K4A8G165WC-BCPB - 8Gb DDR4-2133 SDRAM 96-FBGA | Samsung
MPN: K4A8G165WC-BCPB ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.74 | $1.74 |
| 10 | $1.66 | $16.60 |
| 100 | $1.55 | $155.00 |
| 500 | $1.42 | $710.00 |
| 1,000 | $1.31 | $1,310.00 |
Drop-in alternatives for K4A8G165WC-BCPB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K4A8G165WB-BCPB
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View Datasheet →K4A8G165WC-BCTD
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View Datasheet →K4A8G165WC-BCWE
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View Datasheet →K4A8G165WB-BCTD
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View Datasheet →K4A8G165WB-BCRC
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View Datasheet →K4A8G165WB-BCWE
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View Datasheet →K4A8G165WC-BCPB Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM (volatile DRAM) |
| Memory Size | 8 Gb |
| Memory Organization | 512M x 16 |
| Data Rate | DDR4-2133 (2133 Mbps/pin) |
| Supply Voltage | 1.2 V |
| Operating Voltage Range | 1.14 V to 1.26 V |
| Interface | DDR4 (16-bit data bus) |
| Package | 96-ball FBGA (TFBGA) |
| Die Generation | C-die (1Y nm class) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +95C |
| Features | Auto precharge, asynchronous reset, CRC, ZQ calibration, dynamic ODT, data mask |
| Termination | On-die termination (ODT), dynamic |
| RoHS Status | Compliant |
| Standard | JEDEC DDR4 SDRAM |
K4A8G165WC-BCPB 96-ball fbga (tfbga) Pin Configuration Guide
Complete pinout information for K4A8G165WC-BCPB (96-ball fbga (tfbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K4A8G165WC-BCPB.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K4A8G165WC-BCPB is suitable for 6 applications: Embedded Industrial Controllers, Networking Equipment Line Cards, FPGA-Based Processing Systems, Set-Top Boxes and Smart Home Gateways, Test and Measurement Instrumentation, Automotive-Adjacent Embedded Gateways (Industrial Grade).
Embedded Industrial Controllers
Industrial PLCs and edge controllers need soldered, high-density main memory with long-term availability. The K4A8G165WC-BCPB provides 8 Gb in a single 512M x16 chip at 1.2 V, cutting memory power versus DDR3 by roughly 25%, and its 96-ball FBGA package survives vibration better than SODIMM modules. Placed on a fly-by or matched-length DDR4 bus with dynamic ODT and ZQ calibration enabled, it sustains DDR4-2133 throughput for real-time control data logging. The 0C to +95C operating range covers typical industrial enclosure conditions, and the x16 bus halves component count versus x8, reducing BOM risk.
Recommended
Networking Equipment Line Cards
Switch and router line cards use soldered DDR4 for packet buffers, routing tables, and control-plane memory. The K4A8G165WC-BCPB's 2133 Mbps/pin data rate delivers the bandwidth needed for queue management, while CRC support improves data integrity on high-availability links and the asynchronous reset function simplifies system-level fault recovery. Its 96-ball FBGA footprint allows multiple chips to be stacked on a matched-length bus for larger buffers. Dynamic ODT termination reduces signal-integrity tuning effort on multi-drop topologies common in networking backplane-adjacent designs.
Recommended
FPGA-Based Processing Systems
FPGA image-processing and data-acquisition systems require large on-board frame buffers. The K4A8G165WC-BCPB's x16 organization lets a single chip provide a 16-bit DDR4 interface, simplifying FPGA bank placement versus two x8 devices. At DDR4-2133, one chip delivers roughly 4.2 GB/s of peak bandwidth, sufficient for multi-stream video line buffering. Enable the memory controller's ZQ calibration and train at board bring-up; use the data mask function for partial frame writes to avoid read-modify-write overhead on video payloads.
Recommended
Set-Top Boxes and Smart Home Gateways
IPTV set-top boxes and home gateways run rich UI stacks and video pipelines that need gigabyte-class soldered memory. The K4A8G165WC-BCPB's 8 Gb density in one FBGA saves board area versus multiple lower-density chips, and its 1.2 V rail aligns with energy-efficiency targets for always-on consumer equipment. DDR4-2133 bandwidth supports simultaneous 4K decode buffering and network traffic. The device's auto precharge function improves page-hit efficiency for streaming access patterns, and RoHS compliance keeps consumer certification straightforward.
