MPC755BPX350LE vs SC755BPX350LE Comparison

Detailed side-by-side comparison of MPC755BPX350LE by NXP Semiconductors and SC755BPX350LE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC755BPX350LE MPC755BPX350LE - PowerPC 350MHz MPU, 360-FCPBGA | NXP

MPC755BPX350LE - PowerPC 350MHz MPU, 360-FCPBGA | NXP

MPC755BPX350LE Nrnd

Specification Comparison

Parameter MPC755BPX350LE SC755BPX350LE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $49.90 $65.85
Product Type Microprocessor (MPU) —
Architecture RISC, PowerPC MPC7xx Power Architecture (PowerPC) 32-bit RISC
Core Count 1 —
Data Bus Width 64-Bit —
Clock Speed (Core) 350 MHz —
Supply Voltage (Core) 2 V —
I/O Supply Voltage 3.3 V —
Package 360-FCPBGA (25x25 mm, 1.27 mm pitch) BGA (high-density, surface-mount)
Terminal Form Ball —
Number of Terminals 360 —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
Process Technology 0.22 micrometer CMOS CMOS (process node not publicly disclosed)
Moisture Sensitivity Level (MSL) 3 —
Package Type FCBGA-360, Plastic, 25x25 mm, 2.77 mm height —
RoHS Status [DATA_NEEDED: RoHS compliance] [DATA_NEEDED]
Core Frequency — 350 MHz
Bus Frequency — 360 MHz
Instruction Set — Power Architecture 32-bit
L1 Cache — [DATA_NEEDED: L1 instruction/data split and size]
Bus Interface — 60x/MPX bus
MMU — Yes - hardware memory management
Endianness — Big- and little-endian support
Floating Point Unit — [DATA_NEEDED: FPU presence/configuration]
Multiprocessing — Hardware-assisted SMP support
Mounting Type — Surface Mount
Operating Temperature — [DATA_NEEDED: industrial/extended grade]

Datasheets & Resources

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