EP3SE110F1152C4N vs EP3SE110F1152C4 Comparison

Detailed side-by-side comparison of EP3SE110F1152C4N by Intel and EP3SE110F1152C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE110F1152C4N EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel

EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel

EP3SE110F1152C4N ⚠ Last Time Buy
Intel
EP3SE110F1152C4 EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE110F1152C4N EP3SE110F1152C4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $1,395.00 $2,200.00
Family Stratix III Enhanced (E) Stratix III E
Logic Elements 107,500 107,500
Memory Bits 8,936,448 β€”
Embedded Multipliers (18x18) 896 β€”
Logic Array Blocks (LABs) 4300 [DATA_NEEDED: LAB count]
User I/O Pins 744 β€”
Core Voltage 1.1 V 1.1 V
Process Technology 65 nm 65 nm
Maximum Operating Frequency 450 MHz β€”
Package 1152-ball FCBGA (Flip-Chip BGA) β€”
Mounting Type Surface Mount β€”
Operating Temperature 0C to +85C (Commercial) β€”
Configuration Method Passive Serial / Fast Passive Parallel / JTAG / AES-256 β€”
RoHS Status Compliant Compliant
MSL Level 3 (168 hours) β€”
Design Software Quartus II (v9.1 or later) β€”
Embedded Memory β€” 8,936,448 bits
Maximum User I/Os β€” 744
DSP Blocks β€” [DATA_NEEDED: 18x18 multiplier count]
Maximum Performance β€” 450 MHz
Package Type β€” 1152-ball FCBGA (Flip-Chip BGA)
Operating Temperature Grade β€” Commercial (C4)
Configuration Memory β€” SRAM-based (volatile)
On-chip Termination β€” Dynamic, programmable
I/O Standards Supported β€” LVDS, LVTTL, LVCMOS, HSTL, SSTL

Datasheets & Resources

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