H5TC4G63MFR-PBA vs NT5CC256M16DP-DI Comparison

Detailed side-by-side comparison of H5TC4G63MFR-PBA by SK hynix and NT5CC256M16DP-DI by Nanya Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5TC4G63MFR-PBA H5TC4G63MFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63MFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63MFR-PBA ✓ Active
Nanya Technology
NT5CC256M16DP-DI NT5CC256M16DP-DI - 4Gb DDR3L SDRAM 256Mx16 | Nanya

NT5CC256M16DP-DI - 4Gb DDR3L SDRAM 256Mx16 | Nanya

NT5CC256M16DP-DI ✓ Active

Specification Comparison

Parameter H5TC4G63MFR-PBA NT5CC256M16DP-DI
Brand SK hynix Nanya Technology
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Memory Type DDR3L SDRAM DDR3L SDRAM
Density 4 Gb 4Gb
Organization 256M x 16 256M x 16
Supply Voltage (VDD/VDDQ) 1.35V (+0.100V/-0.067V) —
Data Rate 1866 Mbps (PC3L-14900) 1600 Mbps/pin (800MHz)
Package 96-ball FBGA VFBGA-96
Number of Banks 8 8
Burst Length BL8, BL4 (with burst chop) 8, 4 (with burst chop)
CAS Latency (CL) Programmable —
CAS Write Latency (CWL) Programmable —
Additive Latency Programmable —
On-Die Termination (ODT) Yes —
ZQ Calibration Yes —
Write Leveling Yes —
Auto Self-Refresh Yes —
Temperature-Compensated Self-Refresh Yes —
Process Technology 30nm-class —
RoHS Compliant Yes (Lead-Free & Halogen-Free) —
Supply Voltage — 1.35V
Operating Temperature Range — -40°C to +95°C (industrial)
CAS Latency — 11, 12, 13 (programmable)
Interface — Differential clock (CK, CK#)
Refresh — Auto-refresh and self-refresh
On-Die Termination — Yes (ODT)
RoHS — Compliant
Lead-Free — Yes

Datasheets & Resources

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