H5AN8G6NAFR-UHC vs K4A8G085WC Comparison

Detailed side-by-side comparison of H5AN8G6NAFR-UHC by SK hynix and K4A8G085WC by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5AN8G6NAFR-UHC H5AN8G6NAFR-UHC - 8Gb DDR4 SDRAM 512Mx16 | SK hynix

H5AN8G6NAFR-UHC - 8Gb DDR4 SDRAM 512Mx16 | SK hynix

H5AN8G6NAFR-UHC ✓ Active
Samsung Electronics
K4A8G085WC K4A8G085WC - 8Gb DDR4 SDRAM 1Gx8 2666Mbps | Samsung Electronics

K4A8G085WC - 8Gb DDR4 SDRAM 1Gx8 2666Mbps | Samsung Electronics

K4A8G085WC ✓ Active

Specification Comparison

Parameter H5AN8G6NAFR-UHC K4A8G085WC
Brand SK hynix Samsung Electronics
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $5.74 $24.90
Memory Type DDR4 SDRAM DDR4 SDRAM
Density 8 Gb 8 Gbit
Organization 512M x 16 1G x 8
Supply Voltage 1.2 V 1.2 V
Data Rate 2400 MT/s —
Package FBGA-96 78-ball FBGA (78FBGA)
Operating Temperature 0°C to +85°C —
Number of Terminals 96 —
Package Code TFBGA —
Lead-Free Yes —
Halogen Free Yes —
RoHS Compliant Yes —
CAS Latency [DATA_NEEDED: CAS Latency] —
Burst Length 8, 4 (with burst chop) —
Refresh Auto self-refresh —
Speed — 2666 Mbps/pin (DDR4-2666)
Supply Voltage Range — 1.14 V to 1.26 V
Clock Frequency — 1333 MHz (1333.333 GHz nominal, per web data)
Operating Temperature (K4A8G085WC-BITD) — -40 C to +95 C
Operating Temperature (K4A8G085WC-BCTD) — 0 C to +95 C
Mounting Type — Surface Mount
Auto Precharge — Yes
Asynchronous Reset — Yes
CRC Function — Yes
ZQ Calibration — Yes
Dynamic On-Chip Termination (ODT) — Yes
Data Mask (DM) — Yes
RoHS Status — [DATA_NEEDED: RoHS status]

Datasheets & Resources

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