EP3SE260F1152I4LN vs EP3SE260F1152C4N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152I4LN sa pamamagitan ng Intel at EP3SE260F1152C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1152I4LN EP3SE260F1152C4N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Obsolete
Family Stratix III E Stratix III (Enhanced)
Process Node 65 nm CMOS —
Logic Elements (LE) 255,000 —
Logic Array Blocks (LAB) 10,200 —
Embedded Memory Bits 16,672,640 —
User I/Os 744 —
Packhaging FCBGA-1152 (1517-ball) 1152-ball FC-FBGA (flip-chip)
Package Dimensions 35 x 35 mm —
Core Voltage 0.9 V (supports 1.05-1.15 V variant) 1.1 V
Temperature na Operasyon -40 C to +100 C (Industrial) 0C to +85C (commercial, 'C' suffix)
Operating Frequency Up to 717 MHz —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Supply Voltage Range 0.9 V core, 1.05 V-1.15 V supported —
Series Stratix III Stratix III E
Tindminan RoHS Compliant —
Design Tool Quartus II —
Logic Elements (LEs) — 255,000
Embedded Memory — 16,672,768 bits (16.67 Mbit)
Maximum User I/Os — 744
Number of LABs/CLBs — 10,200
DSP / 18x18 Multipliers — 768 embedded multipliers
Process Technology — 65 nm CMOS
Maximum Operating Frequency — 450 MHz
Speed Grade — -4 (commercial temperature)
Packaging — Tray
Lead-Free / RoHS — Lead-free finish (RoHS compliant per distributor listing)
Uri ng Memory — SRAM-based, volatile (requires configuration device)
Configuration — External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status — Obsolete (per Xecor cross-reference data)

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