EP3SE260F1152I4LN vs EP3SE260F1152C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152I4LN disebabkan oleh Intel dan EP3SE260F1152C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE260F1152I4LN | EP3SE260F1152C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Family | Stratix III E | Stratix III (Enhanced) |
| Process Node | 65 nm CMOS | — |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LAB) | 10,200 | — |
| Embedded Memory Bits | 16,672,640 | — |
| User I/Os | 744 | — |
| Kemasan | FCBGA-1152 (1517-ball) | 1152-ball FC-FBGA (flip-chip) |
| Package Dimensions | 35 x 35 mm | — |
| Core Voltage | 0.9 V (supports 1.05-1.15 V variant) | 1.1 V |
| Suhu Operasi | -40 C to +100 C (Industrial) | 0C to +85C (commercial, 'C' suffix) |
| Operating Frequency | Up to 717 MHz | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Supply Voltage Range | 0.9 V core, 1.05 V-1.15 V supported | — |
| Series | Stratix III | Stratix III E |
| Status RoHS | Compliant | — |
| Design Tool | Quartus II | — |
| Logic Elements (LEs) | — | 255,000 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | — | 744 |
| Number of LABs/CLBs | — | 10,200 |
| DSP / 18x18 Multipliers | — | 768 embedded multipliers |
| Process Technology | — | 65 nm CMOS |
| Maximum Operating Frequency | — | 450 MHz |
| Speed Grade | — | -4 (commercial temperature) |
| Packaging | — | Tray |
| Lead-Free / RoHS | — | Lead-free finish (RoHS compliant per distributor listing) |
| Jenis Ingatan | — | SRAM-based, volatile (requires configuration device) |
| Configuration | — | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |
| Product Status | — | Obsolete (per Xecor cross-reference data) |