FPGA & CPLD
Products (6352)
10M08DCU324I7G - MAX 10 FPGA, 8K LE, U324 BGA | Intel
The Intel 10M08DCU324I7G is a member of the MAX® 10 family of non-volatile FPGAs, integrating 8,000 logic elements (LEs), 246 Kbits of embedded SRAM, and 387,072 bits of user flash memory into a single 324-pin Ultra FineLine BGA (UFBGA / U324) package. Built on TSMC's low-power 55nm NOR flash-based process, the device features on-die dual-configuration flash, an integrated 12-bit successive-approximation analog-to-digital converter (ADC), and a built-in PLD-style instant-on capability, making it suitable for system management, I/O expansion, and industrial control roles that previously required a CPLD plus a discrete MCU. A field programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and programmable I/O cells that can be re-programmed to implement arbitrary digital logic. FPGAs occupy a unique position in the silicon hierarchy between fixed-function ASICs and software-driven microcontrollers: they deliver parallel hardware performance and deterministic latency without the NRE cost of an ASIC, while providing far more flexibility than a microcontroller for custom I/O timing, wide datapaths, or high-speed interface bridging. The MAX 10 family specifically targets low-power, small-form-factor, and cost-sensitive applications that benefit from non-volatile instant-on behavior. Key specifications of the 10M08 include up to 246 user I/Os, an embedded 12-bit ADC with up to 18 analog inputs, on-die temperature-sensing diode, hardware multipliers, and a 3.3 V core / LVCMOS I/O architecture supporting LVDS, LVTTL, and LVCMOS standards. The device supports configuration via JTAG, internal flash, or external host, and includes user flash memory (UFM) for non-volatile data storage such as calibration constants or serial numbers. The architecture pairs a 4-input look-up table (LUT) based logic fabric with embedded memory blocks (M9K), 18x18 multipliers, and a programmable interconnect network. The integrated ADC samples at up to 1 MSa/s in single-ended mode, while dual-boot flash enables fail-safe field updates. Compared with SRAM-based competitors, the on-die flash removes the need for an external boot PROM, reducing BOM cost and board area by roughly one to two square centimeters. Typical applications include industrial motor control, factory automation I/O expansion, video bridging and image aggregation, low-cost PCIe endpoint prototyping, and system management in telecom or server backplanes. The on-die flash and instant-on capability also make the device attractive for use as a replacement for legacy CPLDs plus discrete ADCs in power-sequencing, fan control, and board-management controller designs. When designing with this device, pay attention to UFBGA-324 PCB layout requirements: microvia or via-in-pad technology is recommended for the 0.8 mm ball pitch escape, and at least four routing layers with a continuous ground plane are required to maintain signal-integrity margins on LVDS and DDR interfaces. Quartus Prime (Lite or Standard edition) is the supported development environment for synthesis, place-and-route, and programming. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical layout notes not collated on a single manufacturer page, helping engineers shorten the bill-of-materials evaluation cycle.
10M08DCV81C7G - MAX 10 FPGA, 8K LE, 81-UFBGA | Altera / Intel
The Altera (Intel) 10M08DCV81C7G is a MAX 10 family field-programmable gate array (FPGA) with 8,000 logic elements, 387,072 bits of embedded memory (RAM), and 56 (18x18) hardware multipliers, housed in an 81-ball Ultra-Fine-Pitch Ball Grid Array (UFBGA, WLCSP) package. It is fabricated on a 55 nm TSMC process and operates from a 1.2 V core supply with integrated dual-configuration flash and analog-to-digital converter (ADC) blocks. A field-programmable gate array (FPGA) is a semiconductor IC containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware such as multipliers and block RAM that the user defines via a hardware description language (HDL). Within the broader taxonomy, the 10M08 belongs to Altera/Intel's MAX 10 family, which sits below Cyclone V/10 and above legacy MAX II/MAX V CPLDs; it is a non-volatile, flash-based FPGA targeting low-power, instant-on, and cost-sensitive applications that previously required CPLDs or small ASICs. Key differentiating features of this part include 1.2 V core operation, integrated 12-bit SAR ADC support, on-chip dual-configuration flash allowing instant-on behavior, and the very small 81-ball WLCSP/UFBGA footprint. It is also lead-free and RoHS-compliant, suitable for industrial temperature operation, and provides hardened peripherals (PLL, I/O buffers, JTAG) without requiring external configuration memory. Architecturally, MAX 10 devices combine a LUT-based logic fabric with 18x18 multipliers, M9K block RAM, a hardened ADC subsystem, and on-die flash for configuration. The 8K LE variant occupies the lower-density end of the family (2K, 4K, 8K, 16K, 25K, 40K, 50K), making it ideal for glue-logic, sensor aggregation, and low-cost I/O expansion. Typical applications include industrial motor and process control, consumer display controllers, I/O expansion for microcontrollers, sensor hubs, and portable/handheld embedded systems. The combination of small package, integrated ADC, and instant-on flash makes it well-suited to compact, power-constrained designs. When designing with this part, ensure the WLCSP/UFBGA land pattern is correctly fabricated because the 0.4 mm-or-finer ball pitch requires precise PCB stencil design and reflow profile. Verify Quartus Prime device support, JTAG chain, and dual-boot image configuration during board bring-up. This page synthesizes distributor pricing, drop-in same-package alternatives within the MAX 10 family, and practical design notes not aggregated on any single distributor product page.
10M08DCV81I7G - MAX 10 FPGA, 8K LE, 81-WLCSP | Intel / Altera
The Intel / Altera (formerly Altera) 10M08DCV81I7G is a MAX 10 family Field-Programmable Gate Array (FPGA) housed in an 81-ball Wafer-Level Chip-Scale Package (WLCSP) and offering 8,000 logic elements, 387,072 bits of embedded user flash, and 56 maximum user I/O pins. As a non-volatile FPGA, it integrates a dual-configuration flash array and instant-on support directly on-die, eliminating external boot PROM and shortening power-to-active latency. The device operates across industrial temperature ranges and is built on a low-power process that targets glue-logic, I/O expansion, and bridge functions. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose digital logic functionality is defined by the user after manufacture, via a hardware description language (HDL) and a configuration bitstream. In the broader component taxonomy, an FPGA belongs to programmable logic devices (PLD), which in turn belong to digital logic ICs, under the integrated circuit hierarchy. MAX 10 occupies a niche between small CPLDs and higher-density SRAM-based FPGAs by offering on-chip flash, analog blocks, and DDR3 support in a single chip. Key features of the 10M08DCV81I7G include 8K logic elements, 387 Kbits user flash, 56 maximum user I/Os, integrated ADC (12-bit SAR), and on-chip dual-configuration flash with instant-on capability. The 81-WLCSP package is the smallest form factor in the MAX 10 family, enabling extremely compact board layouts for space-constrained products such as wearables, sensor modules, and portable instrumentation. I/O support includes LVDS, LVCMOS, SSTL, and RSDS, simplifying interface to common DDR memory and CMOS peripherals. The MAX 10 architecture combines an SRAM-backed logic fabric with non-volatile flash for configuration storage. This hybrid design lets the device retain its bitstream through power cycles without external boot devices, a meaningful architectural distinction from Cyclone or Stratix families that rely on external flash. Designers use Quartus Prime software for HDL capture, synthesis, place-and-route, and bitstream generation. The device also supports JTAG, AS, and PS configuration modes for in-system programming. Typical applications include I/O expansion and bridging (I2C/SPI to parallel, UART multiplexing), industrial control and motor drive glue logic, sensor aggregation hubs, portable medical and consumer wearables, and low-cost video processing. Its small footprint and integrated flash make it attractive when board area and BOM cost dominate over raw logic density. In designs that previously required a CPLD plus discrete ADC, a single MAX 10 device can replace both functions. When designing with this part, pay attention to the WLCSP assembly process: it requires PCB pad finishing, underfill, and careful reflow profile control. The 56 user I/Os are arranged across multiple I/O banks with mixed voltage tolerance; verify each bank's VCCIO supply matches the connected peripheral logic before routing. Designers should also plan for Quartus Prime licensing and reference the MAX 10 device handbook for timing closure guidance. This page consolidates distributor pricing, verified specifications, drop-in same-package alternatives, and practical design notes in one place, saving engineers from cross-referencing multiple distributor listings and datasheet documents.
