EP3SE110F1152C4N vs EP3SE110F1152C4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F1152C4N disebabkan oleh Intel dan EP3SE110F1152C4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
EP3SE110F1152C4N ⚠ Bahagian terakhir untuk beliIntel
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE110F1152C4N | EP3SE110F1152C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Family | Stratix III Enhanced (E) | Stratix III E |
| Logic Elements | 107,500 | 107,500 |
| Memory Bits | 8,936,448 | — |
| Embedded Multipliers (18x18) | 896 | — |
| Logic Array Blocks (LABs) | 4300 | [DATA_NEEDED: LAB count] |
| User I/O Pins | 744 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm |
| Maximum Operating Frequency | 450 MHz | — |
| Kemasan | 1152-ball FCBGA (Flip-Chip BGA) | — |
| Jenis Pemasangan | Surface Mount | — |
| Suhu Operasi | 0C to +85C (Commercial) | — |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG / AES-256 | — |
| Status RoHS | Compliant | Compliant |
| Aras MSL | 3 (168 hours) | — |
| Design Software | Quartus II (v9.1 or later) | — |
| Embedded Memory | — | 8,936,448 bits |
| Maximum User I/Os | — | 744 |
| DSP Blocks | — | [DATA_NEEDED: 18x18 multiplier count] |
| Maximum Performance | — | 450 MHz |
| Package Type | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Operating Temperature Grade | — | Commercial (C4) |
| Configuration Memory | — | SRAM-based (volatile) |
| On-chip Termination | — | Dynamic, programmable |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL |