MC68332GCEH16 - 32-Bit CPU32 MCU 16MHz ROMless 132-PQFP | NXP
MPN： MC68332GCEH16 ⚠ 最後購買機會MC68332GCEH16 概覽
A 32-bit microcontroller (MCU) is a microprocessor core with on-chip RAM, ROM/Flash, timers, and communication peripherals integrated on a single die. The MC68332 specifically uses the CPU32 core, an evolution of the Motorola 68000 family, optimized for embedded control. It sits within the broader hierarchy: CPU32 -> M683xx family -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. The part is ROMless, requiring external program memory, which gives designers freedom to select boot code and firmware tailored to the application.
Key features include the CPU32 core at 16 MHz, 2 KB of on-chip RAM, a Time Processing Unit (TPU) for high-resolution timing I/O, a Queued Serial Module (QSM) for queued SPI/UART transactions, and a System Integration Module (SIM) that aggregates chip selects, interrupt control, and bus arbitration. The internal intermodule bus (IMB) connects these standard modules, allowing configuration flexibility. Operating temperature spans -40C to +85C for industrial environments.
The architecture uses modular standard cells interconnected through the intermodule bus (IMB), a hallmark of the M683xx design philosophy. By decoupling peripherals from the core, NXP enables software reuse across family members. The TPU executes microcoded timing algorithms autonomously, offloading the CPU from event timing workloads such as ignition control, motor commutation, and pulse-width measurement. External bus width and wait-state insertion are SIM-controlled, supporting slow program-memory devices.
Typical applications include automotive engine and transmission control, industrial automation controllers, robotic motion controllers, medical instrumentation with deterministic timing needs, and legacy embedded systems originally designed around the Motorola 68000 architecture. The TPU is especially valuable for fuel injection, anti-lock braking, and electronic stability control subsystems.
When designing with this part, ensure proper decoupling near the 5V supply pins, allocate an external program-memory device, and respect the ROMless boot configuration. Migration paths should be evaluated against the MC68332 family variants, since the part is mature and approaching end-of-life per the manufacturer product page.
This page synthesizes distributor pricing, drop-in NXP M68332 family alternatives, application context, and design notes that extend beyond the manufacturer datasheet to support procurement and engineering decisions.
直接替換替代品，適用於 MC68332GCEH16 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MC68332GCEH16 （相同外形與佔位） — 差異在於 Package, Core Processor, Peripherals, Series, Maximum Clock Frequency.
MC68332GMEH16
✅ 直接替換📋 參考替代品（不在目錄中）
MC68332ACEH16
✅ 直接替換聯絡詢價
查看資料表 →MC68332AVEH16
✅ 直接替換聯絡詢價
查看資料表 →MC68LK332ACEH16
✅ 直接替換聯絡詢價
查看資料表 →MC68332GMFC16