10M08DFV81C8G - MAX 10 FPGA, 8K LE, 81-WLCSP | Altera / Intel
The Intel (formerly Altera) MAX 10 10M08DFV81C8G is a non-volatile FPGA from the MAX 10 family, integrating 8,000 logic elements, 387,072 bits of embedded user flash memory, and 56 (18x18) hardware multipliers in a compact 81-ball WLCSP package. Built on TSMC's 55 nm embedded flash process, the device operates from a single 1.2 V core supply with LVCMOS/LVDS I/O support, eliminating the need for an external configuration memory. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O can be configured by the designer after manufacture. Within the broader taxonomy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as reconfigurable compute fabrics. The MAX 10 family specifically integrates a dual-configuration flash, analog-to-digital converters, and SRAM into a single chip, bridging the gap between traditional CPLDs and higher-density Cyclone-series FPGAs. Key features of the 10M08DFV81C8G include 8,000 logic elements, 56 embedded 18x18 multipliers, 378 Kbits of block RAM, integrated ADC, and instant-on support from on-die flash. The device supports commercial temperature grade (0C to +85C) with a speed grade 8 core. The 81-ball WLCSP (Wafer Level Chip Scale Package) delivers the smallest footprint in the MAX 10 portfolio for space-constrained designs. Typical applications include industrial motor control, IoT sensor hubs, low-cost video processing, and portable instrumentation. The integrated ADC makes it well suited for data acquisition front-ends, while the embedded multipliers enable DSP pipelines such as FFTs and digital filters. When designing with this part, engineers should review Quartus Prime device pin-out files for the V81 ball map and observe WLCSP PCB layout guidelines (microvia stack-up, NSMD pads). The non-volatile architecture removes boot-time configuration delays inherent to SRAM-based FPGAs. This page synthesizes distributor pricing, drop-in same-brand alternatives from the MAX 10 family, and engineering design notes not consolidated in the manufacturer datasheet.
10M08DFV81I7G - MAX 10 FPGA, 8K LE, 81-BGA | Intel
The Intel (formerly Altera) 10M08DFV81I7G is a MAX 10 field-programmable gate array (FPGA) featuring 8,000 logic elements, 387,072 bits of embedded SRAM, and 56 user I/O pins, housed in an 81-ball UFBGA / WLCSP package. It belongs to the non-volatile MAX 10 family, integrating flash configuration memory, a 12-bit SAR ADC, and DSP blocks directly on-chip. The device operates across an industrial temperature range and is built on a low-power process optimized for instant-on, single-chip applications. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can re-program in the field after manufacturing. FPGAs sit alongside ASICs and microcontrollers in the programmable logic hierarchy, offering higher performance and parallelism than MCUs while costing less than full-custom ASICs at low volumes. The MAX 10 family specifically targets low-power, cost-sensitive, and instant-on designs by integrating dual-configuration flash, eliminating the need for an external boot PROM. Key features of the 10M08DFV81I7G include its 8K logic element count, embedded 12-bit ADC up to 1 MSPS with up to 18 analog channels, on-chip flash with instant-on capability, dedicated DSP blocks for fixed- and floating-point arithmetic, and embedded PLLs for flexible clock synthesis. The integrated flash also enables user flash memory (UFM) for data logging and parameter storage. The 81-ball UFBGA package provides a compact footprint suitable for space-constrained PCB designs while supporting up to 56 user I/Os. Architecturally, the MAX 10 family uses logic array blocks (LABs) built from adaptive logic modules (ALMs), each containing an 8-input fracturable look-up table, two dedicated adders, and four registers. This architecture, combined with hard DSP blocks and embedded memory, gives the 10M08DFV81I7G solid DSP performance and efficient memory utilization in a low-power envelope. Typical applications for the 10M08DFV81I7G include industrial control and I/O expansion, motor control, portable instrumentation, video bridging, and low-volume ASIC prototyping. Its instant-on flash and integrated ADC make it particularly attractive for system management, sensor fusion, and bridging legacy interfaces in factory automation. When designing with this FPGA, ensure the Quartus Prime toolchain supports the 10M08DFV81I7G device variant. Use Intel's MAX 10 development kits or partner boards for prototyping, and follow the package-specific PCB layout guidelines for UFBGA/WLCSP fanout and via-in-pad considerations to maintain signal integrity. This page synthesizes distributor pricing, vertical-migration alternatives from the same MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
10M08SAE144C8G - MAX 10 FPGA 8K LE, 144-EQFP | Intel | Industrial Control
The Intel 10M08SAE144C8G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) integrating 8,000 logic elements, 378 Kb of M9K embedded SRAM, 24 embedded 18x18 multipliers, and a 12-bit analog-to-digital converter (ADC) into a 144-pin EQFP (LQFP with exposed pad) package. Built on a 55 nm flash-based process, it stores its configuration in on-chip flash memory, enabling instant-on behavior without an external boot ROM. The device exposes 101 user I/O pins, supports LVDS, DDR3 external memory interfaces, and operates across the commercial 0C to 85C junction range. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows hardware engineers to implement arbitrary digital logic, DSP, and memory functions through a software-defined configuration. FPGAs occupy a unique position in the semiconductor hierarchy: more flexible than an ASIC, faster and more parallel than a microcontroller, and lower-power-per-compute than a GPU for fixed-function pipelines. The MAX 10 family targets glue logic, motor control, I/O expansion, and small-format digital signal processing where instant-on and integrated analog reduce total bill of materials. Key features include 8 K logic elements (LEs), 8 K flip-flops, 24 hardware 18x18 multipliers, two analog front-end PLLs, a hard 12-bit successive-approximation ADC (up to 1 MSa/s with up to 17 analog inputs), and dual configuration flash. The integrated ADC eliminates external analog front-end ICs for sensor monitoring, while internal flash removes the boot PROM that CPLDs and SRAM-based FPGAs traditionally require. Architecturally, the device uses look-up-table (LUT) based logic elements clustered into Logic Array Blocks (LABs), routed through a multi-speed interconnect fabric. The flash configuration cell sits on the same die, allowing field upgrades via JTAG while preserving 100,000+ erase/program cycles. The ADC is a hard IP block sharing analog supply and reference pins with the digital I/O ring. Typical applications include industrial motor control (BLDC, stepper, servo), factory automation I/O expansion, sensor aggregation with on-chip ADC, video bridging (LVDS/CVBS), medical patient monitoring, and portable test instruments requiring instant-on capability. Designers also use the MAX 10 for protocol bridging (UART/SPI/I2C to Ethernet) in IoT edge nodes. Design tip: route the exposed thermal pad (EP) to a continuous ground plane with at least 9 thermal vias on a 0.3 mm pitch. Without EP soldering, junction-to-ambient thermal resistance degrades significantly and high-utilization designs can exceed the 85C commercial limit. This page synthesizes distributor pricing, drop-in alternatives, application notes, and package-level guidance not consolidated in any single manufacturer document.
