K4A8G165WC-BCRC vs K4A8G165WC-BCPB Comparison
Detailed side-by-side comparison of K4A8G165WC-BCRC by Samsung Electronics and K4A8G165WC-BCPB by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4A8G165WC-BCPB - 8Gb DDR4-2133 SDRAM 96-FBGA | Samsung
K4A8G165WC-BCPB ✓ ActiveSpecification Comparison
| Parameter | K4A8G165WC-BCRC | K4A8G165WC-BCPB |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $23.00 | $1.31 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM (volatile DRAM) |
| Density | 8 Gb | — |
| Organization | 512M x 16 | — |
| Data Rate | 2400 Mbps | DDR4-2133 (2133 Mbps/pin) |
| Supply Voltage (VDD) | 1.2 V (1.14V to 1.26V) | — |
| VPP Voltage | 2.5 V | — |
| Operating Temperature | 0°C to +95°C (case) | 0C to +95C |
| Package | 96-ball FBGA (9mm x 13mm) | 96-ball FBGA (TFBGA) |
| Interface | 16-bit I/O | DDR4 (16-bit data bus) |
| Banks | 16 (4 bank groups) | — |
| Burst Length | 8 (BL8) | — |
| CAS Latency | Programmable (e.g., 16, 17, 18) | — |
| Refresh | Temperature-compensated self-refresh (TCSR) | — |
| RoHS | Compliant | — |
| Mounting Type | Surface Mount | Surface Mount |
| Memory Size | — | 8 Gb |
| Memory Organization | — | 512M x 16 |
| Supply Voltage | — | 1.2 V |
| Operating Voltage Range | — | 1.14 V to 1.26 V |
| Die Generation | — | C-die (1Y nm class) |
| Features | — | Auto precharge, asynchronous reset, CRC, ZQ calibration, dynamic ODT, data mask |
| Termination | — | On-die termination (ODT), dynamic |
| MSL Level | — | [DATA_NEEDED: MSL Level] |
| RoHS Status | — | Compliant |
| Standard | — | JEDEC DDR4 SDRAM |