H5AN8G6NAFR-UHC vs K4A8G085WC 对比

详细并排对比 H5AN8G6NAFR-UHC 出自 SK hynix 和 K4A8G085WC 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

SK hynix
H5AN8G6NAFR-UHC H5AN8G6NAFR-UHC - 8Gb DDR4 SDRAM 512Mx16 | SK hynix

H5AN8G6NAFR-UHC - 8Gb DDR4 SDRAM 512Mx16 | SK hynix

H5AN8G6NAFR-UHC ✓ 量产中
Samsung Electronics
K4A8G085WC K4A8G085WC - 8Gb DDR4 SDRAM 1Gx8 2666Mbps | Samsung Electronics

K4A8G085WC - 8Gb DDR4 SDRAM 1Gx8 2666Mbps | Samsung Electronics

K4A8G085WC ✓ 量产中

规格对比

参数 H5AN8G6NAFR-UHC K4A8G085WC
品牌 SK hynix Samsung Electronics
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $5.74 $24.90
存储器类型 DDR4 SDRAM DDR4 SDRAM
Density 8 Gb 8 Gbit
存储组织 512M x 16 1G x 8
电源电压 1.2 V 1.2 V
数据速率 2400 MT/s —
封装 FBGA-96 78-ball FBGA (78FBGA)
工作温度 0°C to +85°C —
Number of Terminals 96 —
Package Code TFBGA —
Lead-Free Yes —
无卤 Yes —
RoHS Compliant Yes —
CAS 延迟 [DATA_NEEDED: CAS Latency] —
Burst Length 8, 4 (with burst chop) —
Refresh Auto self-refresh —
Speed — 2666 Mbps/pin (DDR4-2666)
Supply Voltage Range — 1.14 V to 1.26 V
Clock Frequency — 1333 MHz (1333.333 GHz nominal, per web data)
Operating Temperature (K4A8G085WC-BITD) — -40 C to +95 C
Operating Temperature (K4A8G085WC-BCTD) — 0 C to +95 C
安装类型 — Surface Mount
Auto Precharge — Yes
Asynchronous Reset — Yes
CRC Function — Yes
ZQ Calibration — Yes
Dynamic On-Chip Termination (ODT) — Yes
Data Mask (DM) — Yes
RoHS 状态 — [DATA_NEEDED: RoHS status]

数据手册与资源

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