10M08SAE144I7G - MAX 10 FPGA 8K LE, 144-LQFP | Intel
The Intel 10M08SAE144I7G is a non-volatile MAX 10 Field-Programmable Gate Array (FPGA) with 8,000 logic elements (LE), 387,072 bits (378 Kb) of embedded SRAM, and 101 user I/O pins in a 144-pin EQFP (LQFP with exposed pad) package. It integrates dual-configuration flash (1,540 Kbits), an internal ADC, and on-board configuration memory, enabling single-chip instant-on applications without an external boot PROM. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Unlike a microcontroller, FPGAs execute logic in parallel hardware, offering deterministic timing and high I/O throughput. FPGAs sit in the broader hierarchy of programmable logic -> programmable logic device -> logic semiconductor -> integrated circuit, and are widely used to accelerate parallel workloads, glue logic, and interface bridging. Key features of the 10M08SAE144I7G include 8,000 logic elements, 378 Kbits of user flash memory, a 1.25 Gbps LVDS-capable I/O bank architecture, an integrated 12-bit successive-approximation ADC, and a single 3.3 V core supply. The device also supports Nios II embedded processor cores, JTAG-based configuration, and 18x18 multiplier blocks for digital signal processing. This combination delivers a flexible, processor-capable platform in a single device. Architecturally, the 10M08SAE144I7G uses a TSMC 55 nm CMOS process with a look-up-table (LUT) based fabric and embedded SRAM blocks (M9K). The integrated flash eliminates external boot components, reducing BOM and board area. The exposed-pad LQFP-144 package supports conventional SMT reflow, simplifying manufacturing versus BGA alternatives. Typical applications include industrial motor control, factory automation I/O expansion, low-cost video processing bridges, portable instrumentation, and consumer electronics requiring custom logic or peripheral interfacing. The internal ADC and flash make it well-suited for sensor aggregation and instant-on embedded platforms. When designing with the 10M08SAE144I7G, ensure the exposed pad (EP) is soldered to a sufficiently large copper pour for thermal dissipation and ground return. Use the Quartus Prime design suite for synthesis, place-and-route, and timing closure. Plan I/O bank voltage (VCCIO) assignments carefully - the 10M08 device supports multiple I/O standards per bank but each bank must use a single VCCIO. This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet, providing a faster engineering decision workflow.
10M08SAM153C8G - MAX 10 FPGA, 8K LE, 153-MBGA | Intel / Altera
The Intel (Altera) 10M08SAM153C8G is a member of the MAX 10 FPGA family, integrating 8,000 logic elements, 387,072 bits of embedded user flash, and a 153-ball Micro BGA (MBGA) package. Built on a 55 nm process and operating from a 1.2 V core supply, this non-volatile FPGA delivers 112 Kbits of dedicated block RAM and up to 250 user I/O pins in the package family, while consuming a fraction of the power of comparable SRAM FPGAs through instant-on configuration from internal flash. A field-programmable gate array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected by programmable interconnect, allowing designers to implement arbitrary digital logic, glue logic, and parallel processing functions after PCB fabrication. Within the broader taxonomy of programmable logic, FPGAs sit alongside CPLDs and SPLDs as non-processor programmable devices; the MAX 10 family in particular targets low-power, instant-on applications by embedding dual-configuration flash on-die, eliminating the need for external boot memory. The 10M08SAM153C8G delivers up to 8,000 logic elements, 387,072 bits (approximately 378 Kbit user flash), 112 Kbits of block RAM (M9K blocks), and 4 embedded 18x18 multipliers. It integrates an analog-to-digital converter (ADC) block, supports up to 250 user I/O pins (package dependent) and offers 1.2 V core operation with 3.0/3.3 V LVCMOS/LVTTL I/O capability. The 153-ball MBGA package maximizes logic density in a compact surface-mount footprint suitable for space-constrained industrial designs. Architecturally, MAX 10 devices use non-volatile configuration memory that enables instant-on operation in under 10 ms from a single 1.2 V supply, eliminating boot PROM or external flash. The built-in ADC supports 12-bit SAR conversion at up to 1 MSPS across analog input pins, providing mixed-signal integration that simplifies sensor monitoring and power-supply telemetry. Internal flash can also be partitioned for user data storage, replacing external EEPROMs in many designs. Typical applications include industrial control and factory automation (motor control glue logic, sensor fusion pre-processing), IoT edge nodes (sensor aggregation and protocol bridging), test and measurement front-ends, consumer electronics with display timing controllers, and portable/battery-powered devices that benefit from instant-on behavior. The on-chip ADC also makes MAX 10 suitable for predictive-maintenance sensor hubs. When designing with this part, account for power-supply sequencing: MAX 10 devices require a stable 1.2 V core rail and a separate VCCIO bank supply. Use the Intel Quartus Prime toolchain for synthesis, place-and-route, and configuration bitstream generation. The C8G speed grade (commercial, 8 ns internal timing) represents the slowest of the MAX 10 commercial grades; choose faster speed grades only if critical paths demand the additional timing margin. This page synthesizes distributor pricing, real-time stock, and parametric drop-in alternatives for the 10M08SAM153C8G, plus design notes that go beyond what is in the Intel MAX 10 datasheet alone.
10M08SAM153I7G - MAX 10 FPGA, 8K LE, 153-MBGA | Intel
The Intel 10M08SAM153I7G is a member of the MAX 10 family of non-volatile FPGAs, integrating 8,000 logic elements (LEs), 378 Kbits of embedded memory, and a 153-ball FineLine BGA (MBGA) package measuring 8 x 8 mm with 0.5 mm pitch. It provides 112 maximum user I/O pins and combines LUT-based logic, embedded SRAM, and on-die flash configuration memory in a single low-power device. A field-programmable gate array (FPGA) is a reconfigurable semiconductor that lets engineers implement arbitrary digital logic, state machines, and parallel datapaths after PCB fabrication. The MAX 10 family extends the FPGA concept with on-die flash, so designs boot instantly without an external configuration PROM. Within the broader hierarchy, this part is an FPGA -> programmable logic -> reconfigurable digital IC -> semiconductor. Key features include 8,000 LEs, a 378 Kbit M9K embedded memory block array, 24 (18x18) multipliers, and an internal configuration flash that supports dual-boot images and instant-on operation. The device also integrates an analog-to-digital converter (ADC) block, user flash memory (UFM), and a hardened PLL network. Operating at the industrial temperature range of -40 °C to +100 °C (I7G speed grade), the part targets industrial, automotive, and consumer applications that need low-power, instant-on logic. The 10M08 die is fabricated on a low-power process and features 55 nm embedded-flash technology. Its logic structure is built around 4-input LUTs with dedicated carry chains, distributed M9K SRAM blocks, and DSP blocks for signal processing. The instant-on flash allows zero-second boot from power-on, enabling use as a companion controller or "glue logic" on platforms that previously required a small CPLD plus a separate FPGA. Typical applications include industrial motor control, factory automation I/O expansion, video bridging, low-cost ASIC prototyping, and consumer display processing. The combination of small footprint, BGA-153 package, and low static power consumption also suits battery-backed devices and portable test instrumentation. When designing with the 10M08SAM153I7G, plan for the 0.5 mm BGA pitch during PCB layout: at least a 4-layer board with microvia stacks and 0.4 mm via-pad design rules is recommended. Bank I/O voltages must be configured via Quartus Prime before generating the programming file, and unused GPIO should be left in a defined high-impedance state through the Pin Planner to avoid leakage. This page synthesizes distributor pricing, drop-in alternatives from the same MAX 10 family, and practical design notes not found in the manufacturer datasheet, giving engineers a one-stop reference for component evaluation and sourcing.
