EP3SE110F1152C2 vs EP3SE110F1152C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F1152C2 sa pamamagitan ng Intel at EP3SE110F1152C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel
EP3SE110F1152C2 ⚠ Huling PagbiliIntel
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE110F1152C2 | EP3SE110F1152C4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Logic Elements | 107,500 | 107,500 |
| Logic Array Blocks (LABs) | 4,300 | [DATA_NEEDED: LAB count] |
| Adaptive Logic Modules (ALMs) | 53,750 | — |
| Embedded Memory (bits) | 8,936,448 | — |
| Maximum User I/Os | 744 | 744 |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 0.9 V | 1.1 V |
| Maximum Internal Frequency | 800 MHz | — |
| Temperature na Operasyon | 0C to 85C (Commercial) | — |
| Packhaging | 1152-ball FC-BGA | — |
| Package Code | F1152 | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Device Type | FPGA | — |
| Configuration | SRAM-based, volatile (requires configuration device) | — |
| Embedded Memory | — | 8,936,448 bits |
| DSP Blocks | — | [DATA_NEEDED: 18x18 multiplier count] |
| Maximum Performance | — | 450 MHz |
| Package Type | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Operating Temperature Grade | — | Commercial (C4) |
| Configuration Memory | — | SRAM-based (volatile) |
| On-chip Termination | — | Dynamic, programmable |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL |
| Tindminan RoHS | — | Compliant |