EP3SE50F780C4N vs EP3SE110F780C4LN Perbandingan

Perbandingan bersamaan detil EP3SE50F780C4N dari Intel dan EP3SE110F780C4LN dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE50F780C4N EP3SE110F780C4LN
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Aktif
Family Stratix III E Stratix III E
Logic Elements (LE) 47,500 107,500
Embedded Memory Bits 5,760,000 —
Embedded Memory (M9K/M144K blocks) 488 (per family datasheet) —
Number of LABs 1900 —
Maximum User I/Os 488 —
DSP Blocks (18x18 multipliers) 432 —
PLLs 12 (per family datasheet) —
Maximum Operating Frequency 717 MHz —
Transceiver Channels Up to 12 (per family, model-dependent) —
Transceiver Data Rate Up to 6.375 Gbps (per Stratix III E family) —
Process Node 40 nm —
Paket 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch 780-BBGA, FCBGA (Fine-pitch)
Tipe Mounting Surface Mount (BGA) Surface Mount (SMT)
Tegangan Pemuat Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) —
Suhu Kerja 0C to +85C (C4 commercial grade) 0C to +85C (Commercial)
Configuration Modes JTAG, Passive Serial, Fast Passive Parallel —
Status RoHS Lead-free / RoHS compliant —
Level MSL 3 (per JEDEC J-STD-020, FBGA package) 3 (per JEDEC J-STD-020)
Hard Memory Controller DDR2/DDR3 SDRAM (per Stratix III E family) —
Logic Array Blocks (LABs) — 4,300
Embedded Memory — 8,936,448 bits
User I/O Pins — 488
Supply Voltage Core — 0.9 V (typical)
Speed Grade — C4
Lead-Free / RoHS — Yes (N suffix)
Process Technology — 40 nm TSMC
DSP Blocks — Yes (18x18 multipliers)
Tray Packaging — Yes (per distributor listings)

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