EP4CE75F23I7N vs EP4CE75F29I7 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE75F23I7N sa pamamagitan ng Intel at EP4CE75F29I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4CE75F23I7N EP4CE75F29I7
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Product Line Cyclone IV E —
Family Cyclone IV E (EP4CE) —
Logic Elements (LEs) 75,408 75,408
Logic Array Blocks (LABs) 4,713 —
Embedded Memory Bits 2,810,880 bits (312 M9K blocks) —
Distributed RAM Bits 200 Kbits —
Embedded 18x18 Multipliers 15 —
PLLs 4 4
Global Clocks [DATA_NEEDED: global clock network count] —
Maximum User I/Os 292 —
Core Voltage (VCCINT) 1.2 V nominal 1.0 V / 1.2 V selectable
I/O Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) —
Process Technology 60 nm low-power CMOS —
Packhaging 484-ball FBGA (F23, 23 mm body, 1.0 mm pitch) 780-ball FBGA (FineLine BGA)
Operating Temperature Grade Industrial (I7: -40C to +100C Tj) —
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG JTAG, Active Serial (AS), Passive Serial (PS)
External Memory Interfaces DDR / DDR2 SDRAM, QDRII SRAM DDR/DDR2 SDRAM, QDRII SRAM
Design Software Quartus II / Quartus Prime —
Tindminan RoHS Compliant Compliant
Series — Cyclone IV E
Manufacturer — Intel (formerly Altera)
Embedded Memory (bits) — 2,810,880
Embedded Memory Blocks — 274 (M9K)
Embedded 18×18 Multipliers — 200
User I/O Count — 426
Temperature na Operasyon — -40 °C to +100 °C (Industrial)
Process Node — 60 nm low-power CMOS
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Level ng MSL — 3 (168 hours)
Uri ng Pagpapasok — Surface Mount (BGA)

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