✅ 直接替換📋 參考替代品（不在目錄中）
MC68332GCEH16 最大額定值與電氣特性
| Core | CPU32 (M683xx 32-bit) |
| Bit Width | 32-bit |
| Maximum Clock Speed | 16 MHz |
| Program Memory Size | ROMless |
| RAM Size | 2 KB (2K x 8) |
| Number of I/O | 15 |
| 封裝 | 132-BQFP (132-PQFP bumpered, 24.13 x 24.13 mm) |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40C to +85C |
| On-chip Peripherals | TPU (Time Processing Unit), QSM (Queued Serial Module), SIM (System Integration Module) |
| Interconnect | Intermodule Bus (IMB) |
| 供應電壓 | 5 V (typical) |
| 生命週期狀態 | End-of-Life (Last Time Buy per NXP product page) |
MC68332GCEH16 腳位配置
| 腳位 1 | A0 — Address bus bit 0 (external memory interface) |
| 腳位 2 | A1 — Address bus bit 1 |
| 腳位 3 | A2 — Address bus bit 2 |
| 腳位 4 | A3 — Address bus bit 3 |
| 腳位 5 | A4 — Address bus bit 4 |
| 腳位 6 | A5 — Address bus bit 5 |
| 腳位 7 | A6 — Address bus bit 6 |
| 腳位 8 | A7 — Address bus bit 7 |
| 腳位 9 | A8 — Address bus bit 8 |
| 腳位 10 | A9 — Address bus bit 9 |
| 腳位 11 | A10 — Address bus bit 10 |
| 腳位 12 | A11 — Address bus bit 11 |
| 腳位 13 | A12 — Address bus bit 12 |
| 腳位 14 | A13 — Address bus bit 13 |
| 腳位 15 | A14 — Address bus bit 14 |
| 腳位 16 | A15 — Address bus bit 15 |
| 腳位 17 | A16 — Address bus bit 16 |
| 腳位 18 | A17 — Address bus bit 17 |
| 腳位 19 | A18 — Address bus bit 18 |
| 腳位 20 | A19 — Address bus bit 19 |
| 腳位 21 | A20 — Address bus bit 20 |
| 腳位 22 | A21 — Address bus bit 21 |
| 腳位 23 | A22 — Address bus bit 22 |
| 腳位 24 | A23 — Address bus bit 23 |
| 腳位 25 | D0 — Data bus bit 0 |
| 腳位 26 | D1 — Data bus bit 1 |
| 腳位 27 | D2 — Data bus bit 2 |
| 腳位 28 | D3 — Data bus bit 3 |
| 腳位 29 | D4 — Data bus bit 4 |
| 腳位 30 | D5 — Data bus bit 5 |
| 腳位 31 | D6 — Data bus bit 6 |
| 腳位 32 | D7 — Data bus bit 7 |
| 腳位 33 | D8 — Data bus bit 8 |
| 腳位 34 | D9 — Data bus bit 9 |
| 腳位 35 | D10 — Data bus bit 10 |
| 腳位 36 | D11 — Data bus bit 11 |
| 腳位 37 | D12 — Data bus bit 12 |
| 腳位 38 | D13 — Data bus bit 13 |
| 腳位 39 | D14 — Data bus bit 14 |
| 腳位 40 | D15 — Data bus bit 15 |
| 腳位 41 | TPU_CH0 — TPU channel 0 |
| 腳位 42 | TPU_CH1 — TPU channel 1 |
| 腳位 43 | TPU_CH2 — TPU channel 2 |
| 腳位 44 | TPU_CH3 — TPU channel 3 |
| 腳位 45 | TPU_CH4 — TPU channel 4 |
| 腳位 46 | TPU_CH5 — TPU channel 5 |
| 腳位 47 | TPU_CH6 — TPU channel 6 |
| 腳位 48 | TPU_CH7 — TPU channel 7 |
| 腳位 49 | TPU_CH8 — TPU channel 8 |
| 腳位 50 | TPU_CH9 — TPU channel 9 |
| 腳位 51 | TPU_CH10 — TPU channel 10 |
| 腳位 52 | TPU_CH11 — TPU channel 11 |
| 腳位 53 | TPU_CH12 — TPU channel 12 |
| 腳位 54 | TPU_CH13 — TPU channel 13 |
| 腳位 55 | TPU_CH14 — TPU channel 14 |
| 腳位 56 | TPU_CH15 — TPU channel 15 |
| 腳位 57 | QSM_TX — QSM transmit output |
| 腳位 58 | QSM_RX — QSM receive input |
| 腳位 59 | QSM_SCK — QSM serial clock |
| 腳位 60 | QSM_PCS — QSM peripheral chip select |
| 腳位 61 | CS0 — Chip select 0 (SIM) |
| 腳位 62 | CS1 — Chip select 1 (SIM) |
| 腳位 63 | CS2 — Chip select 2 (SIM) |
