EP3SE110F1152C2 vs EP3SE110F1152C4 Comparison
Detailed side-by-side comparison of EP3SE110F1152C2 by Intel and EP3SE110F1152C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel
EP3SE110F1152C2 ⚠ Last Time BuyIntel
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4 ⚠ Last Time BuySpecification Comparison
| Parameter | EP3SE110F1152C2 | EP3SE110F1152C4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Last Time Buy |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Logic Elements | 107,500 | 107,500 |
| Logic Array Blocks (LABs) | 4,300 | [DATA_NEEDED: LAB count] |
| Adaptive Logic Modules (ALMs) | 53,750 | — |
| Embedded Memory (bits) | 8,936,448 | — |
| Maximum User I/Os | 744 | 744 |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 0.9 V | 1.1 V |
| Maximum Internal Frequency | 800 MHz | — |
| Operating Temperature | 0C to 85C (Commercial) | — |
| Package | 1152-ball FC-BGA | — |
| Package Code | F1152 | — |
| Mounting Type | Surface Mount (BGA) | — |
| Device Type | FPGA | — |
| Configuration | SRAM-based, volatile (requires configuration device) | — |
| Embedded Memory | — | 8,936,448 bits |
| DSP Blocks | — | [DATA_NEEDED: 18x18 multiplier count] |
| Maximum Performance | — | 450 MHz |
| Package Type | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Operating Temperature Grade | — | Commercial (C4) |
| Configuration Memory | — | SRAM-based (volatile) |
| On-chip Termination | — | Dynamic, programmable |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL |
| RoHS Status | — | Compliant |