MC9S12XDT512MAA vs MC9S12XDT256MAA Comparación
Comparación detallada lado a lado de MC9S12XDT512MAA por NXP Semiconductors y MC9S12XDT256MAA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S12XDT512MAA | MC9S12XDT256MAA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $0,00 |
| Core Processor | HCS12X | HCS12X |
| Core Size | 16-Bit | 16-Bit |
| Maximum Clock Speed | 80 MHz | 80 MHz |
| Program Memory Size | 512KB (512K x 8) | 256KB (256K x 8) |
| Program Memory Type | FLASH | FLASH |
| RAM Size | 20KB | 16KB |
| EEPROM Size | 4KB | — |
| Connectivity | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT |
| Number of I/O | 59 | 59 |
| ADC Resolution | 10-bit, 8-channel | — |
| Tensión de alimentación | [DATA_NEEDED: supply voltage range] | 2.5V/5V |
| Temperatura de funcionamiento | -40C to +125C (TA) | — |
| Encapsulado | 80-QFP (14x14 mm), Square, Gull Wing | 80-QFP (14x14 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging Method | Tray | — |
| Sin halógenos | Compliant | — |
| ECCN | 3A991.a.2 | — |
| Estimated EOL Date | 2028 | — |
| Core Architecture | — | CISC |
| Terminal Form | — | Gull Wing |
| Packaging | — | Tray |
| Temperature Grade | — | Automotive |
| Part Status | — | NRND (Not Recommended for New Designs) |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |