MC9S12XDT512MAA vs MC9S12XDT256MAA Comparison

Detailed side-by-side comparison of MC9S12XDT512MAA by NXP Semiconductors and MC9S12XDT256MAA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12XDT512MAA MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA Nrnd
NXP Semiconductors
MC9S12XDT256MAA MC9S12XDT256MAA - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XDT256MAA - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XDT256MAA Nrnd

Specification Comparison

Parameter MC9S12XDT512MAA MC9S12XDT256MAA
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $0.00
Core Processor HCS12X HCS12X
Core Size 16-Bit 16-Bit
Maximum Clock Speed 80 MHz 80 MHz
Program Memory Size 512KB (512K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
RAM Size 20KB 16KB
EEPROM Size 4KB —
Connectivity CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 59 59
ADC Resolution 10-bit, 8-channel —
Supply Voltage [DATA_NEEDED: supply voltage range] 2.5V/5V
Operating Temperature -40C to +125C (TA) —
Package 80-QFP (14x14 mm), Square, Gull Wing 80-QFP (14x14 mm)
Mounting Type Surface Mount Surface Mount
Packaging Method Tray —
Halogen Free Compliant —
ECCN 3A991.a.2 —
Estimated EOL Date 2028 —
Core Architecture — CISC
Terminal Form — Gull Wing
Packaging — Tray
Temperature Grade — Automotive
Part Status — NRND (Not Recommended for New Designs)
RoHS Status — [DATA_NEEDED: RoHS status]
Operating Temperature Range — [DATA_NEEDED: operating temperature range]

Datasheets & Resources

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