H5AN8G6NAFR-RDC vs H5AN8G6NAFR-UHC Comparison
Detailed side-by-side comparison of H5AN8G6NAFR-RDC by SK hynix and H5AN8G6NAFR-UHC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | H5AN8G6NAFR-RDC | H5AN8G6NAFR-UHC |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3.05 | $5.74 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Memory Density | 8 Gb | — |
| Organization | 512M x 16 | 512M x 16 |
| Supply Voltage | 1.2 V | 1.2 V |
| Interface | DDR4 (JEDEC-standard) | — |
| Access Mode | Multi Bank Page Burst | — |
| Package Code | TFBGA | TFBGA |
| Package Shape | Rectangular | — |
| Number of Terminals | 96 | 96 |
| Mounting Type | Surface Mount | — |
| Temperature Grade | OTHER (per Partstack listing) | — |
| Technology | CMOS | — |
| RoHS Status | Compliant (Lead-Free & Halogen-Free) | — |
| Speed Grade | -RDC (see datasheet for bin timing) | — |
| Family | H5AN8G4NAFR-xxC / H5AN8G8NAFR-xxC / H5AN8G6NAFR-xxC | — |
| Max Clock Rate | [DATA_NEEDED: max clock rate for -RDC bin] | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | 0°C to +85°C |
| Density | — | 8 Gb |
| Data Rate | — | 2400 MT/s |
| Package | — | FBGA-96 |
| Lead-Free | — | Yes |
| Halogen Free | — | Yes |
| RoHS Compliant | — | Yes |
| CAS Latency | — | [DATA_NEEDED: CAS Latency] |
| Burst Length | — | 8, 4 (with burst chop) |
| Refresh | — | Auto self-refresh |