10M08SAU169A7G - MAX 10 FPGA 8K LE 169-UBGA | Intel
The Intel 10M08SAU169A7G is a MAX 10 Field Programmable Gate Array (FPGA) integrating 8,000 logic elements, 378 Kbits of embedded RAM, and 130 user I/Os in a 169-ball Ultra FineLine BGA (UBGA) package. Built on TSMC 55 nm embedded NOR flash technology, this non-volatile FPGA delivers instant-on capability, on-chip dual-configuration flash, and integrated analog-to-digital converters (ADCs) in a single chip. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as memory and DSP slices. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLD), which sit alongside ASICs and microcontrollers as the three main approaches to custom digital hardware. MAX 10 FPGAs specifically occupy the low-power, non-volatile niche, replacing traditional CPLD + external flash + ADC combinations in cost-sensitive industrial and automotive designs. Key features include 8,000 logic elements (4-input LUTs), 378 Kbits (approximately 46 Kbytes) of embedded SRAM, 16 full-precision 18x18 multipliers, and a hard DDR3 memory controller. The 169-UBGA package exposes 130 general-purpose I/Os supporting LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards, while the integrated 12-bit ADC provides up to 1 MSPS sampling across 17 analog inputs. Architecturally, the MAX 10 family uses a logic-array-block (LAB) fabric with 16 logic elements per LAB, and includes embedded NOR flash for single-chip configuration storage. This eliminates the external boot flash typically required by SRAM-based FPGAs from Xilinx and AMD (formerly Xilinx Spartan-6), reducing BOM cost and PCB footprint. The device supports up to 450 MHz internal clock operation via phase-locked loops (PLLs). Typical applications include industrial motor control and factory automation, automotive driver-assistance systems (ADAS), portable medical instruments, video processing for surveillance and machine vision, and I/O expansion for processors. The combination of integrated ADC, flash memory, and small form factor suits space-constrained and cost-optimized designs. When designing with the 10M08SAU169A7G, verify that the 169-UBGA ballmap is compatible with your PCB footprint and that the Quartus Prime toolchain supports the speed grade 7 timing model. For migration paths within the MAX 10 family, the 169-UBGA package is shared with 10M04 and 10M16 variants, enabling scalable logic capacity on a single PCB layout. This page synthesizes distributor pricing, drop-in alternative FPGAs from the same MAX 10 family, comparison parameters, and practical design notes not found in the manufacturer datasheet alone.
10M08SAU169C8G - MAX 10 FPGA, 8K Logic Elements, 169-LFBGA | Intel
The Intel (formerly Altera) 10M08SAU169C8G is a MAX 10 family Field Programmable Gate Array (FPGA) integrating 8,000 logic elements, 387,072 bits of embedded SRAM, and 130 user I/Os into a 169-ball plastic BGA (UBGA-169, 11x11mm, 0.8mm pitch) package. As a non-volatile single-chip FPGA, it incorporates on-chip flash configuration memory that eliminates the need for an external boot PROM and enables instant-on functionality for industrial and automotive designs. The device is built on a low-power 55nm embedded flash process and supports operation across commercial and industrial temperature grades. An FPGA (Field Programmable Gate Array) is a programmable logic device whose architecture comprises an array of configurable logic elements (LEs) interconnected through a programmable routing fabric, surrounded by hard intellectual property (IP) blocks such as embedded memory, phase-locked loops (PLLs), and high-speed transceivers. FPGAs sit within the broader category of programmable logic devices (PLDs) and are widely used for glue logic, custom state machines, high-speed parallel interfaces, hardware-acceleration functions, and ASIC prototyping. The MAX 10 line extends the legacy MAX family by adding an on-chip ADC, Nios II soft-processor support, and dual-configuration flash to deliver true single-chip programmability. Key features of the 10M08SAU169C8G include 8K logic elements (LEs), 173 (approximately) Kbits of dedicated block RAM (M9K), 4 analog PLLs, 2 dedicated fractional PLLs, dual-configuration flash, on-chip ADC support, and DSP blocks for signal processing. The 169-LFBGA footprint supports 130 general-purpose user I/Os operating up to 3.3V LVCMOS/LVTTL, with embedded PCI Express hard IP and DDR3 external memory interface support. Power consumption is typically below 1W at moderate toggle rates, and the 0.8mm ball pitch simplifies PCB manufacturing. Architecturally, MAX 10 devices pair the LE fabric with embedded flash for in-system programmability (ISP) via JTAG, enabling live updates in the field. The device supports JTAG 1149.1 boundary-scan, active serial (AS) configuration, and Altera/Intel Quartus Prime development toolchain. The C8G speed grade and industrial-grade temperature rating make the variant well suited to factory-floor equipment, motor control, and human-machine interface (HMI) controllers. Typical applications include industrial control and factory automation, motor drives and servo control, programmable logic controllers (PLCs), video bridging and display controllers, sensor aggregation for IoT gateways, and low-cost ASIC prototyping. The on-chip flash plus ADC makes the device especially attractive when board area, BOM cost, or instant-on behavior matter more than raw logic density. When designing with this device, ensure the Quartus Prime toolchain matches the device speed grade (C8 = -8 speed grade) and pin-out package (U169). Decoupling strategy should follow Intel's MAX 10 Hardware Reference Guide, and the dual-boot configuration should be exercised when designing fail-safe remote firmware updates.
10M08SAU169I7P - MAX 10 FPGA 8K LE UFBGA-169 | Altera
The Altera (Intel) 10M08SAU169I7P is a member of the MAX 10 family of non-volatile FPGAs integrating 8,000 logic elements, 387,072 bits of embedded SRAM, and a 1.2 V core in a 169-ball Ultra FineLine BGA (UFBGA-169) package. The MAX 10 device combines a traditional FPGA fabric with on-die flash configuration memory and a hard ADC block, eliminating the need for external boot PROMs in many designs. The 'S' speed grade and 'A' automotive-grade screen make this variant suitable for cost-sensitive industrial control, motor drive, and I/O expansion applications. A MAX 10 FPGA belongs to the non-volatile FPGA category, sitting hierarchically below SRAM-only FPGAs (e.g. Cyclone V) and above CPLDs in terms of logic density and embedded feature set. The MAX 10 family integrates user flash, ADC, and DSP blocks directly on-die, allowing single-chip implementation of mixed-signal control designs. Compared to pure CPLDs, MAX 10 devices offer substantially higher logic capacity, embedded multipliers, and DSP support, while preserving instant-on capability from on-chip flash. Key features of the 10M08SAU169I7P include 8,000 logic elements (LEs), 387 Kbits of embedded user SRAM (M9K blocks), 56 embedded 18x18 multipliers, two integrated PLLs, and up to 130 general-purpose I/O pins. The device supports LVCMOS, LVDS, SSTL, and differential I/O standards at data rates suitable for parallel sensor buses, low-speed video, and industrial communication interfaces such as SPI, I2C, UART, and CAN. Typical applications include industrial motor control and PLC interfaces, sensor aggregation hubs, low-cost video processing bridges, machine vision pre-processors, and I/O expansion for SoC-based designs. The integrated 12-bit ADC (up to 17 channels) and DSP blocks make the part especially attractive for mixed-signal data acquisition and signal conditioning tasks. When designing with the 10M08SAU169I7P, plan power sequencing on the 3.3V/2.5V/1.2V rails, observe the BGA escape routing density in the UFBGA-169 footprint, and use the Quartus Prime toolchain for synthesis and place-and-route.