| 腳位 64 | CS3 — Chip select 3 (SIM) |
| 腳位 65 | CS4 — Chip select 4 (SIM) |
| 腳位 66 | CS5 — Chip select 5 (SIM) |
| 腳位 67 | CS6 — Chip select 6 (SIM) |
| 腳位 68 | CS7 — Chip select 7 (SIM) |
| 腳位 69 | CS9 — Chip select 9 (SIM) |
| 腳位 70 | CS10 — Chip select 10 (SIM) |
| 腳位 71 | IRQ1 — Interrupt request 1 |
| 腳位 72 | IRQ2 — Interrupt request 2 |
| 腳位 73 | IRQ3 — Interrupt request 3 |
| 腳位 74 | IRQ4 — Interrupt request 4 |
| 腳位 75 | IRQ5 — Interrupt request 5 |
| 腳位 76 | IRQ6 — Interrupt request 6 |
| 腳位 77 | IRQ7 — Interrupt request 7 |
| 腳位 78 | RST — Reset input (active low) |
| 腳位 79 | HALT — Halt input (active low) |
| 腳位 80 | BKPT — Breakpoint / background debug |
| 腳位 81 | DSI — Development serial input |
| 腳位 82 | DSO — Development serial output |
| 腳位 83 | CLKIN — Clock input |
| 腳位 84 | CLKOUT — Clock output |
| 腳位 85 | XTAL — Crystal oscillator pin |
| 腳位 86 | EXTAL — External clock pin |
| 腳位 87 | VCCSYNTH — Synthesizer power (internal use) |
| 腳位 88 | VDDSYNTH — Synthesizer power (internal use) |
| 腳位 89 | IFETCH — Instruction fetch status |
| 腳位 90 | IPIPE — Instruction pipeline status |
| 腳位 91 | AVEC — Autovector request |
| 腳位 92 | BERR — Bus error input |
| 腳位 93 | HALT_CPU — CPU halt status |
| 腳位 94 | R/W — Read/Write control |
| 腳位 95 | AS — Address strobe |
| 腳位 96 | DS — Data strobe |
| 腳位 97 | OE — Output enable |
| 腳位 98 | BG — Bus grant |
| 腳位 99 | BR — Bus request |
| 腳位 100 | BGACK — Bus grant acknowledge |
| 腳位 101 | FC0 — Function code bit 0 |
| 腳位 102 | FC1 — Function code bit 1 |
| 腳位 103 | FC2 — Function code bit 2 |
| 腳位 104 | SIZE0 — Transfer size bit 0 |
| 腳位 105 | SIZE1 — Transfer size bit 1 |
| 腳位 106 | TS — Transfer start |
| 腳位 107 | TA — Transfer acknowledge |
| 腳位 108 | TEA — Transfer error acknowledge |
| 腳位 109 | TCLK — Test clock (factory test) |
| 腳位 110 | TDI — Test data input (factory test) |
| 腳位 111 | TDO — Test data output (factory test) |
| 腳位 112 | TMS — Test mode select (factory test) |
| 腳位 113 | TRST — Test reset (factory test) |
| 腳位 114 | VDD — 5V power supply |
| 腳位 115 | VDD — 5V power supply |
| 腳位 116 | VDD — 5V power supply |
| 腳位 117 | VDD — 5V power supply |
| 腳位 118 | VDD — 5V power supply |
| 腳位 119 | VDD — 5V power supply |
| 腳位 120 | VSS — Ground |
| 腳位 121 | VSS — Ground |
| 腳位 122 | VSS — Ground |
| 腳位 123 | VSS — Ground |
| 腳位 124 | VSS — Ground |
| 腳位 125 | VSS — Ground |
| 腳位 126 | VSTBY — Standby voltage (SRAM) |
| 腳位 127 | MODCLK — Module clock |
| 腳位 128 | TEXP — Timer expire |
| 腳位 129 | T2CLK — TPU clock |
| 腳位 130 | PWM_A — PWM channel A output |
| 腳位 131 | PWM_B — PWM channel B output |
| 腳位 132 | NC — Not connected (per datasheet) |
典型應用
MC68332GCEH16 適用於 6 應用s: Automotive Engine Control Unit (ECU), Industrial Motion and Motor Control, Medical Instrumentation Controllers, Robotics and CNC Machine Controllers, Legacy Avionics and Aerospace Subsystems, Industrial PLC and Process Control.
