10M08SAU169I7P - MAX 10 FPGA 8K LE UFBGA-169 | Altera
MPN: 10M08SAU169I7P ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.1 | $12,050.00 |
| 1,000 | $20.5 | $20,500.00 |
Drop-in alternatives for 10M08SAU169I7P — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10M08SAU169C8G
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View Datasheet →10M08SAU169I7P Maximum Ratings & Electrical Characteristics
| Manufacturer | Altera (Intel) |
| Family | MAX 10 |
| Logic Elements | 8,000 |
| Embedded Memory | 387,072 bits (M9K blocks) |
| Embedded Multipliers | 56 (18x18) |
| Maximum User I/O | 130 |
| Package | 169-UFBGA (UBGA-169, 11x11 mm) |
| Core Voltage | 1.2 V |
| Process Technology | 55 nm |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | S (slowest) |
| On-chip Flash | Yes (non-volatile configuration) |
| PLLs | 2 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10M08SAU169I7P 169-ufbga (ubga-169, 11x11 mm) Pin Configuration Guide
Complete pinout information for 10M08SAU169I7P (169-ufbga (ubga-169, 11x11 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08SAU169I7P.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M08SAU169I7P is suitable for 6 applications: Industrial Motor Control, PLC and I/O Expansion, Sensor Aggregation Hub, Low-Cost Video Bridging, Automotive Infotainment Auxiliary, Test & Measurement Front-End.
Industrial Motor Control
The 10M08SAU169I7P suits single-axis and multi-axis industrial motor control designs where its 8,000 LEs and 56 18x18 multipliers can host Field-Oriented Control (FOC) IP cores. The 12-bit on-chip ADC samples phase currents at high rate while DSP blocks execute Clarke/Park transforms. The UFBGA-169 footprint allows compact PCB integration near power stages. Industrial -40C to +100C rating supports factory-floor deployment.
Recommended
PLC and I/O Expansion
Used as an I/O expander or protocol-bridging coprocessor alongside a main MCU/SoC in PLC backplanes, the 10M08SAU169I7P offers 130 user I/Os supporting LVCMOS 3.3V, 2.5V, 1.8V, and LVDS standards. This enables glue-logic functions, signal level translation, and protocol conversion (e.g. parallel-to-SPI, UART-to-CAN). The non-volatile on-chip flash eliminates external boot devices, simplifying PLC module design.
Recommended
Sensor Aggregation Hub
The 10M08SAU169I7P aggregates multiple sensor streams (SPI, I2C, UART, analog via on-chip ADC) in industrial IoT edge nodes. Its 8K LEs handle protocol framing and pre-processing while 387 Kbits SRAM buffers bursts before forwarding to a higher-level processor. The industrial temperature range and small UFBGA-169 footprint suit DIN-rail mounted edge gateways with limited thermal budget.
Recommended
Low-Cost Video Bridging
The 10M08SAU169I7P bridges low-resolution CMOS sensor parallel interfaces to MIPI CSI-2 or RGB-to-MIPI converters in cost-sensitive embedded vision applications. The 56 18x18 multipliers support real-time color-space conversion and scaling. The integrated flash configuration supports instant-on camera initialization. This is suitable for machine vision pre-processors, smart appliances, and entry-level surveillance cameras.
Recommended
Automotive Infotainment Auxiliary
For non-safety-critical automotive infotainment auxiliary functions (e.g. display backlight control, button matrix scanning, audio routing glue logic), the 10M08SAU169A7G variant (AEC-Q100 screened) is a more stringent drop-in upgrade. The 10M08SAU169I7P itself suits industrial-grade automotive adjacent applications where AEC-Q100 is not strictly required. The UFBGA-169 footprint allows compact module placement.
Recommended
Test & Measurement Front-End
In bench-top test instruments and data loggers, the 10M08SAU169I7P serves as a flexible front-end with its on-chip 12-bit ADC (multi-channel) plus 130 GPIO for instrument switching matrices. The DSP blocks implement real-time FIR/IIR filtering on acquired signals. Industrial temperature range and non-volatile boot make it suitable for portable and lab-deployed equipment with field-upgrade requirements.
Recommended
Recommended Products Summary
Engineering reference data for 10M08SAU169I7P — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08SAU169C8G | 10M08SAU169A7G | 10M04SAU169I7G |
|---|---|---|---|---|
| Package | 169-UFBGA (11x11 mm) | 169-UFBGA (11x11 mm) - same | 169-UFBGA (11x11 mm) - same | 169-UFBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | MAX 10 | MAX 10 | MAX 10 | MAX 10 |
| Logic Elements | 8,000 | 8,000 | 8,000 | 4,000 (-50%) |
| Embedded Memory | 387,072 bits | 387,072 bits | 387,072 bits | 189,440 bits (-51%) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Automotive (AEC-Q100) | Industrial (-40C to +100C) |
| Speed Grade | S (slowest) | 8 (faster) | 7 | 7 |
| Embedded Multipliers (18x18) | 56 | 56 | 56 | 30 (-46%) |
| Maximum User I/O | 130 | 130 | 130 | 130 |
Key Differentiators
- Industrial temperature range with full MAX 10 feature set (vs 10M08SAU169C8G)
- Largest logic capacity in the 169-UFBGA MAX 10 footprint (vs 10M04SAU169I7G)
- Slower speed grade gives better power/thermal margin (vs 10M08SAU169C8G (speed grade 8))
Design Notes
The 169-UFBGA package has 0.65 mm ball pitch on an 11x11 mm substrate. Use a 4-layer PCB with microvia-in-pad or dogbone fan-out escape routing for high-density signals. Per Altera MAX 10 hardware design guidelines, place at least 4 ground vias in the central BGA thermal/ground pad to ensure proper thermal dissipation and ground return path integrity.
Estimated: MAX 10 FPGA core draws approximately 100-300 mA at 1.2V depending on logic utilization. The UFBGA-169 package requires a 3.3V auxiliary supply (VCCA) and 2.5V/1.8V selectable supply for I/O banks per the MAX 10 device handbook. Use low-dropout regulators with 1% accuracy and add bulk + decoupling capacitors (10 uF + 100 nF) close to each power pin pair.
Do not assume UFBGA-169 is interchangeable with EQFP-144 or MBGA-153 pinouts - the ball map differs even at the same family. When migrating designs between MAX 10 packages, regenerate the Quartus Prime pin assignments from scratch. Also note that the 'S' speed grade is the slowest; for designs requiring higher Fmax, use speed grade 7 or 8 variants.
Compliance Information
RoHS and REACH compliant per Altera product page. Not AEC-Q100 qualified - choose 10M08SAU169A7G for automotive applications.