EP3SE110F1152C2 vs EP3SE110F1152C4 比較
詳細並排比較 EP3SE110F1152C2 由 Intel 與 EP3SE110F1152C4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE110F1152C2 | EP3SE110F1152C4 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 最後購買 |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Logic Elements | 107,500 | 107,500 |
| Logic Array Blocks (LABs) | 4,300 | [DATA_NEEDED: LAB count] |
| Adaptive Logic Modules (ALMs) | 53,750 | — |
| Embedded Memory (bits) | 8,936,448 | — |
| Maximum User I/Os | 744 | 744 |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 0.9 V | 1.1 V |
| Maximum Internal Frequency | 800 MHz | — |
| 工作溫度 | 0C to 85C (Commercial) | — |
| 封裝 | 1152-ball FC-BGA | — |
| Package Code | F1152 | — |
| 安裝類型 | Surface Mount (BGA) | — |
| Device Type | FPGA | — |
| Configuration | SRAM-based, volatile (requires configuration device) | — |
| Embedded Memory | — | 8,936,448 bits |
| DSP Blocks | — | [DATA_NEEDED: 18x18 multiplier count] |
| Maximum Performance | — | 450 MHz |
| Package Type | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Operating Temperature Grade | — | Commercial (C4) |
| Configuration Memory | — | SRAM-based (volatile) |
| On-chip Termination | — | Dynamic, programmable |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL |
| RoHS 狀態 | — | Compliant |