Automotive Engine Control Unit (ECU)
The MC68332GCEH16's CPU32 core at 16 MHz combined with the Time Processing Unit (TPU) made it a workhorse for automotive engine management in the 1990s and 2000s. The TPU autonomously executes microcoded timing routines for fuel injection pulse width, ignition dwell, and crank/cam shaft synchronization, offloading the CPU32 so it can focus on closed-loop control math. With 2 KB of internal SRAM and ROMless external memory, designers could size boot and calibration tables to specific engine families. The SIM provides chip-select generation for multiple external memory banks. While the part is now EOL per the NXP product page, many deployed vehicles still depend on it, making MC68332GCEH16 a critical maintenance and repair component.
推薦
Industrial Motion and Motor Control
The TPU on the MC68332GCEH16 generates precise PWM waveforms and measures quadrature encoder feedback for servo drives, stepper controllers, and robotic actuators. With 16 MHz CPU32 bandwidth and QSM queued serial transactions, multiple axes can share a single MCU. The intermodule bus (IMB) integrates the TPU, QSM, and SIM so deterministic timing remains predictable even under heavy interrupt load. Designers use the 2 KB SRAM for real-time control loops, while external ROMless memory holds motion profiles and PID parameters. The 132-PQFP industrial-grade temperature range (-40C to +85C) suits factory-floor deployments.
推薦
Medical Instrumentation Controllers
Deterministic timing and high reliability made the MC68332GCEH16 a fit for medical instrument controllers such as infusion pumps, patient monitors, and laboratory analyzers. The TPU handles precise timing of sensor sampling and actuator drive signals while the CPU32 manages user interface and serial communication via the QSM. With 2 KB internal SRAM and ROMless external memory, designers could implement FDA-compliant firmware with version-traceable boot code. The -40C to +85C industrial temperature range supports clinical and laboratory environments. Note that new medical designs should target modern microcontrollers; MC68332GCEH16 is appropriate only for sustaining legacy equipment.
推薦
Robotics and CNC Machine Controllers
Multi-axis robotics and CNC machines benefit from the MC68332GCEH16's TPU, which offloads stepper pulse generation and servo-loop timing from the CPU32. The QSM handles queued SPI communications with multi-axis driver boards, while the SIM arbitrates bus access between peripherals. With 16 MHz CPU32 performance and 2 KB internal SRAM, the MCU can coordinate three to six axes in a single chip, eliminating distributed-controller complexity. External ROMless memory stores G-code interpreters and toolpath tables. The 132-PQFP package provides robust mechanical mounting for vibration-prone factory environments.
推薦
Legacy Avionics and Aerospace Subsystems
Long-lifecycle aerospace and avionics subsystems continue to deploy the MC68332GCEH16 because its deterministic interrupt latency, radiation-tolerant packaging options, and proven reliability match DO-178 and MIL-spec workflows. The TPU's autonomous timing handles actuator drive and sensor sampling in flight control surfaces, while the CPU32 manages serial databus protocols via QSM. The -40C to +85C operating range spans avionics bay temperatures. Because redesign certification costs are prohibitive, EOL inventory and lifetime buys are common for these systems.
推薦
Industrial PLC and Process Control
Programmable logic controllers (PLCs) and process-control systems historically used the MC68332GCEH16 for deterministic scan-time execution and digital I/O handling. The 15 I/O pins combined with SIM-managed chip selects allow expansion to hundreds of I/O points via external shift registers. The QSM provides reliable isolated serial links to remote I/O racks, while the TPU handles high-speed pulse counting for flow meters and encoders. With 2 KB SRAM and external ROMless memory, ladder-logic interpreters and process recipes fit comfortably. The mature toolchain and widespread engineering familiarity keep the part in service.
