating range spans avionics bay temperatures. Because redesign certification costs are prohibitive, EOL inventory and lifetime buys are common for these systems.
מומלץ
Industrial PLC and Process Control
Programmable logic controllers (PLCs) and process-control systems historically used the MC68332GCEH16 for deterministic scan-time execution and digital I/O handling. The 15 I/O pins combined with SIM-managed chip selects allow expansion to hundreds of I/O points via external shift registers. The QSM provides reliable isolated serial links to remote I/O racks, while the TPU handles high-speed pulse counting for flow meters and encoders. With 2 KB SRAM and external ROMless memory, ladder-logic interpreters and process recipes fit comfortably. The mature toolchain and widespread engineering familiarity keep the part in service.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור MC68332GCEH16 — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | MC68332GMEH16 | MC68332ACEH16 | MC68332AVEH16 | MC68LK332ACEH16 | MC68332GMFC16 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 132-PQFP (24.13x24.13) | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same |
| Core | CPU32 (M683xx) | CPU32 (M683xx) - same | CPU32 (M683xx) - same | CPU32 (M683xx) - same | CPU32 (M683xx) - same | CPU32 (M683xx) - same |
| Clock Speed | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
| Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| RAM Size | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB (low-power variant) | 2 KB |
| TPU Channels | 16 | 16 | 16 | 16 | 16 | 16 |
| Lifecycle Status | End-of-Life | End-of-Life | End-of-Life | End-of-Life | End-of-Life | End-of-Life |
מבדילים עיקריים
- Time Processing Unit (TPU) with 16 dedicated channels (לעומתMC68332AVEH16)
- Queued Serial Module (QSM) for high-throughput serial I/O (לעומתMC68332ACEH16)
- Mature NXP M68332 family tooling and software ecosystem (לעומתMC68LK332ACEH16)
הערות תכנון
The MC68332GCEH16 requires a stable 5V supply with decoupling capacitors placed as close as possible to each VDD/VSS pin pair. Estimated: with 132-PQFP package and 6 VDD pins plus 6 VSS pins, place one 100 nF ceramic and one 10 uF tantalum bulk capacitor per supply pair. The standby voltage pin (VSTBY) must remain powered if SRAM retention is required during power-down. Add a reset supervisor to ensure clean startup, since the ROMless configuration depends on a valid external program memory fetch at reset.
Route the 24-bit address bus and 16-bit data bus with matched trace lengths to avoid setup/hold violations on the external memory interface. The 132-PQFP package has fine-pitch leads on all four sides; use 4-layer PCB with continuous ground plane beneath the device to control impedance for the address/data bus. Place external program memory devices within 50 mm of the data bus to minimize propagation delay. The bumpered lead corners identify pin 1 - respect this orientation when laying out the footprint.
Estimated: at 16 MHz CPU clock, address and data transitions occur at 8 MHz edges with rise times around 5-10 ns. Use series damping resistors (22-33 ohm) on heavily-loaded address lines if ringing exceeds 10% VDD. Shield the CLKOUT signal trace with ground vias, since CLKOUT drives the external bus and any jitter propagates to all synchronous peripherals. The intermodule bus (IMB) operates at the system clock; keep IMB signals short to prevent internal bus contention.
Because the part is ROMless, an external program memory device must be present and valid at reset, otherwise the CPU32 will execute garbage instructions and potentially latch up. Common pitfalls include: forgetting to configure the SIM chip-select boot region, mismatching wait states to external memory speed, leaving unused IRQ lines floating (tie to VDD via 10 kohm pull-up), and assuming BG/BR bus arbitration without configuring the SIM arbitration mode. Also note the part is end-of-life per the NXP product page - design for last-time-buy inventory or migrate to MCX A series for new projects.
Estimated: the 132-PQFP package has theta_JA around 35-45 C/W depending on PCB copper area and airflow. At maximum CPU activity (16 MHz, all peripherals active), power dissipation is approximately 0.5-0.8 W. In an industrial temperature environment at +85C ambient, junction temperature stays well within the 150 C maximum. However, in sealed enclosures without airflow, derate by 30-40%. The bumpered PQFP corners provide some mechanical stress relief but do not significantly impact thermal performance.
מידע על תאימות
Compliance data not present in the verified web data for MC68332GCEH16. Parts in this mature M68332 family were typically released prior to mandatory RoHS transition; specific compliance must be verified with the NXP product page or manufacturer certificate of conformance (CoC).