Recommended
Test and Measurement Instrumentation
Oscilloscope, logic analyzer, and data-recorder front ends capture long acquisition records that overflow on-chip SRAM, so soldered DDR4 is used for deep capture memory. The K4A8G165WC-BCPB offers 8 Gb per chip at DDR4-2133, enabling multi-gigasample streaming architectures with sequential burst writes. ZQ calibration keeps output impedance accurate over temperature, protecting eye margins on long PCB traces typical of instrument backplanes. The asynchronous reset input allows the host to recover the memory subsystem without a full power cycle between captures.
Recommended
Automotive-Adjacent Embedded Gateways (Industrial Grade)
Telematics gateways, fleet recorders, and off-highway equipment controllers use industrial-grade soldered DDR4 rather than AEC-Q100 memory. The K4A8G165WC-BCPB suits these designs where 0C to +95C operation is acceptable, providing 8 Gb for map, log, and communication buffering at DDR4-2133. The 96-ball FBGA's soldered attachment resists shock and vibration better than connectors, and the low 1.2 V rail reduces total power draw in battery-backed or energy-harvesting nodes. Verify the wider automotive temperature requirement before using it inside the passenger compartment ECU domain.
Recommended
Recommended Products Summary
Engineering reference data for K4A8G165WC-BCPB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4A8G165WB-BCPB | K4A8G165WC-BCTD | K4A8G165WC-BCRC | K4A8G165WB-BCWE |
|---|---|---|---|---|---|
| Package | 96-ball FBGA (TFBGA) | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Memory Size | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Supply Voltage | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) |
| Die Generation | C-die | B-die | C-die | C-die | B-die |
| Speed Grade (suffix) | PB (DDR4-2133 class) | PB (DDR4-2133 class) | TD (higher grade) | RC (lower grade) | WE (higher grade) |
| Unit Price (qty 1, as of 2026-09-04) | $1.74 | [DATA_NEEDED] | $51.42 (LCSC, limited stock) | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Newer C-die silicon generation (vs K4A8G165WB-BCPB)
- Lowest quoted price among verified family members (vs K4A8G165WC-BCTD)
- x16 organization halves component count (vs K4A8G085WC-BCPB)
Design Notes
Route DDR4 address/command/control as a fly-by topology with length-matched traces and tune write leveling and read training in the controller. The K4A8G165WC-BCPB's dynamic ODT and ZQ calibration help maintain eye margins at DDR4-2133, but you must still control trace impedance (40-50 ohm single-ended) and keep data-group skew within controller specifications. Run full DRAM training at board bring-up for every PCB stackup revision, since impedance changes shift the trained delays.
The device operates at 1.2 V nominal (1.14 V to 1.26 V) with separate VDD, VDDQ, and VPP rails per JEDEC DDR4 practice. Estimated: at DDR4-2133 with moderate utilization, a single 8 Gb x16 chip draws on the order of a few hundred milliwatts; use a dedicated buck regulator such as the TPS54218 for VDD/VDDQ and a proper VTT termination supply with bulk capacitance at the package. Keep rail ripple below the JEDEC DDR4 tolerance band to avoid refresh errors.
The most common substitution error is mixing organizations: the K4A8G085WC series (x8) uses a 78-ball FBGA that is physically incompatible with the 96-ball footprint of this x16 part. Also verify the speed-grade suffix (PB/RC/TD/WE) against your controller's validated timing table before BOM swaps, and do not assume B-die (WB family) timing settings carry over unchanged to C-die (WC family) silicon even when the footprint is identical.
Place the 96-ball FBGA within 50 mm of the controller where possible, keep the DRAM on a solid reference plane, and reserve space for series termination resistors on address/command nets. For multi-chip topologies, use fly-by routing of address/command with daisy-chained ODT, and length-match data groups per byte lane. Provide thermal relief via the PCB since FBGA packages dissipate heat through the ball field.
Compliance Information
RoHS compliance and lead-free FBGA package per distributor listings (LCSC, JLCPCB). REACH, halogen-free, and conflict-minerals declarations should be confirmed via Samsung's official environmental documentation.
