K4B4G1646E-BCMA vs K4B4G1646E-BYK0 Comparison
Detailed side-by-side comparison of K4B4G1646E-BCMA by Samsung Electronics and K4B4G1646E-BYK0 by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4B4G1646E-BCMA - 4Gb DDR3 SDRAM 1066MHz FBGA-96 | Samsung
K4B4G1646E-BCMA ✓ Active
Specification Comparison
| Parameter | K4B4G1646E-BCMA | K4B4G1646E-BYK0 |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | — |
| Unit Price (USD) | $3.77 | — |
| Memory Type | DDR3 SDRAM | DDR3L SDRAM |
| Density | 4 Gbit | 4 Gb |
| Organization | 256M x 16 | 256M x 16 |
| Clock / Data Rate | 1066 MHz / 1066 Mbps per data pin | — |
| Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.35 V (1.283 V to 1.45 V) |
| Operating Temperature | 0C to +95C | 0°C to +95°C (TC) |
| Package | FBGA-96 (7.5 x 13.3 mm) | 96-ball FBGA (13 x 9 mm, 0.8 mm pitch) |
| Operating Supply Current (IDD) | 55 mA | — |
| Standby Current | 2 mA | — |
| Auto Precharge | Yes | Yes |
| Asynchronous Reset | Yes | Yes |
| On-Die Termination (ODT) | Dynamic ODT supported | — |
| ZQ Calibration | Yes | Yes |
| Data Mask Function | Yes | — |
| Mounting Type | Surface Mount (BGA) | — |
| RoHS Status | Compliant | — |
| Data Rate | — | DDR3-1600 (800 MHz) |
| CAS Latency | — | 11 (CL-tRCD-tRP) |
| Burst Length | — | 8 (fixed), 4 (burst chop) |
| On-Die Termination | — | Yes (dynamic ODT) |
| Self-Refresh | — | Yes |
| Data Mask | — | Yes |
| RoHS | — | Compliant |