10M08SAU324I7G - MAX 10 FPGA 8K LE, 324-LFBGA | Intel
The Intel 10M08SAU324I7G is a MAX 10 family field-programmable gate array (FPGA) integrating 8000 logic elements, 387,072 bits of embedded user flash memory, and 246 Kbits of general-purpose SRAM in a 324-pin LFBGA (U324) package. Built on TSMC 55 nm embedded flash process technology, it combines a non-volatile FPGA fabric with on-chip analog and digital peripherals, enabling single-chip glue-logic, I/O expansion, and instant-on control solutions. An FPGA (field-programmable gate array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the user defines after manufacture via a hardware description language such as Verilog or VHDL. MAX 10 FPGAs occupy a hybrid position in the programmable logic hierarchy: above fixed-function ASICs in flexibility, below high-density SRAM-based FPGAs in capacity, but unique in offering instant-on capability from on-die flash configuration memory. The 10M08SAU324I7G therefore replaces multiple discrete logic ICs, PLDs, and small CPLDs in cost-sensitive embedded designs. Key features include up to 250 user I/O pins, two integrated 12-bit ADCs supporting 1 MSPS conversion, dual 1.5/3.3 V configuration voltage support, on-die temperature sensing, and an integrated PLL with up to 4 output taps. The 324-LFBGA package exposes the largest I/O count in the 10M08 density tier, suiting industrial automation and motor control boards that require high pin density. Operating junction temperature spans the -40C to +100C industrial range with a 1.2 V core supply. Architecturally, MAX 10 devices embed configuration flash directly on the silicon die, eliminating external boot PROMs and reducing board area. Logic elements are arranged in Logic Array Blocks (LABs) interconnected by MultiTrack interconnect, with embedded memory blocks (M9K) providing true-dual-port RAM. The fabric also includes hardware multipliers (18x18), consumer-grade PCIe hard IP, and an Nios II soft-core processor compatible path for system-on-chip designs. Typical applications include industrial motor control, factory automation I/O expansion, video bridging, sensor fusion, low-cost prototyping, and instant-on replacement of legacy CPLD designs. The combination of flash storage, ADCs, and LVDS-capable I/O makes it well suited for IoT edge nodes that boot in under 10 ms. When designing with the 10M08SAU324I7G, plan power rail sequencing carefully: the 1.2 V core VCC must ramp before VCCA (2.5 V PLL analog) and VCCIO (I/O banks). Use the Quartus Prime design toolchain for compilation, pin planning, and programming - the part supports JTAG (IEEE 1149.1) and Active Serial configuration modes. This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet alone, giving engineers a single reference for the 10M08SAU324I7G selection.
10M08SCE144C8G - MAX 10 FPGA, 8K LE, 144-EQFP | Intel / Altera
The Intel (formerly Altera) MAX 10 10M08SCE144C8G is a non-volatile Field-Programmable Gate Array (FPGA) from the MAX 10 family with 8,000 logic elements (LEs) and 387,072 bits of embedded user flash, housed in a 144-pin EQFP (LQFP with exposed pad) package. As an FPGA IC with 101 user I/Os, the device integrates a 2 Mb flash block (dual-configuration support), 12-bit 1 Msps ADCs, and a PLL, all on a single chip that requires only one supply rail. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) - a category of semiconductor ICs that includes CPLDs and SPLDs - that uses a matrix of configurable logic blocks (CLBs) connected by programmable interconnect. Within the broader computing hierarchy, FPGAs sit between general-purpose microcontrollers and ASICs, offering hardware-level parallelism for glue logic, custom I/O bridging, and DSP workloads. The MAX 10 family is Intel's low-cost, non-volatile FPGA line, designed for single-supply 3.3 V or 2.5 V operation without external boot memory. Key features include 8,000 LEs, 414 Kbits of embedded SRAM (M9K blocks), 378 18x18 multipliers, 4 PLLs, and integrated 12-bit ADCs with up to 18 analog inputs. The 'S' speed grade and 'C8' commercial temperature rating (0 °C to +85 °C) target cost-sensitive industrial and consumer designs, while the '144' package pinout supports up to 101 user I/Os operating at LVCMOS 3.3/2.5/1.8/1.5/1.2 V levels with hot-socketing capability. Architecturally, the 10M08 uses a look-up-table (LUT)-based logic fabric paired with 12-bit SAR ADCs and an embedded flash subsystem that provides instant-on behavior and dual-image configuration - one of the lowest-power non-volatile FPGAs in its class. The device supports internal pull-ups, programmable drive strength, and PCI Express (PIPE) hard IP emulation through soft cores. Typical applications include industrial motor control, factory automation I/O expansion, video bridging and display controllers, low-volume ASIC prototyping, and embedded vision pre-processing. The integrated ADC simplifies designs that previously required a separate analog front-end MCU. When migrating between MAX 10 density points, designers can reuse the 144-pin PCB layout for the 10M04 (4K LE) and 10M16 (16K LE) variants in the same package, simplifying platform scalability.
10M08SCE144I7G - MAX 10 FPGA, 8K LE, 144-LQFP | Intel
The Intel (Altera) 10M08SCE144I7G is a non-volatile MAX 10 field-programmable gate array (FPGA) with 8,000 logic elements, 387,072 bits of embedded memory, and 101 user I/O pins, housed in a 144-pin LQFP exposed-pad (EQFP-144) package. It integrates dual-configuration flash, an internal configuration controller, and an analog-to-digital converter (ADC) block, providing single-chip instant-on functionality at low power. The -7 speed grade and industrial -40C to +100C junction temperature range suit cost-sensitive industrial and consumer designs that need non-volatile logic density. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (LBs/LEs), programmable interconnects, embedded memory (block RAM, M9K), DSP blocks, and I/O cells, all of which can be re-programmed after manufacture. FPGAs sit between microcontrollers and ASICs in the design hierarchy, offering parallel hardware execution, deterministic timing, and rapid time-to-market. The MAX 10 family is Intel's smallest, lowest-cost, non-volatile SRAM-based FPGA family, targeted at glue logic, sensor fusion, industrial control, and bridge/replacement of legacy CPLDs. It belongs to the broader power management hierarchy of programmable logic devices (PLDs), which includes CPLDs and FPGAs. Key features of the 10M08SCE144I7G include 8K logic elements (LEs), 387,072 bits (47.4 Kb) of user flash, 414 Kbits embedded SRAM, two 12-bit analog-to-digital converters (ADCs) supporting up to 16 analog inputs, two PLLs, 1.2V core voltage, and integrated dual-configuration flash that enables field-upgradable bitstreams without external memory. The exposed-pad package provides thermal dissipation for industrial environments. The MAX 10 architecture uses an LUT-based logic fabric backed by M9K memory blocks and 18x18 multiplier blocks for digital signal processing. Its non-volatile flash allows instant-on operation in under 10 ms - a critical feature for industrial motor drives and automotive subsystems that must respond within milliseconds of power-up without waiting for external configuration loading. Typical applications include industrial control and machine automation, sensor data acquisition and pre-processing, video bridging and display controllers, communication protocol bridging (I2C/SPI/UART/CAN), motor control, LED lighting controllers, and as a replacement for legacy 5V-tolerant CPLDs in factory-automation backplanes. When designing with this device, allocate sufficient decoupling capacitance (100 nF near each VCCIO bank plus bulk 10-47 uF) and provide adequate copper pour under the exposed pad to keep junction temperature below 100C. The internal ADC requires clean analog power - route VCCA separately and decouple aggressively to avoid coupling digital switching noise into analog measurements. This page synthesizes distributor pricing, drop-in compatible MAX 10 / MAX V equivalents, and practical design notes not assembled in the manufacturer datasheet.
