MC9S12XDT512MAA vs MC9S12XDT256MAA 对比

详细并排对比 MC9S12XDT512MAA 出自 NXP Semiconductors 和 MC9S12XDT256MAA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12XDT512MAA MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA Nrnd
NXP Semiconductors
MC9S12XDT256MAA MC9S12XDT256MAA - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XDT256MAA - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XDT256MAA Nrnd

规格对比

参数 MC9S12XDT512MAA MC9S12XDT256MAA
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $0.00 $0.00
Core Processor HCS12X HCS12X
Core Size 16-Bit 16-Bit
Maximum Clock Speed 80 MHz 80 MHz
Program Memory Size 512KB (512K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
RAM Size 20KB 16KB
EEPROM Size 4KB —
Connectivity CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 59 59
ADC Resolution 10-bit, 8-channel —
电源电压 [DATA_NEEDED: supply voltage range] 2.5V/5V
工作温度 -40C to +125C (TA) —
封装 80-QFP (14x14 mm), Square, Gull Wing 80-QFP (14x14 mm)
安装类型 Surface Mount Surface Mount
Packaging Method Tray —
无卤 Compliant —
ECCN 3A991.a.2 —
Estimated EOL Date 2028 —
Core Architecture — CISC
Terminal Form — Gull Wing
Packaging — Tray
Temperature Grade — Automotive
Part Status — NRND (Not Recommended for New Designs)
RoHS 状态 — [DATA_NEEDED: RoHS status]
工作温度范围 — [DATA_NEEDED: operating temperature range]

数据手册与资源

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