EPF10K200SBC600-1 vs EPF10K200EBC600-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SBC600-1 sa pamamagitan ng Intel at EPF10K200EBC600-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200SBC600-1 - 200K Gate FLEX-10KS FPGA, 470 I/O | Intel / Altera
EPF10K200SBC600-1 ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K200SBC600-1 | EPF10K200EBC600-2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | FLEX-10KS | — |
| Series | EPF10K200 | FLEX-10KE |
| Logic Elements / Cells | 9,984 | — |
| Gate Count (typical) | 200,000 gates | — |
| Logic Array Blocks (LABs) | 1,248 | 1248 |
| Number of User I/Os | 470 | — |
| Number of Logic Cells | 4,992 | — |
| Embedded RAM (bits) | 24,576 (across EABs) | — |
| Max Internal Frequency | 250 MHz | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Process Technology | 0.22 µm CMOS | 0.30 µm CMOS |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V (typ. 2.5 V) | — |
| Speed Grade | -1 (fastest commercial) | — |
| Temperature na Operasyon | 0 °C to 70 °C (Commercial) | 0°C to +70°C (Commercial) |
| Packhaging | 600-ball BGA, 45 × 45 mm, 1.27 mm pitch | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| JTAG Support | IEEE Std 1149.1 | — |
| Configuration | Serial via EPC2/EPC8 configuration devices | — |
| Tindminan RoHS | Non-compliant (per third-party listing) | unknown |
| Logic Family | — | CMOS (SRAM-based) |
| Typical Gate Count | — | 200,000 gates |
| Logic Elements (LEs) | — | 9984 |
| Embedded Memory (EAB) | — | 98304 bits (96 Kbits) |
| Maximum User I/O | — | 470 pins |
| Volte ng Pagbibigay | — | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) |
| I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |
| Package Type | — | 600-ball BGA (BGA-600) |
| Package Dimensions | — | 45 × 45 mm |
| Ball Pitch | — | 1.27 mm |
| Package Height | — | 1.1 mm max |
| Configuration Method | — | JTAG (IEEE 1149.1), EPC2 serial PROM |
| Part Status | — | Obsolete |