K4B4G1646E-BCMA vs K4B4G1646E-BYK0 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4B4G1646E-BCMA disebabkan oleh Samsung Electronics dan K4B4G1646E-BYK0 disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Samsung Electronics
K4B4G1646E-BCMA - 4Gb DDR3 SDRAM 1066MHz FBGA-96 | Samsung
K4B4G1646E-BCMA ✓ Aktif
Pengandingan Spesifikasi
| Parametr | K4B4G1646E-BCMA | K4B4G1646E-BYK0 |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Status Stok | In Stock | — |
| Harga Unit (USD) | $3.77 | — |
| Jenis Ingatan | DDR3 SDRAM | DDR3L SDRAM |
| Density | 4 Gbit | 4 Gb |
| Organisasi | 256M x 16 | 256M x 16 |
| Clock / Data Rate | 1066 MHz / 1066 Mbps per data pin | — |
| Tegangan Pemberi Arus | 1.425 V to 1.575 V (1.5 V nominal) | 1.35 V (1.283 V to 1.45 V) |
| Suhu Operasi | 0C to +95C | 0°C to +95°C (TC) |
| Kemasan | FBGA-96 (7.5 x 13.3 mm) | 96-ball FBGA (13 x 9 mm, 0.8 mm pitch) |
| Operating Supply Current (IDD) | 55 mA | — |
| Standby Current | 2 mA | — |
| Auto Precharge | Yes | Yes |
| Asynchronous Reset | Yes | Yes |
| On-Die Termination (ODT) | Dynamic ODT supported | — |
| ZQ Calibration | Yes | Yes |
| Data Mask Function | Yes | — |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Status RoHS | Compliant | — |
| Kadar Data | — | DDR3-1600 (800 MHz) |
| Latensi CAS | — | 11 (CL-tRCD-tRP) |
| Burst Length | — | 8 (fixed), 4 (burst chop) |
| On-Die Termination | — | Yes (dynamic ODT) |
| Self-Refresh | — | Yes |
| Data Mask | — | Yes |
| RoHS | — | Compliant |