EPM2210GF324C5 vs EPM2210GF324C5N Comparison
Detailed side-by-side comparison of EPM2210GF324C5 by Intel and EPM2210GF324C5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPM2210GF324C5 - MAX II 2210 LE CPLD, 324-BGA, 5ns | Intel/Altera
EPM2210GF324C5 ⚠ Last Time Buy
Specification Comparison
| Parameter | EPM2210GF324C5 | EPM2210GF324C5N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Active |
| Family | MAX II | MAX II G |
| Device Name | EPM2210 | — |
| Logic Elements (LE) | 2,210 | — |
| Equivalent Macrocells | 1,700 | 1700 |
| Maximum User I/Os | 272 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Pin-to-Pin Delay (tPD1) | 5 ns (C5 speed grade) | — |
| Internal Performance | 304 MHz | — |
| Core Voltage (VCCINT) | 1.8 V | — |
| I/O Voltage (VCCIO) - MultiVolt | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 6-layer-metal flash, 0.18 um | — |
| Operating Junction Temperature | 0C to +85C (commercial) | — |
| Package | 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch |
| In-System Programmability | JTAG (IEEE 1149.1) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant (lead-free) | Compliant |
| Series | — | MAX II |
| Logic Elements | — | 2210 |
| Maximum User I/O | — | 212 |
| Pin-to-Pin Delay (tPD) | — | 11.2 ns |
| Propagation Delay | — | 11.2 ns (max) |
| Technology | — | Flash CMOS, 6-layer metal |
| Core Voltage | — | 3.3 V / 2.5 V (internal) |
| I/O Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Operating Temperature | — | 0 °C to +85 °C (commercial) |
| Programmability | — | In-system (JTAG / IEEE 1532), non-volatile |
| Lead Free | — | Yes |
| MSL Level | — | 3 |