EP3SE260F1152I4LN vs EP3SE260F1152C4N Perbandingan
Perbandingan bersamaan detil EP3SE260F1152I4LN dari Intel dan EP3SE260F1152C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260F1152I4LN | EP3SE260F1152C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Family | Stratix III E | Stratix III (Enhanced) |
| Process Node | 65 nm CMOS | — |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LAB) | 10,200 | — |
| Embedded Memory Bits | 16,672,640 | — |
| User I/Os | 744 | — |
| Paket | FCBGA-1152 (1517-ball) | 1152-ball FC-FBGA (flip-chip) |
| Package Dimensions | 35 x 35 mm | — |
| Core Voltage | 0.9 V (supports 1.05-1.15 V variant) | 1.1 V |
| Suhu Kerja | -40 C to +100 C (Industrial) | 0C to +85C (commercial, 'C' suffix) |
| Operating Frequency | Up to 717 MHz | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Supply Voltage Range | 0.9 V core, 1.05 V-1.15 V supported | — |
| Series | Stratix III | Stratix III E |
| Status RoHS | Compliant | — |
| Design Tool | Quartus II | — |
| Logic Elements (LEs) | — | 255,000 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | — | 744 |
| Number of LABs/CLBs | — | 10,200 |
| DSP / 18x18 Multipliers | — | 768 embedded multipliers |
| Process Technology | — | 65 nm CMOS |
| Maximum Operating Frequency | — | 450 MHz |
| Speed Grade | — | -4 (commercial temperature) |
| Packaging | — | Tray |
| Lead-Free / RoHS | — | Lead-free finish (RoHS compliant per distributor listing) |
| Tipe Memori | — | SRAM-based, volatile (requires configuration device) |
| Configuration | — | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |
| Product Status | — | Obsolete (per Xecor cross-reference data) |