EPM2210GF324C5 vs EPM2210GF324C5N Perbandingan
Perbandingan bersamaan detil EPM2210GF324C5 dari Intel dan EPM2210GF324C5N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EPM2210GF324C5 - MAX II 2210 LE CPLD, 324-BGA, 5ns | Intel/Altera
EPM2210GF324C5 ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | EPM2210GF324C5 | EPM2210GF324C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Aktif |
| Family | MAX II | MAX II G |
| Device Name | EPM2210 | — |
| Logic Elements (LE) | 2,210 | — |
| Equivalent Macrocells | 1,700 | 1700 |
| Maximum User I/Os | 272 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Pin-to-Pin Delay (tPD1) | 5 ns (C5 speed grade) | — |
| Internal Performance | 304 MHz | — |
| Core Voltage (VCCINT) | 1.8 V | — |
| I/O Voltage (VCCIO) - MultiVolt | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 6-layer-metal flash, 0.18 um | — |
| Suhu Hubung Kerja | 0C to +85C (commercial) | — |
| Paket | 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch |
| In-System Programmability | JTAG (IEEE 1149.1) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant (lead-free) | Compliant |
| Series | — | MAX II |
| Logic Elements | — | 2210 |
| Maximum User I/O | — | 212 |
| Pin-to-Pin Delay (tPD) | — | 11.2 ns |
| Propagation Delay | — | 11.2 ns (max) |
| Technology | — | Flash CMOS, 6-layer metal |
| Core Voltage | — | 3.3 V / 2.5 V (internal) |
| I/O Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Suhu Kerja | — | 0 °C to +85 °C (commercial) |
| Programmability | — | In-system (JTAG / IEEE 1532), non-volatile |
| Lead Free | — | Yes |
| Level MSL | — | 3 |