EPF10K130EFC484-3N vs EPF10K130EFC484-3 比較

詳細並排比較 EPF10K130EFC484-3N 由 Intel 與 EPF10K130EFC484-3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EPF10K130EFC484-3N EPF10K130EFC484-3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Series FLEX-10KE —
Number of Logic Elements / Cells 6656 —
Total RAM Bits 65536 —
Typical Gate Count 130000 130,000 system gates
Number of I/O 369 —
Number of LABs/CLBs 832 —
Number of Embedded Array Blocks (EABs) 72 —
Speed Grade -3 (faster timing bin) -3
Operating Temperature Grade Commercial (0C to +70C) —
Core Voltage 2.5 V —
Process Technology 0.22 µm CMOS —
Package Type 484-BBGA (FineLine BGA) —
Package Dimensions 23 x 23 mm —
Ball Pitch 1.0 mm —
安裝類型 Surface Mount Surface Mount (BGA)
Configuration Memory SRAM-based (volatile, requires config device) —
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Configuration Interface JTAG / PS / PPS / Altera serial —
Family — FLEX 10KE
Logic Elements (LEs) — 6,656
Logic Array Blocks (LABs) — 832
Embedded Memory (EABs) — 16 x 4,096 bits (65,536 bits total)
Maximum User I/O — 369
Supply Voltage (Core) — 3.3 V
I/O Voltage Support — 5.0 V / 3.3 V / 2.5 V (multi-volt I/O)
Propagation Delay — 0.6 ns (per LE)
工作溫度 — 0 C to +70 C (commercial)
封裝 — 484-pin FBGA (FineLine BGA)
Configuration Method — SRAM-based, serial or parallel, requires external configuration device
Logic Family — CMOS (SRAM-based)

資料表與資源

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