EPF10K130EFC484-3N vs EPF10K130EFC484-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K130EFC484-3N sa pamamagitan ng Intel at EPF10K130EFC484-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K130EFC484-3N EPF10K130EFC484-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND NRND
Series FLEX-10KE —
Number of Logic Elements / Cells 6656 —
Total RAM Bits 65536 —
Typical Gate Count 130000 130,000 system gates
Number of I/O 369 —
Number of LABs/CLBs 832 —
Number of Embedded Array Blocks (EABs) 72 —
Speed Grade -3 (faster timing bin) -3
Operating Temperature Grade Commercial (0C to +70C) —
Core Voltage 2.5 V —
Process Technology 0.22 µm CMOS —
Package Type 484-BBGA (FineLine BGA) —
Package Dimensions 23 x 23 mm —
Ball Pitch 1.0 mm —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Configuration Memory SRAM-based (volatile, requires config device) —
Tindminan RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Configuration Interface JTAG / PS / PPS / Altera serial —
Family — FLEX 10KE
Logic Elements (LEs) — 6,656
Logic Array Blocks (LABs) — 832
Embedded Memory (EABs) — 16 x 4,096 bits (65,536 bits total)
Maximum User I/O — 369
Supply Voltage (Core) — 3.3 V
I/O Voltage Support — 5.0 V / 3.3 V / 2.5 V (multi-volt I/O)
Propagation Delay — 0.6 ns (per LE)
Temperature na Operasyon — 0 C to +70 C (commercial)
Packhaging — 484-pin FBGA (FineLine BGA)
Configuration Method — SRAM-based, serial or parallel, requires external configuration device
Logic Family — CMOS (SRAM-based)

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