EP3SE260F1152C2N vs EP3SE260F1152C4N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C2N sa pamamagitan ng Intel at EP3SE260F1152C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C2N EP3SE260F1152C4N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Series Stratix III E Stratix III E
Family FPGA - Field Programmable Gate Array Stratix III (Enhanced)
Number of Logic Elements 255000 —
Number of LABs/CLBs 10200 10,200
Total Memory Bits 16672768 —
Number of I/O 744 —
Voltage - Supply 1.1 V —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Temperature na Operasyon [DATA_NEEDED: operating temperature grade] 0C to +85C (commercial, 'C' suffix)
Packhaging / Kaso 1152-BBGA, FCBGA —
Process Technology 65 nm 65 nm CMOS
Maximum Frequency 600 MHz —
Supplier Device Package 1152-FCBGA —
Level ng MSL [DATA_NEEDED: MSL rating] —
Tindminan RoHS Compliant —
Lead Free Yes (per EP3SE260F1152C2G comparison) —
ECCN [DATA_NEEDED: ECCN code] —
Moisture Sensitivity [DATA_NEEDED: MSL level] —
Logic Elements (LEs) — 255,000
Embedded Memory — 16,672,768 bits (16.67 Mbit)
Maximum User I/Os — 744
DSP / 18x18 Multipliers — 768 embedded multipliers
Core Voltage — 1.1 V
Maximum Operating Frequency — 450 MHz
Packhaging — 1152-ball FC-FBGA (flip-chip)
Speed Grade — -4 (commercial temperature)
Packaging — Tray
Lead-Free / RoHS — Lead-free finish (RoHS compliant per distributor listing)
Uri ng Memory — SRAM-based, volatile (requires configuration device)
Configuration — External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status — Obsolete (per Xecor cross-reference data)

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