MPC755BPX350LE vs SC755BPX350LE 对比
详细并排对比 MPC755BPX350LE 出自 NXP Semiconductors 和 SC755BPX350LE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
SC755BPX350LE - Power Architecture RISC Microprocessor | NXP | 360MHz
SC755BPX350LE Nrnd规格对比
| 参数 | MPC755BPX350LE | SC755BPX350LE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $49.90 | $65.85 |
| Product Type | Microprocessor (MPU) | — |
| Architecture | RISC, PowerPC MPC7xx | Power Architecture (PowerPC) 32-bit RISC |
| Core Count | 1 | — |
| 数据总线宽度 | 64-Bit | — |
| Clock Speed (Core) | 350 MHz | — |
| Supply Voltage (Core) | 2 V | — |
| I/O Supply Voltage | 3.3 V | — |
| 封装 | 360-FCPBGA (25x25 mm, 1.27 mm pitch) | BGA (high-density, surface-mount) |
| Terminal Form | Ball | — |
| Number of Terminals | 360 | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Process Technology | 0.22 micrometer CMOS | CMOS (process node not publicly disclosed) |
| 湿敏等级（MSL） | 3 | — |
| Package Type | FCBGA-360, Plastic, 25x25 mm, 2.77 mm height | — |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED] |
| Core Frequency | — | 350 MHz |
| Bus Frequency | — | 360 MHz |
| Instruction Set | — | Power Architecture 32-bit |
| L1 Cache | — | [DATA_NEEDED: L1 instruction/data split and size] |
| Bus Interface | — | 60x/MPX bus |
| MMU | — | Yes - hardware memory management |
| Endianness | — | Big- and little-endian support |
| Floating Point Unit | — | [DATA_NEEDED: FPU presence/configuration] |
| Multiprocessing | — | Hardware-assisted SMP support |
| 安装类型 | — | Surface Mount |
| 工作温度 | — | [DATA_NEEDED: industrial/extended grade] |