EP4CE75F23I7N vs EP4CE75F29I7 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE75F23I7N disebabkan oleh Intel dan EP4CE75F29I7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP4CE75F23I7N EP4CE75F29I7
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Product Line Cyclone IV E —
Family Cyclone IV E (EP4CE) —
Logic Elements (LEs) 75,408 75,408
Logic Array Blocks (LABs) 4,713 —
Embedded Memory Bits 2,810,880 bits (312 M9K blocks) —
Distributed RAM Bits 200 Kbits —
Embedded 18x18 Multipliers 15 —
PLLs 4 4
Global Clocks [DATA_NEEDED: global clock network count] —
Maximum User I/Os 292 —
Core Voltage (VCCINT) 1.2 V nominal 1.0 V / 1.2 V selectable
I/O Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) —
Process Technology 60 nm low-power CMOS —
Kemasan 484-ball FBGA (F23, 23 mm body, 1.0 mm pitch) 780-ball FBGA (FineLine BGA)
Operating Temperature Grade Industrial (I7: -40C to +100C Tj) —
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG JTAG, Active Serial (AS), Passive Serial (PS)
External Memory Interfaces DDR / DDR2 SDRAM, QDRII SRAM DDR/DDR2 SDRAM, QDRII SRAM
Design Software Quartus II / Quartus Prime —
Status RoHS Compliant Compliant
Series — Cyclone IV E
Manufacturer — Intel (formerly Altera)
Embedded Memory (bits) — 2,810,880
Embedded Memory Blocks — 274 (M9K)
Embedded 18×18 Multipliers — 200
User I/O Count — 426
Suhu Operasi — -40 °C to +100 °C (Industrial)
Process Node — 60 nm low-power CMOS
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Aras MSL — 3 (168 hours)
Jenis Pemasangan — Surface Mount (BGA)

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