EP3SE260F1152C2N vs EP3SE260F1152C4N 比較
詳細並排比較 EP3SE260F1152C2N 由 Intel 與 EP3SE260F1152C4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260F1152C2N | EP3SE260F1152C4N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Series | Stratix III E | Stratix III E |
| Family | FPGA - Field Programmable Gate Array | Stratix III (Enhanced) |
| Number of Logic Elements | 255000 | — |
| Number of LABs/CLBs | 10200 | 10,200 |
| Total Memory Bits | 16672768 | — |
| Number of I/O | 744 | — |
| Voltage - Supply | 1.1 V | — |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| 工作溫度 | [DATA_NEEDED: operating temperature grade] | 0C to +85C (commercial, 'C' suffix) |
| 封裝 / 外殼 | 1152-BBGA, FCBGA | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Maximum Frequency | 600 MHz | — |
| Supplier Device Package | 1152-FCBGA | — |
| MSL 等級 | [DATA_NEEDED: MSL rating] | — |
| RoHS 狀態 | Compliant | — |
| Lead Free | Yes (per EP3SE260F1152C2G comparison) | — |
| ECCN | [DATA_NEEDED: ECCN code] | — |
| Moisture Sensitivity | [DATA_NEEDED: MSL level] | — |
| Logic Elements (LEs) | — | 255,000 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | — | 744 |
| DSP / 18x18 Multipliers | — | 768 embedded multipliers |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 450 MHz |
| 封裝 | — | 1152-ball FC-FBGA (flip-chip) |
| Speed Grade | — | -4 (commercial temperature) |
| Packaging | — | Tray |
| Lead-Free / RoHS | — | Lead-free finish (RoHS compliant per distributor listing) |
| 記憶體類型 | — | SRAM-based, volatile (requires configuration device) |
| Configuration | — | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |
| Product Status | — | Obsolete (per Xecor cross-reference data) |