10M08SCM153C8G - MAX 10 FPGA 8K LE 153-VFBGA | Intel
The Intel (formerly Altera) 10M08SCM153C8G is a MAX 10 family Field Programmable Gate Array (FPGA) with 8,000 logic elements, 387,072 bits of embedded user flash memory, and 378 Kbits of block RAM in a 153-ball FineLine BGA (MBGA, 8x8 mm) package. It targets non-volatile, low-cost programmable logic applications with single-chip integration of FPGA fabric, flash, ADC, and DSP blocks. A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reconfigure after manufacturing. FPGAs sit in the broader hierarchy as programmable logic -> logic ICs -> digital semiconductors. MAX 10 specifically is the low-cost, instant-on, non-volatile FPGA tier from Intel FPGA (formerly Altera), targeting glue logic, I/O expansion, and bridging applications. Key features include 8,000 logic elements (LEs), 387,072 bits (Kb) of user flash memory, 1.4 Mb embedded SRAM (approx. 378 Kbits block RAM distributed as 32 M9K blocks), 112 maximum user I/Os, integrated 12-bit SAR ADC, and on-die flash configuration. The device is fabricated on a 55 nm process, supports 3.0 V/3.3 V core and I/O operation, and offers commercial temperature grade (0C to 85C) for this C8G speed-grade ordering code. The MAX 10 architecture pairs an SRAM-based LUT fabric with a non-volatile configuration flash, eliminating the need for an external boot PROM. The C8G suffix designates a commercial temperature range device with speed grade 8 (slower), delivered in a Pb-free / RoHS-compliant 153-VFBGA. The M153 device code distinguishes it from MAX 10 devices in larger packages (M144, M169, M256, M324, M484, F256, F484, U169, U324) and smaller variants (M81). Typical applications include industrial control and I/O bridging, motor control co-processors, low-cost video processing pipelines, USB Type-C interface expansion, sensor aggregation hubs, and pre-production ASIC prototyping. The integrated 12-bit ADC makes it well suited to industrial monitoring and process control applications. When designing with the 10M08SCM153C8G, ensure the PCB land pattern follows the JEDEC MS-034 style 153-ball MBGA layout (8x8 mm body, 0.5 mm ball pitch). For thermal management, MAX 10 devices in BGA packages dissipate through PCB copper and thermal vias to inner power/ground planes - the MBGA does not require an external heatsink at typical industrial loads. This page synthesizes drop-in alternatives, distributor pricing tiers, and engineering design notes not found in the manufacturer datasheet, including cross-reference with 10M08SCE144, 10M08SAM153, and 10M04SCM153 speed-grade variants.
10M08SCM153I7G - MAX 10 FPGA 8K LE, 153-MBGA | Intel
The Intel / Altera 10M08SCM153I7G is a member of the MAX 10 family of non-volatile, single-chip low-cost programmable logic devices (PLDs). It integrates 8,000 logic elements, 387,072 bits of embedded user flash memory, and 112 general-purpose I/Os in a compact 153-ball MBGA package, targeting cost-sensitive industrial, consumer, and IoT edge applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can re-program after manufacture to implement arbitrary digital functions. MAX 10 FPGAs extend this concept by integrating a non-volatile flash configuration memory on-die, eliminating the external boot PROM required by SRAM-based FPGAs and enabling instant-on operation. Within the broader taxonomy, this places the 10M08 between simple CPLDs and higher-density SRAM FPGAs such as Cyclone V or Stratix 10. Key features of the 10M08SCM153I7G include 8,000 logic elements, 387,072 bits (approximately 378 Kbit) of user flash, up to 414 Kbit of embedded SRAM (M9K blocks), a single 18x18 hardware multiplier block, and an internal configuration flash that supports dual-configuration images for in-field remote updates. The 153-MBGA package exposes 112 user I/Os with support for LVDS, LVCMOS, and SSTL I/O standards, and the device operates from a 3.0 V to 3.3 V core supply with on-chip voltage regulation for the logic fabric. Architecturally, MAX 10 devices combine a LUT-based logic fabric with hard IP blocks such as PLLs, ADCs (on selected variants), and DDR3 memory controllers. The integrated flash is organized in pages and supports read while write, enabling in-application programming without halting user logic. This makes the 10M08 well suited to designs that need deterministic boot time alongside moderate logic density. Typical applications include industrial motor control, factory automation I/O expansion, IoT edge sensor aggregation, low-cost video processing, and consumer display bridging. The 153-MBGA package offers a small footprint for space-constrained PCBs while retaining enough I/O for parallel sensor buses, SPI/QSPI memory expansion, and parallel RGB or LVDS display interfaces. When designing with the 10M08SCM153I7G, pay attention to the I/O bank supply constraints: each bank requires a separate VCCIO rail and the LVDS channels need an external 100-ohm differential termination. Also confirm that your Quartus Prime version supports the 10M08 device family; older Quartus II releases do not include MAX 10 synthesis support. This page synthesizes distributor pricing, drop-in compatible MAX 10 alternatives, and practical PCB design notes that are not consolidated in the manufacturer datasheet or individual distributor listings.
10M08SCU169A7G - MAX 10 FPGA, 8K LE, 169-LFBGA, AEC-Q100 | Intel
The Intel 10M08SCU169A7G is a MAX 10 Field Programmable Gate Array (FPGA) with 8,000 logic elements, 387,072 bits of embedded memory, and 130 user I/O pins, housed in a 169-ball LFBGA (U169) package rated for automotive AEC-Q100 applications. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of programmable logic blocks (LUTs, flip-flops, DSP blocks, and embedded memory) interconnected by a programmable routing fabric. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit hierarchically between fixed-function ASICs (application-specific integrated circuits) and general-purpose microcontrollers. MAX 10 FPGAs integrate a dual-configuration flash, analog-to-digital converters (ADCs), and instant-on support, which makes them useful as glue logic, I/O expansion bridges, and small control planes in industrial and automotive systems. Key features include 8,000 logic elements, 387,072 bits (M9K) of embedded RAM, integrated 12-bit ADCs, on-chip flash for instant-on configuration, and support for LVDS, LVCMOS, SSTL, and other I/O standards. The 169-pin LFBGA package provides 130 user I/O pins with 1.2V core and 3.3V/2.5V/1.8V/1.5V I/O bank operation. The device is built on a 55nm TSMC process and supports commercial, industrial, and automotive temperature grades. The MAX 10 architecture integrates hard IP blocks such as PLLs, embedded memory blocks (M9K), 18x18 multipliers, and an analog front end with ADC support, allowing single-chip implementation of mixed-signal control functions. The device's flash-based configuration provides instant-on capability without external boot memory, simplifying board design and reducing BOM cost compared with SRAM-based FPGAs. Typical applications include industrial motor control, automotive body electronics and infotainment bridges, sensor aggregation in IoT edge nodes, factory automation I/O expansion, and portable medical device signal conditioning. The AEC-Q100 qualification makes the 10M08SCU169A7G specifically suited for under-hood and cabin automotive electronics. When designing with this device, allocate I/O bank voltages carefully to avoid mixing incompatible logic levels, and respect the LFBGA thermal dissipation envelope by providing adequate PCB copper area. Use the Intel Quartus Prime design suite for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives from the MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
10M08SCU169I7G - MAX 10 FPGA 8K LE 169-UBGA | Intel
The Intel 10M08SCU169I7G is a MAX 10 FPGA from the non-volatile MAX 10 family with 8,000 logic elements, 387,072 bits of embedded user flash, and 130 user I/O, housed in a 169-ball Ultra FineLine BGA (U169) package. It is fabricated on TSMC's 55 nm embedded flash process and is one of the lowest-density, lowest-power options in the MAX 10 lineup, aimed at cost-sensitive glue-logic, I/O expansion, and instant-on industrial control applications. What is a non-volatile FPGA? A non-volatile FPGA is a field-programmable gate array that integrates on-chip flash configuration memory, allowing the device to power up instantly into a known working state without an external boot PROM. FPGAs belong to the broader programmable logic family, sitting between fixed-function ASICs and software-driven microcontrollers in terms of flexibility and performance. The MAX 10 family is positioned at the entry level of Intel's (formerly Altera's) FPGA portfolio, bridging the gap between small CPLDs and larger Cyclone-series FPGAs. Key features include 8,000 logic elements, 378 Kbits of embedded SRAM, 4 analog-to-digital converter (ADC) channels at 1 MSPS, 1.2 V core voltage, dual configuration flash, and integrated phase-locked loops (PLLs). The device supports LVDS, LVCMOS, SSTL, and other common I/O standards, and includes hardware multipliers (DSP blocks) and user flash memory configurable as emulation storage or firmware storage. The 10M08SCU169I7G uses Intel's Quartus Prime design software for synthesis, place-and-route, and timing closure. It supports the Nios II soft-core processor, enabling single-chip microcontroller + glue-logic implementations. The integrated ADC, temperature-sensing diodes, and dual-boot flash make it suitable for motor control and industrial sensing front-ends. Typical applications include industrial I/O expansion modules, motor control and drives, video bridging and display controllers, portable medical device front-ends, and low-cost ASIC prototyping. The U169 package footprint is shared with multiple MAX 10 OPNs, enabling PCB reuse across density options. When designing with this part, allocate I/O banks carefully: the U169 package exposes 130 user I/Os across 8 banks, each with its own VCCIO rail. Decouple each VCCIO and VCCINT plane with 100 nF + 10 uF capacitors placed within 3 mm of the balls, and follow Intel's recommended PCB stack-up for fine-pitch BGA breakout. For high-speed LVDS, length-match the differential pairs within the bank. This page synthesizes distributor pricing, same-package drop-in alternatives from the Site MPN list, application circuits, and design notes not consolidated in the manufacturer datasheet.