推薦
推薦產品摘要
工程參考資料，適用於 MC68332GCEH16 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MC68332GMEH16 | MC68332ACEH16 | MC68332AVEH16 | MC68LK332ACEH16 | MC68332GMFC16 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 132-PQFP (24.13x24.13) | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same |
| Core | CPU32 (M683xx) | CPU32 (M683xx) - same | CPU32 (M683xx) - same | CPU32 (M683xx) - same | CPU32 (M683xx) - same | CPU32 (M683xx) - same |
| Clock Speed | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
| Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| RAM Size | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB (low-power variant) | 2 KB |
| TPU Channels | 16 | 16 | 16 | 16 | 16 | 16 |
| Lifecycle Status | End-of-Life | End-of-Life | End-of-Life | End-of-Life | End-of-Life | End-of-Life |
主要差異化特點
- Time Processing Unit (TPU) with 16 dedicated channels (對比MC68332AVEH16)
- Queued Serial Module (QSM) for high-throughput serial I/O (對比MC68332ACEH16)
- Mature NXP M68332 family tooling and software ecosystem (對比MC68LK332ACEH16)
設計說明
The MC68332GCEH16 requires a stable 5V supply with decoupling capacitors placed as close as possible to each VDD/VSS pin pair. Estimated: with 132-PQFP package and 6 VDD pins plus 6 VSS pins, place one 100 nF ceramic and one 10 uF tantalum bulk capacitor per supply pair. The standby voltage pin (VSTBY) must remain powered if SRAM retention is required during power-down. Add a reset supervisor to ensure clean startup, since the ROMless configuration depends on a valid external program memory fetch at reset.
Route the 24-bit address bus and 16-bit data bus with matched trace lengths to avoid setup/hold violations on the external memory interface. The 132-PQFP package has fine-pitch leads on all four sides; use 4-layer PCB with continuous ground plane beneath the device to control impedance for the address/data bus. Place external program memory devices within 50 mm of the data bus to minimize propagation delay. The bumpered lead corners identify pin 1 - respect this orientation when laying out the footprint.
Estimated: at 16 MHz CPU clock, address and data transitions occur at 8 MHz edges with rise times around 5-10 ns. Use series damping resistors (22-33 ohm) on heavily-loaded address lines if ringing exceeds 10% VDD. Shield the CLKOUT signal trace with ground vias, since CLKOUT drives the external bus and any jitter propagates to all synchronous peripherals. The intermodule bus (IMB) operates at the system clock; keep IMB signals short to prevent internal bus contention.
Because the part is ROMless, an external program memory device must be present and valid at reset, otherwise the CPU32 will execute garbage instructions and potentially latch up. Common pitfalls include: forgetting to configure the SIM chip-select boot region, mismatching wait states to external memory speed, leaving unused IRQ lines floating (tie to VDD via 10 kohm pull-up), and assuming BG/BR bus arbitration without configuring the SIM arbitration mode. Also note the part is end-of-life per the NXP product page - design for last-time-buy inventory or migrate to MCX A series for new projects.
Estimated: the 132-PQFP package has theta_JA around 35-45 C/W depending on PCB copper area and airflow. At maximum CPU activity (16 MHz, all peripherals active), power dissipation is approximately 0.5-0.8 W. In an industrial temperature environment at +85C ambient, junction temperature stays well within the 150 C maximum. However, in sealed enclosures without airflow, derate by 30-40%. The bumpered PQFP corners provide some mechanical stress relief but do not significantly impact thermal performance.
合規資訊
Compliance data not present in the verified web data for MC68332GCEH16. Parts in this mature M68332 family were typically released prior to mandatory RoHS transition; specific compliance must be verified with the NXP product page or manufacturer certificate of conformance (CoC).
