EP3SE260F1152C2N vs EP3SE260F1152C4N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C2N disebabkan oleh Intel dan EP3SE260F1152C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SE260F1152C2N EP3SE260F1152C4N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Obsolete
Series Stratix III E Stratix III E
Family FPGA - Field Programmable Gate Array Stratix III (Enhanced)
Number of Logic Elements 255000 —
Number of LABs/CLBs 10200 10,200
Total Memory Bits 16672768 —
Number of I/O 744 —
Voltage - Supply 1.1 V —
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Suhu Operasi [DATA_NEEDED: operating temperature grade] 0C to +85C (commercial, 'C' suffix)
Kemasan / Case 1152-BBGA, FCBGA —
Process Technology 65 nm 65 nm CMOS
Maximum Frequency 600 MHz —
Supplier Device Package 1152-FCBGA —
Aras MSL [DATA_NEEDED: MSL rating] —
Status RoHS Compliant —
Lead Free Yes (per EP3SE260F1152C2G comparison) —
ECCN [DATA_NEEDED: ECCN code] —
Moisture Sensitivity [DATA_NEEDED: MSL level] —
Logic Elements (LEs) — 255,000
Embedded Memory — 16,672,768 bits (16.67 Mbit)
Maximum User I/Os — 744
DSP / 18x18 Multipliers — 768 embedded multipliers
Core Voltage — 1.1 V
Maximum Operating Frequency — 450 MHz
Kemasan — 1152-ball FC-FBGA (flip-chip)
Speed Grade — -4 (commercial temperature)
Packaging — Tray
Lead-Free / RoHS — Lead-free finish (RoHS compliant per distributor listing)
Jenis Ingatan — SRAM-based, volatile (requires configuration device)
Configuration — External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status — Obsolete (per Xecor cross-reference data)

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