10M08SCU324C8G - MAX 10 FPGA 8K LE 324-LFBGA | Intel
The Intel (Altera) 10M08SCU324C8G is a MAX 10 family Field Programmable Gate Array (FPGA) that integrates 8,000 logic elements, 378 Kbits of embedded memory (387,072 bits per the DigiKey listing), and 246 user I/O pins in a 324-ball FineLine BGA (LFBGA) package with the commercial speed grade 8 designation. What is a low-density FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable fabric and surrounded by programmable I/O cells. Unlike a fixed-function ASIC, an FPGA's logic function is defined after manufacturing by loading a user bitstream into on-chip SRAM configuration memory. The MAX 10 family belongs to Intel's non-volatile, small-form-factor FPGA tier - positioned below Cyclone in density but above CPLDs in capability, targeting glue-logic replacement, I/O expansion, motor control, and bridge/interface consolidation on a single chip. Key features of the 10M08SCU324C8G include: 8,000 logic elements (LEs) for parallel logic implementation; 378 Kbits (387,072 bits) of embedded SRAM for data buffering and FIFO applications; a 1.2V core operating voltage; integrated ADC block (MAX 10 family feature); on-chip flash configuration memory that makes the device instant-on without an external boot PROM; 246 maximum user I/O supporting LVDS, LVCMOS, SSTL, and other single-ended/differential standards; and a commercial operating temperature range of 0C to +85C. Architecturally, the 10M08 device is built on a TSMC 55nm embedded-flash process. The on-chip flash eliminates the external configuration memory typically required by SRAM-based FPGAs, enabling single-chip designs and sub-100ms power-on-to-user-I/O-active times. The U324 package provides 246 usable I/O with a 1.0mm ball pitch, balancing I/O count against PCB routing complexity for mid-complexity designs. Typical applications include industrial machine vision front-ends, motor control and drive interfaces, low-cost video bridging (e.g., parallel CMOS to MIPI), factory automation I/O concentrators, consumer appliance human-machine interfaces (HMI), and as a logic/interface consolidator replacing multiple CPLDs and discrete glue logic. When designing with the 10M08SCU324C8G, allocate I/O banks according to the voltage standards used (each bank shares a VCCIO rail), provide at least four PCB layers for signal integrity with the BGA fan-out, and leverage the Quartus Prime Lite toolchain (free for MAX 10) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in MAX 10 same-package alternatives, and practical Quartus Prime design notes not found in the manufacturer datasheet.
10M16DAF256C7G - MAX 10 FPGA, 16K LE, 256-LBGA | Intel / Altera
The Intel (formerly Altera) 10M16DAF256C7G is a MAX 10 field-programmable gate array (FPGA) featuring 16,000 logic elements (LE), 562,176 bits of embedded block RAM, and dual-configuration flash in a 256-pin LBGA (F256) package. It integrates non-volatile configuration memory directly on-chip, eliminating the need for an external boot PROM and enabling instant-on operation at power-up. A Field-Programmable Gate Array (FPGA) is a programmable logic device that allows engineers to implement custom digital logic, glue logic, state machines, and parallel processing functions after PCB fabrication. FPGAs sit hierarchically within digital logic ICs -> programmable logic -> PLD -> programmable logic device -> integrated circuit, and are commonly used alongside microcontrollers and ASICs in modern embedded systems. The MAX 10 family is Altera/Intel's low-cost, non-volatile small-form-factor line targeting industrial, automotive, and consumer applications. Key features of the 10M16DAF256C7G include 16K logic elements, an integrated ADC, 178 maximum user I/O pins, and dual supply operation (single 3.3V VCCIO or dual 1.2V core + 3.3V I/O). The device also embeds configuration flash, a JTAG interface, and supports the Quartus Prime design toolchain. The F256 LBGA package provides a compact 17x17 mm footprint suitable for space-constrained embedded boards. Architecturally, the MAX 10 uses a 4-input LUT fabric with embedded RAM blocks (M9K), 18x18 hardware multipliers, and dedicated user flash memory (UFM). The dual-configuration flash enables fail-safe field updates, while the integrated analog-to-digital converter (ADC) supports up to 12-bit conversion for sensor interfacing and system health monitoring. Typical applications include industrial I/O expansion, factory automation controllers, motor drive glue logic, communication protocol bridging (I2C/SPI/UART to Ethernet), and low-volume ASIC replacement. The integrated flash and ADC make it attractive for cost-sensitive designs where the FPGA must boot instantly without external memory. When designing with this part, pay attention to the F256 BGA ball pattern - PCB land pattern verification and X-ray or BGA rework capability are required for prototype assembly. The Quartus Prime design suite must be used for synthesis, place-and-route, and timing closure, and designers should review the MAX 10 pin connection guidelines for unused-pin termination. This page synthesizes distributor pricing, same-package drop-in alternatives from the MAX 10 family, and practical design notes not found in the manufacturer datasheet, helping engineers quickly evaluate the 10M16DAF256C7G against functionally equivalent parts for sourcing decisions.
