EP3SE260F1152I4LN vs EP3SE260F1152C4N Comparison

Detailed side-by-side comparison of EP3SE260F1152I4LN by Intel and EP3SE260F1152C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152I4LN EP3SE260F1152C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $3,520.00 $1,620.00
Family Stratix III E Stratix III (Enhanced)
Process Node 65 nm CMOS β€”
Logic Elements (LE) 255,000 β€”
Logic Array Blocks (LAB) 10,200 β€”
Embedded Memory Bits 16,672,640 β€”
User I/Os 744 β€”
Package FCBGA-1152 (1517-ball) 1152-ball FC-FBGA (flip-chip)
Package Dimensions 35 x 35 mm β€”
Core Voltage 0.9 V (supports 1.05-1.15 V variant) 1.1 V
Operating Temperature -40 C to +100 C (Industrial) 0C to +85C (commercial, 'C' suffix)
Operating Frequency Up to 717 MHz β€”
Mounting Type Surface Mount Surface Mount (BGA)
Supply Voltage Range 0.9 V core, 1.05 V-1.15 V supported β€”
Series Stratix III Stratix III E
RoHS Status Compliant β€”
Design Tool Quartus II β€”
Logic Elements (LEs) β€” 255,000
Embedded Memory β€” 16,672,768 bits (16.67 Mbit)
Maximum User I/Os β€” 744
Number of LABs/CLBs β€” 10,200
DSP / 18x18 Multipliers β€” 768 embedded multipliers
Process Technology β€” 65 nm CMOS
Maximum Operating Frequency β€” 450 MHz
Speed Grade β€” -4 (commercial temperature)
Packaging β€” Tray
Lead-Free / RoHS β€” Lead-free finish (RoHS compliant per distributor listing)
Memory Type β€” SRAM-based, volatile (requires configuration device)
Configuration β€” External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status β€” Obsolete (per Xecor cross-reference data)

Datasheets & Resources

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