EP3SE110F1152C4N vs EP3SE110F1152C4 比較

詳細並排比較 EP3SE110F1152C4N 由 Intel 與 EP3SE110F1152C4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE110F1152C4N EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel

EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel

EP3SE110F1152C4N ⚠ 最後購買機會
Intel
EP3SE110F1152C4 EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 ⚠ 最後購買機會

規格比較

參數 EP3SE110F1152C4N EP3SE110F1152C4
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 最後購買
Family Stratix III Enhanced (E) Stratix III E
Logic Elements 107,500 107,500
Memory Bits 8,936,448 —
Embedded Multipliers (18x18) 896 —
Logic Array Blocks (LABs) 4300 [DATA_NEEDED: LAB count]
User I/O Pins 744 —
Core Voltage 1.1 V 1.1 V
Process Technology 65 nm 65 nm
Maximum Operating Frequency 450 MHz —
封裝 1152-ball FCBGA (Flip-Chip BGA) —
安裝類型 Surface Mount —
工作溫度 0C to +85C (Commercial) —
Configuration Method Passive Serial / Fast Passive Parallel / JTAG / AES-256 —
RoHS 狀態 Compliant Compliant
MSL 等級 3 (168 hours) —
Design Software Quartus II (v9.1 or later) —
Embedded Memory — 8,936,448 bits
Maximum User I/Os — 744
DSP Blocks — [DATA_NEEDED: 18x18 multiplier count]
Maximum Performance — 450 MHz
Package Type — 1152-ball FCBGA (Flip-Chip BGA)
Operating Temperature Grade — Commercial (C4)
Configuration Memory — SRAM-based (volatile)
On-chip Termination — Dynamic, programmable
I/O Standards Supported — LVDS, LVTTL, LVCMOS, HSTL, SSTL

資料表與資源

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