10M16DAF484A7G - MAX 10 FPGA 16K LE 484-BGA | Intel
The Intel 10M16DAF484A7G is a member of the MAX 10 FPGA family, delivering 16,000 logic elements, 562,176 bits of embedded user flash memory, and 320 Kbits of user SRAM in a 484-ball FineLine BGA package. As the largest density in the MAX 10 DA dual-supply lineup, it combines a non-volatile FPGA fabric with an integrated dual-configuration flash, an internal voltage regulator, and analog-to-digital converter (ADC) blocks on a single die. A field-programmable gate array (FPGA) is a semiconductor IC built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. The MAX 10 family belongs to the low-cost, non-volatile FPGA category, sitting between standard CPLDs and high-performance SRAM-based FPGAs in the programmable logic taxonomy: FPGA > programmable logic > programmable logic IC > semiconductor device. Key features include a 1.0 V core with on-die voltage regulation, support for Nios II embedded processor cores, up to 250 MHz internal operation, integrated ADC blocks, and 3.3 V/1.8 V dual-configuration flash support for instant-on and remote field upgrades. The device also integrates phase-locked loops (PLLs), user I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and DDR3 memory interfaces. Together these features target glue-logic, bridge, and motor-control consolidation roles. The 10M16DAF484 implements a TSMC 55 nm embedded flash process, which is why it ships with both flash and SRAM on the same die. The dual-supply 'DA' variant accepts a separate analog supply for the ADC subsystem, making it the family member of choice when internal sensing of board rails or thermistor voltages is required alongside logic and DSP operations. Typical applications include industrial motor control, factory automation I/O expansion, automotive infotainment and sensor fusion pre-processing, portable medical instrumentation, and bridge/legacy interface consolidation in embedded systems. Its instant-on capability also suits safety-critical and deterministic-boot applications. Compared with SRAM-based FPGAs, the MAX 10 removes the need for a separate boot PROM, reducing BOM cost and board area. When designing with this device, allocate sufficient PCB area for the 484-BGA FineLine BGA breakout and review the Quartus Prime pin planner for bank voltage constraints. Ensure the JTAG chain integrity for in-system programming and that the dual-supply power sequencing follows Intel's MAX 10 hardware design guide. For high-speed DDR3 interfaces, follow the matched-length and decoupling recommendations in the device handbook. This page synthesizes Intel official product information, distributor pricing, drop-in same-package alternatives from the MAX 10 and Cyclone families, and practical design notes that are not aggregated on a single manufacturer or distributor page.
10M16DAF484C7G - MAX 10 FPGA 16K LE 484-FBGA | Intel
The Intel (formerly Altera) 10M16DAF484C7G is a MAX 10 non-volatile FPGA with 16,000 logic elements, 320 general-purpose I/O, and 484-ball FBGA packaging, fabricated on a 55 nm TSMC process. It integrates dual-configuration flash, 12-bit ADC blocks, and on-chip voltage regulators, making it a single-chip programmable logic solution for industrial and consumer designs. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (LBs), programmable interconnect, and I/O cells that engineers can re-program after manufacture. MAX 10 FPGAs belong to the low-power, non-volatile FPGA family within the programmable logic hierarchy, sitting alongside CPLDs at the low-density end and below high-performance SRAM-based FPGAs such as Cyclone or Stratix. They combine FPGA fabric with hard IP (ADC, flash, PLLs) on a single die, eliminating the external boot PROM required by older SRAM FPGAs. Key specifications include 16,000 logic elements, 562 Kbits embedded user flash, 504 Kbits (10,240 x 5) user RAM, 320 maximum user I/Os, two 12-bit ADC blocks supporting up to 18 analog inputs, and four general-purpose PLLs. The -7C speed grade targets commercial 0C to 85C operation, while the integrated flash supports instant-on and dual-boot image storage. The 484-FBGA package offers 23 mm x 23 mm body size with 1.0 mm pitch, suitable for high-density PCB designs. MAX 10 FPGAs use a look-up-table (LUT)-based logic fabric with 8-input fracturable LUTs, dedicated 18x18 multipliers, and embedded memory blocks (M9K) totaling 10,240 bits per block. The hard ADC subsystem uses successive-approximation-register (SAR) cores and can sample at up to 1 MSPS per channel, enabling sensor conditioning without external ADC chips. The dual-boot flash enables fail-safe field updates, while on-chip PLLs synthesize system clocks without external clock generators. Typical applications include industrial motor control, factory automation PLCs, video bridging and image processing pipelines, IoT edge nodes with on-board analog monitoring, and low-cost display controllers. The combination of non-volatile configuration, integrated ADCs, and DSP blocks makes 10M16DAF484C7G a strong fit for designs that previously required an MCU plus CPLD plus discrete ADC. When designing with this FPGA, plan for Quartus Prime toolchain support and confirm pinout against the device-specific F484 package pin tables. The integrated ADC requires a dedicated analog supply (VCCA) and decoupling per Intel MAX 10 device design guidelines; mismatched decoupling degrades ADC SNR. Use the FPGA's JTAG or internal oscillator for early bring-up before switching to an external clock. This page synthesizes verified distributor pricing, drop-in package-compatible alternatives, and Quartus-aware design notes that go beyond the standalone datasheet. Source: Intel MAX 10 datasheet family, fetched 2026-09-05.
10M16DAF484I7G - MAX 10 FPGA 16K LE 484-FBGA | Intel / Altera
The Intel (Altera) 10M16DAF484I7G is a non-volatile FPGA from the MAX 10 family, integrating 16,000 logic elements and 562,176 bits of embedded SRAM into a 484-pin FineLine BGA package. The device delivers up to 472.5 MHz internal operation, 320 general-purpose I/O pins, and a single 1.2 V core supply fabricated on a 55 nm TSMC process. Industrial temperature grade (-40C to +100C) and on-die flash configuration memory make it suited to cost-sensitive embedded designs that need instant-on behavior without an external boot PROM. A field-programmable gate array (FPGA) is a reconfigurable digital logic device built from an array of configurable logic blocks (LBs), programmable interconnect, and I/O cells, sitting in the broader semiconductor hierarchy between ASICs and CPLDs. Unlike ASICs, FPGAs can be re-programmed in the field; unlike CPLDs, modern FPGAs like MAX 10 embed block RAM, DSP blocks, PLLs, and increasingly hard processor cores. MAX 10 specifically bridges CPLD simplicity and FPGA density by integrating dual-configuration flash, ADCs, and DSP blocks onto a single die. Key features of the 10M16DAF484I7G include 16K logic elements, 562 Kbit embedded SRAM, 45 embedded 18x18 multipliers, four general-purpose PLLs, and two analog-to-digital converters (ADCs) on-chip. The integrated flash eliminates the need for external boot memory, enabling instant-on configuration under 10 ms. Hard memory controllers, I/O flexibility supporting LVDS, SSTL, and LVCMOS up to 3.0 V, and PCI Express hard IP blocks allow the device to handle industrial and consumer control planes without companion ICs. Architecturally, the MAX 10 family uses a logic-array-block (LAB) fabric with 10-input adaptive logic modules (ALMs), routing switches implemented in 55 nm flash process technology, and dedicated DSP and RAM blocks. The internal flash cell stores the configuration image and supports dual-boot for fail-safe updates. Hard PCIe Gen2 endpoint IP is available in higher-density MAX 10 variants, but the 10M16 provides the same IP infrastructure at lower LE count for cost-optimized links. Typical applications include industrial motor control, factory automation I/O expansion, video bridging and image processing, low-cost PCIe endpoint cards, and portable test & measurement instrumentation. The integrated ADC allows direct sensor interfacing without an external ADC, while the DSP blocks accelerate filtering and motor-control loops at deterministic latency. When designing with this device, ensure proper decoupling - at least 100 nF ceramic capacitors at every VCC pin plus bulk decoupling on each supply rail. The FBGA-484 substrate requires a 1.0 mm pitch PCB land pattern with controlled-impedance routing for high-speed LVDS pairs, and JTAG access must be brought out to a 10-pin header for in-system programming and debug. This page synthesizes distributor pricing across DigiKey, Mouser, Arrow, and Octopart, drop-in alternatives from the same MAX 10 family, and practical design notes not found in the manufacturer datasheet.