EP3SE110F1152C4N vs EP3SE110F1152C4 Perbandingan
Perbandingan bersamaan detil EP3SE110F1152C4N dari Intel dan EP3SE110F1152C4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
EP3SE110F1152C4N ⚠ Waktu Beli TerakhirIntel
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE110F1152C4N | EP3SE110F1152C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Waktu Pembelian Terakhir |
| Family | Stratix III Enhanced (E) | Stratix III E |
| Logic Elements | 107,500 | 107,500 |
| Memory Bits | 8,936,448 | — |
| Embedded Multipliers (18x18) | 896 | — |
| Logic Array Blocks (LABs) | 4300 | [DATA_NEEDED: LAB count] |
| User I/O Pins | 744 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm |
| Maximum Operating Frequency | 450 MHz | — |
| Paket | 1152-ball FCBGA (Flip-Chip BGA) | — |
| Tipe Mounting | Surface Mount | — |
| Suhu Kerja | 0C to +85C (Commercial) | — |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG / AES-256 | — |
| Status RoHS | Compliant | Compliant |
| Level MSL | 3 (168 hours) | — |
| Design Software | Quartus II (v9.1 or later) | — |
| Embedded Memory | — | 8,936,448 bits |
| Maximum User I/Os | — | 744 |
| DSP Blocks | — | [DATA_NEEDED: 18x18 multiplier count] |
| Maximum Performance | — | 450 MHz |
| Package Type | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Operating Temperature Grade | — | Commercial (C4) |
| Configuration Memory | — | SRAM-based (volatile) |
| On-chip Termination | — | Dynamic, programmable |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL |